EP3CLS70F484C8N vs EP3CLS70F484C7N Comparison

Detailed side-by-side comparison of EP3CLS70F484C8N by Intel and EP3CLS70F484C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS70F484C8N EP3CLS70F484C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $56.80 $96.30
Family Cyclone III LS โ€”
Device Logic Elements (LEs) 70,208 โ€”
Logic Array Blocks (LABs) 4,388 4,388
Embedded Memory Bits 3,068,928 bits (approx. 2,997 Kbit) 3,068,928
DSP Blocks (18x18 Multipliers) 247 โ€”
Maximum User I/Os 278 278
Phase-Locked Loops (PLLs) 4 โ€”
Global Clock Networks 20 โ€”
Core Supply Voltage 1.2 V โ€”
Process Technology 65 nm TSMC low-power TSMC 65nm low-power (LP)
Package 484-ball FBGA (FineLine BGA), 23x23 mm โ€”
Operating Temperature Commercial 0C to +85C (C8 grade) [DATA_NEEDED: commercial/industrial grade]
Speed Grade 8 (slowest commercial) โ€”
Configuration Modes Passive Serial (PS), Fast Passive Parallel (FPP), JTAG โ€”
Bitstream Encryption AES-256 (LS family feature) โ€”
RoHS Status Compliant Compliant (per Intel product page)
Device Family โ€” Cycloneยฎ III LS
Logic Elements (LE) โ€” 70,208
Maximum Operating Frequency โ€” 437.5 MHz
Core Supply Voltage (VCCINT) โ€” 1.2 V
Package Type โ€” 484-ball FineLine BGA (FBGA-484)
Package Dimensions โ€” 19 x 19 mm, 1.0 mm ball pitch
Mounting Type โ€” Surface Mount
MSL Level โ€” [DATA_NEEDED: MSL rating]
Configuration Method โ€” JTAG / Passive Serial / Active Serial
Design Tool โ€” Intel Quartus II (Cyclone III support)

Datasheets & Resources

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