EP3CLS70F780C8 vs EP3CLS150F780C8 Comparison

Detailed side-by-side comparison of EP3CLS70F780C8 by Intel and EP3CLS150F780C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS70F780C8 EP3CLS150F780C8
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $56.75 $195.20
Family Cyclone III LS Cyclone III LS
Logic Elements (LE) 70,208 β€”
Logic Array Blocks (LAB) 4,463 β€”
Embedded Memory Bits 3,068,928 bit β€”
Embedded Memory (M9K blocks) 305 β€”
Embedded 18x18 Multipliers 244 β€”
Maximum User I/O Pins 413 β€”
Maximum Operating Frequency 402 MHz 402 MHz
Process Technology 65 nm TSMC low-power CMOS 65 nm
Core Supply Voltage 1.2 V 1.2 V
Package 780-ball FineLine BGA (FBGA-780) β€”
Operating Junction Temperature 0 Β°C to +85 Β°C (commercial) β€”
PLLs 4 general-purpose PLLs β€”
Global Clock Networks 20 β€”
Security Features AES bitstream encryption, JTAG tamper protection β€”
Configuration Scheme Active serial (AS), passive serial (PS), JTAG, Fast Passive Parallel (FPP) β€”
RoHS Status Compliant β€”
Mounting Type Surface Mount (BGA) Surface Mount
Series β€” Cyclone III
Logic Elements / Cells β€” 150,848
Total Memory Bits β€” 6,137,856
Number of LABs β€” 9,428
Number of Logic Array Blocks β€” 9,428
User I/O Pins β€” 413
Number of PLLs β€” 4
Operating Temperature β€” 0 C to 85 C (Commercial)
Package Type β€” FBGA-780
Package Dimensions β€” 29 x 29 mm
Ball Pitch β€” 1.0 mm
Lead Free / RoHS β€” Compliant
Configuration Mode β€” JTAG, Passive Serial, Active Serial, Fast Passive Parallel

Datasheets & Resources

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