EP3CLS70F780C8 - Cyclone III LS FPGA 70K LE 780-FBGA | Intel
MPN: EP3CLS70F780C8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $73.1 | $731.00 |
| 100 | $64.85 | $6,485.00 |
| 250 | $60.4 | $15,100.00 |
| 500 | $56.75 | $28,375.00 |
EP3CLS70F780C8 Overview
A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory, multipliers, and I/O elements that the user can re-program after manufacture to implement arbitrary digital functions. Cyclone III LS belongs to the broader taxonomy of programmable logic devices (PLD) within the power management and digital logic family of semiconductors. The Cyclone III LS architecture is optimized for low static and dynamic power, making it well suited to industrial, automotive driver assistance, video processing, and communications infrastructure designs that demand hundreds of thousands of logic gates plus hardware DSP throughput.
Key features include 70,208 logic elements (LEs), 4 Mbit embedded SRAM organized as 305 memory blocks of 9 Kbit each, up to 244 embedded 18x18 multipliers for DSP, four general-purpose PLLs, and 413 user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The 780-pin FineLine BGA package exposes the full I/O count plus eight transceiver clock inputs, dedicated configuration and JTAG pins, and dual-purpose configuration pins. Internal long-line and row/column routing interconnect supports predictable timing closure at speeds up to 402 MHz.
The Cyclone III LS architecture combines an FPGA fabric, embedded memory, embedded multiplier blocks, and I/O elements in a unified low-power silicon process. Compared to the base Cyclone III family, the LS variant adds the security engine, hardware AES decryption, and JTAG tamper detection without changing the core logic or I/O structure. This makes the LS family a power- and security-aware extension of Cyclone III for designs that require both low static power and tamper-resistant bitstream handling.
Typical applications for the EP3CLS70F780C8 include industrial motor control, video surveillance and image processing pipelines, automotive driver-assistance front cameras, software-defined radio front-ends, telecommunications line cards, and medical imaging pre-processing. The combination of low cost per logic element and a security-hardened bitstream makes it appropriate for connected industrial equipment and edge-compute appliances where both power budget and IP protection matter.
When designing with this device, pay close attention to the FPGA bank supply and reference-voltage sequencing required for the 780-ball FineLine BGA. Quartus II or the Intel Quartus Prime design software is required for place-and-route, timing closure, and bitstream generation. For tamper-protected deployments, enable the AES-128/256 bitstream encryption and JTAG-disable features early in the design phase so the configuration pins are constrained correctly.
This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone III LS family, and practical design notes that complement the Cyclone III LS Device Data Sheet. Information is current as of 2026-09-09.
Drop-in alternatives for EP3CLS70F780C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS70F780C8 (same form factor and footprint) — differing in Process Technology, Package, Embedded Memory Bits, Logic Elements, Maximum User I/O.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS70F780C8N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP3CLS100F780C8N
✅ Drop-In✓ In Stock
$105.8 / Unit
View Datasheet →EP3CLS100F780C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$65 / Unit
View Datasheet →EP3CLS150F780C8N
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$205 / Unit
View Datasheet →EP3CLS150F780C8
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$195.2 / Unit
View Datasheet →EP3CLS200F780C8
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$1995 / Unit
View Datasheet →EP3CLS70F780C8 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III LS |
| Logic Elements (LE) | 70,208 |
| Logic Array Blocks (LAB) | 4,463 |
| Embedded Memory Bits | 3,068,928 bit |
| Embedded Memory (M9K blocks) | 305 |
| Embedded 18x18 Multipliers | 244 |
| Maximum User I/O Pins | 413 |
| Maximum Operating Frequency | 402 MHz |
| Process Technology | 65 nm TSMC low-power CMOS |
| Core Supply Voltage | 1.2 V |
| Package | 780-ball FineLine BGA (FBGA-780) |
| Operating Junction Temperature | 0 °C to +85 °C (commercial) |
| PLLs | 4 general-purpose PLLs |
| Global Clock Networks | 20 |
| Security Features | AES bitstream encryption, JTAG tamper protection |
| Configuration Scheme | Active serial (AS), passive serial (PS), JTAG, Fast Passive Parallel (FPP) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
EP3CLS70F780C8 780-ball fineline bga (fbga-780) Pin Configuration Guide
Pin configuration for EP3CLS70F780C8 (780-ball fineline bga (fbga-780) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS70F780C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS70F780C8 is suitable for 7 applications: Industrial Motor Control, Video Surveillance and Image Processing, Automotive Driver Assistance Front Camera, Software Defined Radio Front-End, Telecommunications Line Card, Medical Imaging Pre-Processing, Connected Industrial Edge Gateways.
Industrial Motor Control
The EP3CLS70F780C8 fits industrial motor control designs because its 244 embedded 18x18 multipliers execute field-oriented control (FOC) loops and space-vector PWM at high update rates while the 65 nm low-power process keeps junction temperature manageable inside sealed drives. With 70,208 LEs and 305 M9K memory blocks, the fabric can absorb resolver decoding, current-loop PI controllers, and safety state machines on a single device. The AES bitstream encryption protects proprietary motor-control firmware when drives ship to OEMs. Designers typically place the FPGA between the MCU and the IGBT gate driver, using its 413 user I/O for parallel ADC sampling and PWM outputs.
Recommended
Video Surveillance and Image Processing
The EP3CLS70F780C8 is well matched to video surveillance and image-processing pipelines because its 70K LEs plus 244 multipliers can sustain multi-tap FIR filtering and real-time motion-detection algorithms at full HD frame rates. The 3,068,928 bits of embedded SRAM allow line and frame buffering without external memory for moderate resolutions, while the 413 user I/O accommodate parallel camera sensor interfaces, DDR2/DDR3 memory, and HDMI/DVI outputs. The LS family's low static power benefits fanless surveillance enclosures, and AES encryption protects analytic IP embedded in the bitstream. This part typically sits between the image sensor and the network processor, handling ISP front-end tasks.
Recommended
Automotive Driver Assistance Front Camera
The EP3CLS70F780C8 supports automotive front-camera advanced driver-assistance systems (ADAS) because the 70,208 LEs can host lane-departure warning, vehicle/pedestrian detection, and traffic-sign recognition algorithms in parallel. The 244 embedded 18x18 multipliers accelerate HOG and Haar-classifier features common in vision pipelines, and the device's 65 nm low-power process keeps thermal envelope compatible with sealed automotive camera modules. With 413 user I/O, designers can connect to MIPI-CSI bridges, automotive Ethernet PHYs, and CAN-FD transceivers without external logic. The Cyclone III LS Device Data Sheet confirms AEC-Q100 compatibility is not available, so this part suits non-safety-critical vision pre-processing in non-AEC-Q100 platforms.
Recommended
Software Defined Radio Front-End
The EP3CLS70F780C8 fits software-defined radio front-ends because its 244 18x18 multipliers implement digital down-conversion, channelization, and digital pulse shaping FIR filters at sample rates up to 250 MHz. The 305 M9K memory blocks absorb FIFO buffering between ADC data streams and downstream DSP cores, while the 4 general-purpose PLLs derive precise sample and symbol clocks from a low-frequency reference. The 413 user I/O accommodate LVDS pairs from high-speed ADCs and JESD-style interfaces when bit-slip alignment is required. AES bitstream encryption is valuable in customer-premises radio equipment where firmware constitutes protectable IP. The FPGA typically sits between the ADC and the host processor, performing real-time baseband processing.
Recommended
Telecommunications Line Card
The EP3CLS70F780C8 is appropriate for telecommunications line-card designs because its low-power 65 nm Cyclone III LS fabric integrates protocol bridging, packet classification, and traffic-shaping functions at line rates without forcing a larger, more expensive FPGA. The 413 user I/O provide SGMII-style LVDS interfaces to PHY devices, while the 3,068,928 bits of embedded memory support deep FIFO queues between the network and the host fabric. Per the Cyclone III LS Device Data Sheet, AES bitstream encryption is essential when the line card ships to carriers and must comply with lawful-intercept and IP-protection requirements. The device typically bridges PHY, framer, and switch ASIC functions on legacy telecom backplanes.
Recommended
Medical Imaging Pre-Processing
The EP3CLS70F780C8 suits medical imaging front-ends such as ultrasound beamforming and endoscopy video pre-processing because its 244 18x18 multipliers run real-time FIR filtering and beam-delay computation across transducer channels at low latency. The 3,068,928 bits of embedded SRAM hold scan-line buffers and lookup tables needed for image reconstruction, while the 70,208 LEs implement the control state machine and DMA engines. The 780-FBGA package provides 413 user I/O for high-speed ADC data capture and display-panel interfaces. AES bitstream encryption is valuable in regulated medical environments where diagnostic algorithms constitute protectable IP, though AEC-Q100 medical safety certifications are not provided on Cyclone III LS parts.
Recommended
Connected Industrial Edge Gateways
The EP3CLS70F780C8 fits connected industrial edge gateways because its Cyclone III LS security engine provides AES bitstream encryption plus JTAG tamper protection that hardened industrial customers require. The 70,208 LEs run protocol conversion (Modbus, EtherCAT, PROFINET), local analytics, and secure-boot sequencing on a single low-power device, while 413 user I/O expose multiple industrial bus interfaces without external logic. The 65 nm low-power process and 1.2 V core keep the FPGA compatible with sealed IP65 enclosures and convection-cooled gateways. Per the Cyclone III LS Device Data Sheet, the LS family is the recommended Cyclone III tier for any design where IP protection or tamper resistance is a hard requirement.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS70F780C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS70F780C8N | EP3CLS100F780C8N | EP3CLS100F780C8 | EP3CLS150F780C8N | EP3CLS200F780C8 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (FineLine BGA, 29x29, 1.0 mm pitch) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 70,208 | 70,208 (identical) | 100,448 (+43%) | 100,448 (+43%) | 150,848 (+114%) | 200,496 (+185%) |
| Embedded Memory | 3,068,928 bit (305 M9K blocks) | 3,068,928 bit (identical) | 4,473,408 bit | 4,473,408 bit | 6,143,808 bit | 8,192,000 bit |
| Embedded 18x18 Multipliers | 244 | 244 (identical) | 266 | 266 | 384 | 396 |
| Maximum User I/O | 413 | 413 (identical) | 426 | 426 | 426 | 426 |
| Security Engine (AES + JTAG tamper) | Yes | Yes (identical) | Yes | Yes | Yes | Yes |
| Core Voltage | 1.2 V | 1.2 V (identical) | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | C8 (commercial) | C8N (commercial, Pb-free) | C8N (commercial, Pb-free) | C8 (commercial) | C8N (commercial, Pb-free) | C8 (commercial) |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- AES-128/256 bitstream encryption plus JTAG tamper protection (vs EP3C70F780C8 (base Cyclone III, no LS security))
- Pin-compatible with higher-density LS variants for design migration (vs EP3CLS100F780C8N (same 780-FBGA))
- 305 M9K memory blocks for embedded line/frame buffers (vs Lattice ECP5 LFE5UM-85 (8.9 Mbit distributed))
- Low static power via 65 nm low-process TSMC technology (vs Spartan-6 XC6SLX75 (45 nm but higher static))
Design Notes
The EP3CLS70F780C8 requires a clean 1.2 V core supply (VCCINT) plus separate VCCIO bank supplies (typically 1.2 V to 3.3 V) and a VCCA_PLL analog supply for the four PLLs. Per the Cyclone III LS Device Data Sheet, decouple each VCC pin with 0.1 µF and 10 µF capacitors placed as close as physically possible to the package balls, and isolate the PLL supply with a ferrite bead from the digital rails. Sequencing of VCCINT before VCCIO is required to avoid I/O latch-up during power-up; failing to sequence supplies can permanently damage the device.
The 780-ball FineLine BGA uses a 1.0 mm pitch, which is the largest pitch in the Cyclone III LS family and is forgiving for PCB fabrication. Use at least 4-layer stack-up with continuous GND and PWR planes directly under the BGA to provide low-impedance return paths for high-speed LVDS and DDR signals. Per the Cyclone III LS Device Data Sheet, route differential pairs (LVDS) with 100 Ω differential impedance, length-matched within 50 mils for source-synchronous interfaces, and keep all configuration signals (TCK, TMS, TDI, TDO, MSEL, nCE, nCONFIG, nSTATUS, CONF_DONE, DCLK) short to avoid boot issues.
Estimated: with all 70,208 LEs switching at 25 percent toggle rate and the device operating at 1.2 V core, dynamic power is approximately 1.5 W to 2 W typical, plus 100 mW to 200 mW static. The 780-FBGA package has a junction-to-ambient thermal resistance around 15 C/W with adequate PCB copper pour; without copper spreading, θJA can exceed 30 C/W. Per the Cyclone III LS Device Data Sheet, designers should target at least 10 cm² of 4-layer GND copper under the device to keep junction rise below 30 C above ambient at full load.
Two common pitfalls when designing with the EP3CLS70F780C8: (1) confusing Cyclone III LS with base Cyclone III - only the LS family has AES bitstream encryption, and selecting the wrong family breaks IP protection; (2) incorrect MSEL pin strapping - the MSEL[3:0] pins select the configuration scheme (AS, PS, FPP, JTAG) and an incorrect setting causes boot failure. Refer to the Cyclone III LS Device Data Sheet configuration chapter for the exact MSEL resistor pull-up/pull-down table. Additionally, do not enable JTAG tamper protection before the design is fully validated, because the device may refuse subsequent unencrypted configuration attempts.
Compliance Information
RoHS and REACH compliance per Intel material declaration. Not AEC-Q100 qualified. Lead-free (Pb-free) 780-FBGA finish standard on C8N variants; the C8 finish is also lead-free per Cyclone III LS family datasheet. Halogen-free status marked unknown because it was not explicitly stated in the verified web data provided.
