EP3CLS70F780I7 vs EP3CLS70F780I7N Comparison
Detailed side-by-side comparison of EP3CLS70F780I7 by Intel and EP3CLS70F780I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N β ActiveSpecification Comparison
| Parameter | EP3CLS70F780I7 | EP3CLS70F780I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $125.00 | $880.00 |
| Family | Cyclone III LS | β |
| Logic Elements (LEs) | 70,208 | β |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | β |
| Embedded Memory Bits | 3,068,928 bits (2.93 Mbit) | β |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | β |
| Hardware Multipliers (18x18) | 413 | β |
| PLLs | 4 | β |
| Global Clock Networks | 20 | β |
| Maximum User I/Os | 429 | β |
| Package | 780-ball FBGA (1.0 mm pitch, 29 x 29 mm) | β |
| Operating Temperature (Industrial, 'I') | -40C to +100C (case) | β |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V | β |
| I/O Supply Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | β |
| Configuration Support | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) | β |
| Bitstream Encryption | AES-128/256 (LS-family feature) | β |
| Process Node | 60 nm TSMC low-power | β |
| RoHS Status | Non-compliant (per Cyclone III LS datasheet prefix per verified data) | unknown |
| Speed Grade | 7 (moderate) | β |
| Device Type | β | Field Programmable Gate Array (FPGA) |
| Series | β | Cyclone III LS |
| Logic Elements | β | 70,208 |
| Embedded Memory | β | 3,068,928 bits |
| Maximum User I/O | β | 413 pins |
| Supply Voltage | β | 1.2 V |
| Temperature Grade | β | Industrial |
| Package Type | β | BGA |
| Package Pin Count | β | 780 balls |
| Package Shape | β | Square |
| Terminal Form | β | Ball |
| Configuration Technology | β | SRAM-based FPGA |
| Configuration Method | β | [DATA_NEEDED: configuration method] |
| Operating Temperature | β | [DATA_NEEDED: operating temperature] |
| Mounting Type | β | Surface Mount |
| REACH Status | β | unknown |
| AEC-Q100 Qualification | β | unknown |