EP3SE110F1152C2 vs EP3SE110F1152C4 Comparison

Detailed side-by-side comparison of EP3SE110F1152C2 by Intel and EP3SE110F1152C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE110F1152C2 EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel

EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel

EP3SE110F1152C2 ⚠ Last Time Buy
Intel
EP3SE110F1152C4 EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE110F1152C2 EP3SE110F1152C4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $4,100.00 $2,200.00
Family Stratix III E (Enhanced) Stratix III E
Logic Elements 107,500 107,500
Logic Array Blocks (LABs) 4,300 [DATA_NEEDED: LAB count]
Adaptive Logic Modules (ALMs) 53,750 β€”
Embedded Memory (bits) 8,936,448 β€”
Maximum User I/Os 744 744
Process Technology 65 nm 65 nm
Core Voltage 0.9 V 1.1 V
Maximum Internal Frequency 800 MHz β€”
Operating Temperature 0C to 85C (Commercial) β€”
Package 1152-ball FC-BGA β€”
Package Code F1152 β€”
Mounting Type Surface Mount (BGA) β€”
Device Type FPGA β€”
Configuration SRAM-based, volatile (requires configuration device) β€”
Embedded Memory β€” 8,936,448 bits
DSP Blocks β€” [DATA_NEEDED: 18x18 multiplier count]
Maximum Performance β€” 450 MHz
Package Type β€” 1152-ball FCBGA (Flip-Chip BGA)
Operating Temperature Grade β€” Commercial (C4)
Configuration Memory β€” SRAM-based (volatile)
On-chip Termination β€” Dynamic, programmable
I/O Standards Supported β€” LVDS, LVTTL, LVCMOS, HSTL, SSTL
RoHS Status β€” Compliant

Datasheets & Resources

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