EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
MPN: EP3CLS70F780I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1140 | $1,140.00 |
| 10 | $1090 | $10,900.00 |
| 100 | $1020 | $102,000.00 |
| 500 | $950 | $475,000.00 |
| 1,000 | $880 | $880,000.00 |
EP3CLS70F780I7N Overview
A field-programmable gate array, or FPGA, is an integrated circuit containing configurable logic blocks, programmable interconnects, input/output resources, and often dedicated memory or interface circuitry. Engineers configure these hardware resources after PCB assembly to implement custom digital functions. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices and is positioned between fixed-function application-specific integrated circuits and software-driven processors because it combines hardware parallelism with design-time reconfiguration.
The principal verified resource figures are 70,208 logic elements and 3,068,928 bits of embedded memory. The device provides 413 maximum user I/O pins according to the distributor specification. Its 780-ball BGA package supports dense board-level routing, while the 1.2 V supply indication helps define the core power architecture. The I7 ordering code corresponds to industrial grading, as independently identified in the supplied distributor data.
Cyclone III LS devices are intended for configurable digital implementations in which parallel processing, interface aggregation, and deterministic hardware operation are important. Unlike a processor that executes sequentially, an FPGA can instantiate many parallel datapaths and state machines. Embedded memory can support FIFOs, lookup tables, packet buffers, image-line storage, and other localized data structures without consuming all general-purpose logic elements.
Typical applications include industrial control, communications equipment, video and image processing, test and measurement, machine-vision controllers, and embedded digital signal processing. For machine vision, the FPGA can combine sensor acquisition, pixel processing, buffering, and host-interface logic. In communications, it can implement protocol conversion, framing, filtering, and timing functions while the 413-I/O capacity supports multiple external interfaces.
Design planning should begin with pin assignment, core-current estimation, configuration circuitry, decoupling, and signal-integrity analysis for the 780-ball BGA. The 3,068,928-bit memory figure should not be interpreted as a fixed contiguous RAM block; usable embedded memory depends on the selected Cyclone III LS architecture, configuration, and memory depth/width choices. The BGA escape routing also requires strict adherence to the manufacturer's PCB design guidance.
This product page consolidates verified distributor specifications, industrial-grade identity, package information, commercial availability, and same-brand drop-in alternatives. It is intended to help engineers shortlist the FPGA while recognizing that pinout, timing, power, configuration, and device-family compatibility must be confirmed against the manufacturer documentation before release to production.
Drop-in alternatives for EP3CLS70F780I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS70F780I7N (same form factor and footprint) — differing in Package, RoHS Status, Embedded Memory Bits, PLLs, Process Node.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS70F780I7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$125 / Unit
View Datasheet →EP3CLS70F780C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$318.75 / Unit
View Datasheet →EP3CLS70F780C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$350 / Unit
View Datasheet →EP3CLS70F780C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →EP3CLS70F780C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$56.75 / Unit
View Datasheet →EP3CLS70F780I7N Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Series | Cyclone III LS |
| Logic Elements | 70,208 |
| Embedded Memory | 3,068,928 bits |
| Maximum User I/O | 413 pins |
| Supply Voltage | 1.2 V |
| Temperature Grade | Industrial |
| Package Type | BGA |
| Package Pin Count | 780 balls |
| Package Shape | Square |
| Terminal Form | Ball |
| Configuration Technology | SRAM-based FPGA |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
EP3CLS70F780I7N square Pin Configuration Guide
Pin configuration for EP3CLS70F780I7N (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS70F780I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS70F780I7N is suitable for 6 applications: Industrial Control and Automation, Communications and Protocol Bridging, Video and Image Processing, Test and Measurement Equipment, Embedded Signal Processing, Machine Vision Controller.
Industrial Control and Automation
EP3CLS70F780I7N fits industrial control systems that require parallel logic, multiple external interfaces, and industrial-temperature ordering. Its verified 70,208 logic elements support state machines, protocol handlers, motor-control sequencing, and safety-oriented control logic. The 3,068,928 bits of embedded memory can hold FIFOs and command or telemetry buffers, while 413 maximum user I/O pins allow the FPGA to aggregate sensors, actuators, converters, and supervisory processors. It is typically placed between a controller and field interfaces, where deterministic hardware operation helps reduce software scheduling pressure. The 1.2 V supply and 780-ball BGA require careful power integrity and multilayer routing. Confirm exact operating-temperature limits, I/O standards, and pin assignments in the manufacturer datasheet before production release.
Recommended
Communications and Protocol Bridging
EP3CLS70F780I7N is suitable for communications equipment that needs configurable framing, packet buffering, protocol conversion, and parallel datapath processing. The verified 70,208 logic elements allow several independent receive, transmit, filtering, and control paths to operate concurrently. Its 3,068,928 bits of embedded memory can support FIFOs, lookup tables, and packet queues, while the 413 maximum user I/O pins provide capacity for parallel buses, management interfaces, and high-pin-count external devices. In a typical design, the FPGA sits between a host processor and PHY, serializer, converter, or backplane interface. The design must be checked against supported I/O voltage, timing, and banking rules, because the supplied data does not provide interface-speed specifications. The 780-ball BGA also requires controlled-impedance escape routing and robust reference-plane continuity.
Recommended
Video and Image Processing
EP3CLS70F780I7N can serve as a hardware image-processing engine in machine-vision, inspection, and display-interface equipment. The verified 70,208 logic elements provide capacity for pixel pipelines, color-space conversion, filtering, feature extraction, and frame timing. The 3,068,928 bits of embedded memory are useful for line buffers, small frame regions, lookup tables, and synchronization FIFOs. With 413 maximum user I/O pins, the device can connect image sensors, frame buffers, display controllers, and host processors without relying exclusively on a narrow external bus. The FPGA can process multiple pixels in parallel, reducing the need for a processor to execute every operation. The 1.2 V supply requires a low-noise power implementation, while the 780-ball package demands careful BGA layout. Exact image-rate support must be established through timing analysis and device I/O documentation.
Recommended
Test and Measurement Equipment
EP3CLS70F780I7N fits test and measurement platforms that need simultaneous capture, triggering, filtering, and data formatting. Its 70,208 logic elements can implement multiple acquisition channels, digital demodulation, waveform analysis, and deterministic control functions. The verified 3,068,928 bits of embedded memory can hold sample buffers, trigger histories, lookup tables, and channel FIFOs. The 413 maximum user I/O pins support ADC interfaces, DAC controls, clock distribution, front-panel communication, and high-speed data export. A typical architecture uses the FPGA to synchronize converters and reduce the host processor's real-time workload. The 780-ball BGA supports dense integration but requires disciplined signal integrity, impedance control, and power decoupling. Since the supplied data does not specify ADC/DAC compatibility or maximum clock rates, validate those requirements against the target interfaces and FPGA documentation.
Recommended
Embedded Signal Processing
EP3CLS70F780I7N is appropriate for embedded signal-processing systems that benefit from hardware parallelism and deterministic latency. The verified 70,208 logic elements can implement FIR filters, FFT stages, encoders, decoders, arithmetic datapaths, and control logic, while the 3,068,928 bits of embedded memory support coefficient storage, sample buffers, and intermediate data. The 413 maximum user I/O pins allow the FPGA to interface with data converters, processors, memory, and control peripherals. In a typical signal chain, the FPGA performs preprocessing before data is transferred to a host or downstream accelerator. This can reduce bottlenecks caused by sequential software processing. The 1.2 V supply and 780-ball BGA require a carefully designed power distribution network and controlled PCB stack-up. Confirm DSP performance, clocking, memory configuration, and timing margins using the manufacturer design tools.
Recommended
Machine Vision Controller
EP3CLS70F780I7N is well matched to machine-vision controllers that need synchronized sensor acquisition, preprocessing, buffering, and host communication. Its 70,208 logic elements can support pixel correction, region-of-interest extraction, thresholding, filtering, and camera timing. The verified 3,068,928 bits of embedded memory provide capacity for line buffers, lookup tables, and small image or feature stores. The 413 maximum user I/O pins are useful for connecting camera modules, frame-grabber devices, encoders, lighting controls, and host interfaces. The FPGA can perform deterministic operations while a processor handles higher-level analysis. In a typical system, sensor data enters through parallel or serialized interfaces, passes through processing blocks, and is transferred through a managed FIFO. The 780-ball BGA and 1.2 V supply make power integrity and signal integrity central to implementation. Exact sensor interface rates and supported I/O standards require datasheet validation.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS70F780I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS70F780I7 | EP3CLS70F780C7N | EP3CLS70F780C7 | EP3CLS70F780C8N | EP3CLS70F780C8 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball BGA (F780) | 780-ball BGA (F780) | 780-ball BGA (F780) | 780-ball BGA (F780) | 780-ball BGA (F780) | 780-ball BGA (F780) |
| Logic Elements | 70,208 | 70,208 | 70,208 | 70,208 | 70,208 | 70,208 |
| Embedded Memory | 3,068,928 bits | 3,068,928 bits | 3,068,928 bits | 3,068,928 bits | 3,068,928 bits | 3,068,928 bits |
| Maximum User I/O | 413 pins | 413 pins | 413 pins | 413 pins | 413 pins | 413 pins |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Ordering Variant | I7N | I7 | C7N | C7 | C8N | C8 |
| Configuration Technology | SRAM-based FPGA | SRAM-based FPGA | SRAM-based FPGA | SRAM-based FPGA | SRAM-based FPGA | SRAM-based FPGA |
Key Differentiators
- High verified logic capacity for programmable control and processing (vs EP3CLS100F780I7N)
- Large embedded-memory resource relative to general-purpose control FPGAs (vs EP3C10U256C8)
- Industrial temperature grading in the I7N ordering (vs EP3CLS70F780C7N)
- Same-family F780 footprint reuse potential (vs EP3CLS70F484I7N)
Design Notes
Use the verified 1.2 V supply indication as the starting point for the FPGA core power tree, but do not design the complete power system from that single figure alone. Confirm the required I/O, auxiliary, configuration, and reference rails from the manufacturer datasheet. Estimate regulator current from the intended logic utilization, clock rates, switching activity, and I/O loading rather than assuming a full-load value. Place local decoupling close to the 780-ball package, maintain solid reference planes, and simulate transient response before layout release.
The 780-ball BGA requires a controlled-impedance multilayer PCB, uninterrupted reference planes, and a fanout strategy that follows the manufacturer's package drawing. Start pin assignment with power, configuration, clocks, and high-speed interfaces before assigning lower-speed I/O. Verify ball escape rules, via-in-pad requirements, solder-mask definition, and assembly capabilities with the fabricator. A complete official ball map was not included in the verified web data, so the manufacturer datasheet and package drawing are mandatory for implementation.
The 413 maximum user I/O count provides routing capacity but does not establish signal integrity or supported data rate. Use controlled-impedance traces for fast external buses, maintain short clock paths, provide return-path continuity, and simulate the relevant I/O configuration. Separate noisy switching regions from clocks, configuration signals, and sensitive analog supplies where the board allows. The supplied data does not specify I/O standards or timing limits, so qualify every interface using the official Cyclone III LS documentation and measured board behavior.
Do not infer a complete pinout from the F780 package code, and do not treat every C7, C8, or I7 ordering variant as automatically interchangeable. Confirm the exact ordering-code meaning, speed grade, temperature grade, configuration interface, and ball-level compatibility. Also distinguish 70,208 logic elements from 3,068,928 bits of embedded memory: the two resources serve different design functions. Build the FPGA project using the correct device family and obtain post-route timing, power, and configuration validation before release.
Compliance Information
The verified web data does not explicitly provide RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations for EP3CLS70F780I7N. No compliance claim is assumed.
