EP3CLS70F484C8 - Cyclone III LS FPGA, 70K LE, 484-FBGA | Intel
MPN: EP3CLS70F484C8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $246 | $24,600.00 |
| 500 | $224 | $112,000.00 |
| 1,000 | $198 | $198,000.00 |
EP3CLS70F484C8 Overview
A Cyclone III LS FPGA is a SRAM-based programmable logic device that combines configurable logic blocks, embedded memory blocks (M9K), embedded multipliers (18x18), and a flexible I/O ring in a single IC. It sits in the broader taxonomy of programmable logic devices (PLD) -> FPGA -> SRAM-based FPGA -> low-power FPGA. Compared with ASICs, FPGAs in this class offer rapid time-to-market, in-field re-programmability, and zero NRE cost, while consuming more power and silicon area per logic function than a custom ASIC.
Key features of the EP3CLS70F484C8 include 70,208 logic elements, 4 embedded PLL clock managers, 4.4 Mbit of total embedded RAM (organized as M9K blocks), 4 transceivers absent (this is a non-transceiver family, lower cost), up to 278 user I/O supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), and on-chip security with AES-256 bitstream encryption and JTAG/CRC tamper detection. The 484-pin FBGA package supports high-density board designs while exposing the device's full I/O and memory bandwidth.
The Cyclone III LS architecture is built on a 1.2 V core with a 65 nm TSMC process, achieving static power consumption below 100 mW for typical designs. The combination of plentiful logic, embedded multipliers for DSP, and security features makes the device suitable for industrial control, automotive driver-assist, secure communications, and video/image processing where low total system cost matters more than maximum throughput.
Typical applications for the EP3CLS70F484C8 include industrial motor control, video surveillance encoders, secure point-of-sale terminals, automotive infotainment, and protocol bridging cards. The device is also used as a low-cost glue-logic aggregator in legacy industrial systems and as a high-volume DSP co-processor in factory automation.
When designing with this FPGA, plan power sequencing for the 1.2 V core supply and the I/O bank supplies (typically 1.8 V, 2.5 V, 3.3 V). Use the Quartus II design suite for synthesis, place-and-route, and bitstream generation. Verify thermal dissipation in high-utilization designs with the PowerPlay early power estimator before PCB layout.
This page consolidates distributor pricing, drop-in Cyclone III LS family alternatives, application guidance, and Quartus design notes not available on a single distributor page, offering engineers a complete decision reference for the EP3CLS70F484C8.
Drop-in alternatives for EP3CLS70F484C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS70F484C8 (same form factor and footprint) — differing in Process Technology, Operating Temperature, Package, RoHS Status, Embedded Memory Bits.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS70F484C8N
✅ Drop-In✓ In Stock
$56.8 / Unit
View Datasheet →EP3CLS70F484I7N
✅ Drop-In✓ In Stock
$67.5 / Unit
View Datasheet →EP3CLS70F484C7N
✅ Drop-In✓ In Stock
$96.3 / Unit
View Datasheet →EP3CLS100F484C8
✅ Drop-In✓ In Stock
$148.45 / Unit
View Datasheet →EP3CLS100F484C8N
✅ Drop-In✓ In Stock
$115.4 / Unit
View Datasheet →EP3CLS150F484C8N
✅ Drop-In✓ In Stock
$115.2 / Unit
View Datasheet →EP3CLS200F484C8
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP3CLS70F484C8 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III LS |
| Logic Elements | 70,208 |
| Logic Array Blocks (LABs) | 278 |
| Total Embedded Memory Bits | 3,068,928 |
| Embedded Memory Blocks | M9K (4 Kbit each) |
| Embedded Multipliers (18x18) | 300 |
| Maximum User I/O Pins | 278 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 65 nm TSMC low-power |
| Core Supply Voltage | 1.2 V |
| Operating Junction Temperature | 0C to +85C (commercial) |
| Package | 484-ball FineLine BGA (FBGA-484) |
| Bitstream Encryption | AES-256 (Cyclone III LS feature) |
| Configuration Mode | Active serial, passive serial, JTAG, fast passive parallel |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP3CLS70F484C8 484-ball fineline bga (fbga-484) Pin Configuration Guide
Pin configuration for EP3CLS70F484C8 (484-ball fineline bga (fbga-484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS70F484C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS70F484C8 is suitable for 6 applications: Industrial Motor Control, Video Surveillance Encoder, Secure Point-of-Sale Terminal, Automotive Infotainment, Protocol Bridging Card, Medical Imaging DSP Co-processor.
Industrial Motor Control
The EP3CLS70F484C8 fits industrial motor control because its 70,208 logic elements and 300 18x18 multipliers provide ample headroom for field-oriented control (FOC) algorithms, PID loops, and encoder interface logic on a single chip. The 4 PLLs generate precise PWM frequencies for 3-phase IGBT/MOSFET inverter stages, while 278 user I/O support multiple encoder inputs (QEP), Hall sensors, and gate-driver outputs. Unlike a microcontroller, the FPGA parallelizes current and position sampling at sub-microsecond latency, improving torque ripple and dynamic response.
Recommended
Video Surveillance Encoder
The EP3CLS70F484C8 is well-suited to multi-channel H.264/MJPEG video encoder designs because its 3.0 Mbit embedded memory (M9K blocks) buffers macroblock rows at 1080p resolution while 300 18x18 multipliers accelerate DCT/IDCT transforms in parallel. The 278 user I/O support BT.656, BT.1120, and MIPI-CSI video input interfaces, plus LCD output panels. Compared with dedicated video encoder ASICs, the FPGA enables rapid codec upgrades and custom analytics overlays without silicon respin.
Recommended
Secure Point-of-Sale Terminal
The Cyclone III LS AES-256 bitstream encryption and JTAG tamper detection make the EP3CLS70F484C8 ideal for PCI-PTS certified point-of-sale terminals where IP protection and tamper resistance are mandatory. The 70,208 logic elements integrate keypad scanner, EMV contact/contactless interface controller, thermal printer driver, and secure display controller on one chip, reducing BOM and attack surface. The 1.2 V core keeps thermal dissipation low for sealed terminal enclosures.
Recommended
Automotive Infotainment
The EP3CLS70F484C8 supports automotive infotainment head units by providing CAN/LIN/FlexRay bus interfaces, LVDS display output to the cluster, and I2S audio routing to the DSP, all in parallel fabric. The 278 user I/O connect to multiple display panels, touch controllers, and rear-seat entertainment buses. Compared with an ASSP, the FPGA allows OEM-specific HMI customization and field updates via partial reconfiguration without altering the hardware design.
Recommended
Protocol Bridging Card
The EP3CLS70F484C8 functions as a universal protocol bridge in legacy industrial systems, translating between PROFINET, EtherCAT, Modbus TCP, and serial fieldbus protocols at wire speed without software round-trip latency. The 70K LE support concurrent stack implementations (PROFINET IRT + EtherCAT slave + Modbus master) on a single device. The 4 PLLs derive precise clocks for each bus, and 278 I/O handle multiple isolated PHY interfaces in parallel.
Recommended
Medical Imaging DSP Co-processor
The EP3CLS70F484C8 acts as a low-cost DSP co-processor in ultrasound and endoscopy imaging systems, accelerating beamforming and image filter pipelines using its 300 18x18 multipliers. The 3.0 Mbit embedded memory holds line buffers for B-mode and color Doppler processing at real-time frame rates. Compared with a discrete DSP, the FPGA offers lower latency parallel pipelines and easier algorithm updates during clinical validation, at lower unit cost than a high-end ASSP.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS70F484C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS70F484C8N | EP3CLS70F484I7N | EP3CLS70F484C7N | EP3CLS100F484C8 | EP3CLS150F484C8N | EP3CLS200F484C8 |
|---|---|---|---|---|---|---|---|
| Package | FBGA-484 | FBGA-484 (same) | FBGA-484 (same) | FBGA-484 (same) | FBGA-484 (same) | FBGA-484 (same) | FBGA-484 (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 70,208 | 70,208 | 70,208 | 70,208 | 100,448 | 150,848 | 198,464 |
| Embedded Memory Bits | 3,068,928 | 3,068,928 | 3,068,928 | 3,068,928 | 3,732,480 | 5,121,024 | 6,635,520 |
| Embedded Multipliers (18x18) | 300 | 300 | 300 | 300 | 444 | 600 | 768 |
| Maximum User I/O | 278 | 278 | 278 | 278 | 278 | 278 | 230 |
| Speed Grade | -8 (commercial) | -8 | -7 (industrial) | -7 | -8 | -8 | -8 |
| Bitstream Encryption (AES-256) | Yes (LS family) | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- AES-256 bitstream encryption + JTAG tamper detection (vs EP3C55F484C8 (standard Cyclone III, no LS))
- 43% more logic capacity at the same package footprint (vs EP3CLS70F484C8N)
- Industrial temperature range for harsh environments (vs EP3CLS70F484C8 (commercial 0C to +85C))
Design Notes
The Cyclone III LS core requires a 1.2 V regulated supply within +/-4% tolerance (1.15 V to 1.25 V) per the device handbook. Estimated: at typical 70% logic utilization and 100 MHz operation, static plus dynamic power is roughly 0.8-1.2 W - design the regulator for 2 W peak to handle burst workloads. Power-on sequence must bring VCCINT up before VCCAUX and VCCIO to avoid I/O latch-up; the Cyclone III handbook recommends a 100 ms delay between rails for hot-swap tolerant designs.
FBGA-484 packages require 1.0 mm ball pitch routing on the PCB, with 0.5 mm via-in-pad recommended for fanout. Use a minimum 4-layer PCB stackup with continuous ground planes beneath the device to provide return paths for high-speed LVDS signals. The 484-ball land pattern needs NSMD (non-solder mask defined) pads of 0.5 mm diameter per the Altera package mechanical drawing. Decoupling: place 0.1 uF X7R capacitors on every 4-5 power pins within 3 mm trace length, plus bulk 47 uF tantalum per voltage rail.
Do not configure the device in JTAG mode with the MSEL pins floating - always tie MSEL[3:0] to VCCIO or GND through 1 kohm resistors per the Cyclone III LS handbook configuration chapter. When using AES-256 bitstream encryption, store the key in a tamper-protected EEPROM and never expose it via JTAG readback. The configuration flash must be sized for at least 2x the compressed bitstream to allow for future design updates without re-spinning the boot memory.
Compliance Information
RoHS and lead-free status per Intel product page. Halogen-free status not explicitly stated in verified web data. Cyclone III LS family is not AEC-Q100 qualified - for automotive applications requiring AEC-Q100, consider Cyclone IV automotive variants.
