EP3CLS70F484C7N - 70K LE Cyclone III LS FPGA 484-FBGA | Intel
MPN: EP3CLS70F484C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $148.5 | $148.50 |
| 10 | $135.2 | $1,352.00 |
| 100 | $118.75 | $11,875.00 |
| 500 | $105.4 | $52,700.00 |
| 1,000 | $96.3 | $96,300.00 |
EP3CLS70F484C7N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (LBs), embedded memory, multiplier/DSP blocks, and programmable I/O cells interconnected by a programmable routing fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> SoC FPGAs, occupying the high-density end used for digital signal processing, custom interfaces, glue logic, and hardware-accelerated compute. The Cyclone III LS family specifically targets low static and dynamic power at 65nm node while preserving sufficient logic, memory, and DSP resources for mainstream embedded workloads.
Key features of the EP3CLS70F484C7N include 70,208 logic elements, approximately 3,068,928 bits of embedded RAM, 4,388 LABs (Logic Array Blocks), 278 maximum user I/Os, and 437.5 MHz maximum internal operating frequency. The device integrates dedicated 18x18 multipliers for DSP, supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI Express through soft IP, and includes configuration bitstream encryption plus JTAG-based IEEE 1149.1 boundary-scan for security-sensitive applications.
The Cyclone III LS architecture separates core logic from I/O banks, allowing independent VCCIO rails per bank for mixed-voltage interfacing. Its 65nm TSMC LP process delivers lower leakage than the standard Cyclone III family, which is critical for thermally constrained and battery-powered systems. The 484-FBGA FineLine BGA provides a compact 19x19mm footprint with 1.0mm ball pitch suitable for multilayer PCBs.
Typical applications include industrial motor control and automation, video processing and image preprocessing pipelines, software-defined radio front-ends, low-cost ASIC prototyping, and secure communications equipment. The Cyclone III LS family is also widely deployed in medical imaging peripherals, test and measurement backplanes, and automotive infotainment prototypes.
When designing with this device, prioritize power distribution: use a four-layer PCB with dedicated core and I/O planes, and place decoupling capacitors within 3mm of every VCC pin. The Quartus II design suite (or its successor) is required for synthesis, place-and-route, and bitstream generation - leverage the low-power compilation mode to minimize dynamic switching current.
This page synthesizes current distributor pricing, verified drop-in alternatives within the Cyclone III LS family, and practical PCB-level design notes that complement (not duplicate) the official Intel Cyclone III Device Handbook.
Drop-in alternatives for EP3CLS70F484C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS70F484C7N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, RoHS Status, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS70F484C8N
✅ Drop-In✓ In Stock
$56.8 / Unit
View Datasheet →EP3CLS70F484C7
✅ Drop-In✓ In Stock
$148.75 / Unit
View Datasheet →EP3C70F484C7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3C70F484C8N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3CLS100F484C7N
✅ Drop-In✓ In Stock
$495.8 / Unit
View Datasheet →EP3CLS70F484I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$67.5 / Unit
View Datasheet →EP3CLS70F484C7N Maximum Ratings & Electrical Characteristics
| Device Family | Cyclone® III LS |
| Logic Elements (LE) | 70,208 |
| Logic Array Blocks (LABs) | 4,388 |
| Embedded Memory Bits | 3,068,928 |
| Maximum User I/Os | 278 |
| Maximum Operating Frequency | 437.5 MHz |
| Process Technology | TSMC 65nm low-power (LP) |
| Core Supply Voltage (VCCINT) | 1.2 V |
| Package Type | 484-ball FineLine BGA (FBGA-484) |
| Package Dimensions | 19 x 19 mm, 1.0 mm ball pitch |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (per Intel product page) |
| Configuration Method | JTAG / Passive Serial / Active Serial |
| Design Tool | Intel Quartus II (Cyclone III support) |
EP3CLS70F484C7N 19 x 19 mm, 1.0 mm ball pitch Pin Configuration Guide
Pin configuration for EP3CLS70F484C7N (19 x 19 mm, 1.0 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS70F484C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS70F484C7N is suitable for 6 applications: Industrial Motor Control, Video Processing and Image Preprocessing, Software-Defined Radio Front-End, ASIC Prototyping and Emulation, Medical Imaging Peripherals, Test and Measurement Instrumentation.
Industrial Motor Control
The EP3CLS70F484C7N delivers 70,208 logic elements and 278 user I/Os in a single 484-FBGA device, making it ideal for multi-axis industrial motor drives. Its 18x18 hardware multipliers and embedded RAM blocks accelerate field-oriented control (FOC) loops, while the 65nm LP process keeps junction temperature within industrial thermal envelopes. Place the device near the IGBT gate drivers with short, matched-length traces to minimize PWM skew, and use the LS family's bitstream encryption to protect proprietary control firmware.
Recommended
Video Processing and Image Preprocessing
The 3,068,928 bits of embedded RAM and 278 I/Os make the EP3CLS70F484C7N well suited to real-time video pipelines where line buffers, color-space conversion, and edge detection are implemented in fabric. Designers typically instantiate DDR2/DDR3 controllers in soft IP to handle full-HD frame buffers, and the LVDS I/O banks enable direct connection to camera-link or MIPI bridges. The 437.5 MHz fabric clock comfortably supports 1080p60 throughput at 8 bits per channel.
Recommended
Software-Defined Radio Front-End
In SDR baseband applications, the EP3CLS70F484C7N's 18x18 multipliers and 70K logic elements are sufficient to implement DDC/DUC, channelizers, and protocol stacks for sub-6 GHz waveforms. The 437.5 MHz fabric clock pairs well with external ADC sample rates up to 250 MSPS, and the low-power LS process enables sealed chassis designs without active cooling. Use the LVDS banks for ADC/DAC data capture and reserve PLLs for low-jitter sampling-clock synthesis.
Recommended
ASIC Prototyping and Emulation
The 70K-LE fabric, plentiful I/Os, and JTAG-driven configuration make the EP3CLS70F484C7N a flexible platform for ASIC prototyping and IP validation before tape-out. Engineers map partitioned RTL into the device, leverage embedded BlockRAM for transaction recording, and use the LS encryption to safeguard pre-silicon customer IP. Quartus II's incremental compilation preserves timing closure across prototype revisions.
Recommended
Medical Imaging Peripherals
Ultrasound beamformers and portable patient monitors benefit from the EP3CLS70F484C7N's combination of embedded multipliers (for FIR/IIR filtering), low-power 65nm LP process (for battery operation), and bitstream encryption (to meet IEC 62443 security guidance for connected medical devices). The 484-FBGA package's compact 19x19mm footprint fits handheld form factors, and the 278 I/Os support multiple transducer channels plus TFT display interfaces.
Recommended
Test and Measurement Instrumentation
Bench-top oscilloscopes, logic analyzers, and protocol testers leverage the EP3CLS70F484C7N's 437.5 MHz fabric speed and 278 I/Os to implement deep acquisition memory, custom triggering, and protocol-decode state machines. The device's dedicated DDR memory interfaces and JTAG-based reconfiguration allow field firmware updates, while the LS encryption protects proprietary decoder IP. Use the Quartus II SignalTap logic analyzer for in-system debug of customer-visible firmware.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS70F484C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS70F484C8N | EP3CLS70F484C7 | EP3C70F484C7N | EP3CLS100F484C7N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | FBGA-484 (19x19mm, 1.0mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Logic Elements | 70,208 | 70,208 | 70,208 | 70,208 | 100,448 |
| Family / Series | Cyclone III LS (low-power, secure) | Cyclone III LS | Cyclone III LS | Cyclone III (standard) | Cyclone III LS |
| Speed Grade | C7 (commercial) | C8 (slower) | C7 | C7 | C7 |
| Bitstream Encryption | Yes (LS series) | Yes | Yes | No (standard Cyclone III) | Yes |
| Embedded Memory | 3,068,928 bits | 3,068,928 bits | 3,068,928 bits | 2,730,240 bits | 4,026,624 bits |
| Maximum User I/Os | 278 | 278 | 278 | 278 | 278 |
Key Differentiators
- Bitstream encryption hardware (vs EP3C70F484C7N)
- Lower static leakage from LS process (vs EP3C70F484C7N)
- Faster commercial speed grade (vs EP3CLS70F484C8N)
Design Notes
The EP3CLS70F484C7N requires a clean 1.2V core rail (VCCINT) capable of delivering up to 1.5A during full fabric utilization, plus per-bank VCCIO rails (1.2V/1.5V/1.8V/2.5V/3.3V) and a quiet 2.5V PLL analog supply. Place one 0.1uF MLCC within 3mm of every VCC pin and add bulk tantalum or polymer capacitors near each supply pin group. Estimated: at 100% toggle rate the dynamic current can exceed 1.2A; verify against the Quartus II PowerPlay early in the design cycle.
Use a 4-layer or 6-layer PCB with continuous ground and power planes directly beneath the 484-FBGA footprint. Escape the BGA on the top layer with dog-bone fanouts or microvias to inner signal layers. Match the impedance of DDR2/DDR3 traces to 50 ohm single-ended and 100 ohm differential, and isolate the LVDS pairs from noisy switching signals with ground pours. Keep all decoupling loops under 1mm in length.
The 484-FBGA package's thermal pad must be soldered to a copper-filled land pattern with thermal vias (typically 0.3mm drill, 1.0mm pitch, plugged on the bottom) to provide a low-resistance path to inner ground planes. Without thermal vias, the junction-to-ambient thermal resistance (theta_JA) can exceed 25 C/W and trigger thermal throttling in fully utilized designs. Estimated: at 1.5W dissipation with proper thermal vias, expect a junction temperature rise of ~20-25 C above ambient.
Do not leave CONFIG_DONE, nSTATUS, or nCONFIG floating - each requires a pull-up or pull-down resistor per the Cyclone III Handbook. ConfMSEL[3:0] pins must be hardwired to select the configuration mode (AS, PS, JTAG, or FPP) and cannot be changed at runtime. Forgetting to assert nCE or correctly strapping MSEL is the most common first-board failure mode.
Compliance Information
RoHS and lead-free compliance confirmed by the Intel/Altera product page. AEC-Q100 not applicable (FPGA, not a discrete automotive IC). MSL rating and halogen-free status not specified in the provided Verified Web Data and marked as [DATA_NEEDED].
