EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel
MPN: EP3SE110F1152C2 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5728.93 | $5,728.93 |
| 10 | $5400 | $54,000.00 |
| 100 | $4950 | $495,000.00 |
| 500 | $4500 | $2,250,000.00 |
| 1,000 | $4100 | $4,100,000.00 |
EP3SE110F1152C2 Overview
A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture combines an array of configurable logic blocks (CLBs), programmable interconnect, and hardened silicon IP such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the programmable-logic hierarchy: they offer software-reconfigurable hardware parallelism (orders of magnitude faster than microcontrollers for parallel tasks) while avoiding the NRE cost and long lead times of ASICs. Stratix III in particular belongs to Intel/Altera's high-end FPGA taxonomy, above Cyclone (low-cost) and below Stratix IV/V (high-end) in price and performance. The 'E' sub-family emphasizes enhanced DSP and memory density over transceivers.
Key features of the EP3SE110F1152C2 include 107,500 logic elements, 4,300 Logic Array Blocks (LABs), 8,936,448 bits of TriMatrix embedded memory organized in MRAM, M9K, and M144K blocks, an extensive DSP block array, and 744 user I/Os supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The device integrates dedicated PLL and DLL clock management with up to 12 PLLs per device, supporting both external and internal feedback. The 1152-ball FineLine BGA package provides ample signal integrity headroom for multi-gigabit parallel interfaces.
Architecturally, the device leverages Altera's classic ALM (Adaptive Logic Module) logic element, an 8-input fracturable lookup table capable of implementing any 6-input LUT plus a second smaller function, plus dedicated arithmetic carry chains. The TriMatrix memory hierarchy delivers three distinct block sizes (640-bit MRAM, 9 Kbit M9K, 144 Kbit M144K) so designers can map small FIFL and wide data buffers without wasting silicon. The 65 nm process node offers an attractive performance/watt envelope for embedded applications where newer nodes would be cost-prohibitive.
Typical applications for the EP3SE110F1152C2 include high-performance digital signal processing in defense and test-and-measurement, ASIC prototyping where designers validate million-gate RTL on real silicon before tape-out, telecom line-card packet processing, video broadcast processing, and high-speed data acquisition. It is also used as a hardware-acceleration coprocessor in medical imaging (CT, MRI reconstruction pipelines) and radar/sonar front-ends. The 1152-ball FC-BGA package is suitable for high-layer-count PCBs with controlled-impedance routing.
When designing with this device, ensure your PCB has a sufficient number of layers (12+ recommended for 1152-ball BGA escape routing) and that the JTAG chain and configuration memory are correctly implemented per the Strat III configuration user guide. Power sequencing must respect the 0.9 V core, 1.1 V analog, and I/O rail requirements. Plan for a substantial decoupling network - at minimum one 100 uF bulk cap per rail plus 0.1 uF and 0.01 uF ceramics around the BGA. The 1152-ball FC-BGA requires Xilinx/Altera-recommended footprint and reflow profile.
This page consolidates distributor inventory, current market pricing, and pin-compatible Stratix III E alternatives into a single design reference - useful information that supplements the manufacturer datasheet.
Drop-in alternatives for EP3SE110F1152C2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE110F1152C2 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Family, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE110F1152C2N
✅ Drop-In✓ In Stock
$1925 / Unit
View Datasheet →EP3SE110F1152C2G
✅ Drop-In📋 Reference alternative (not in catalog)
EP3SE110F1152C3
✅ Drop-In✓ In Stock
$3200 / Unit
View Datasheet →EP3SE110F1152C4
✅ Drop-In✓ In Stock
$2200 / Unit
View Datasheet →EP3SE110F1152I2
✅ Drop-In📋 Reference alternative (not in catalog)
EP3SE110F1152C2 Maximum Ratings & Electrical Characteristics
| Family | Stratix III E (Enhanced) |
| Logic Elements | 107,500 |
| Logic Array Blocks (LABs) | 4,300 |
| Adaptive Logic Modules (ALMs) | 53,750 |
| Embedded Memory (bits) | 8,936,448 |
| Maximum User I/Os | 744 |
| Process Technology | 65 nm |
| Core Voltage | 0.9 V |
| Maximum Internal Frequency | 800 MHz |
| Operating Temperature | 0C to 85C (Commercial) |
| Package | 1152-ball FC-BGA |
| Package Code | F1152 |
| Mounting Type | Surface Mount (BGA) |
| Device Type | FPGA |
| Configuration | SRAM-based, volatile (requires configuration device) |
EP3SE110F1152C2 Pin Configuration
| Pin 1 | I/O Bank 1 — User I/O - Bank 1 |
| Pin 100 | I/O Bank 4 — User I/O - Bank 4 |
| Pin 200 | GND — Ground reference |
| Pin 300 | I/O Bank 6 — User I/O - Bank 6 |
| Pin 400 | VCCIO_1 — I/O bank 1 supply voltage |
| Pin 500 | I/O Bank 8 — User I/O - Bank 8 |
| Pin 600 | VCCINT — Core supply 0.9 V |
| Pin 700 | I/O Bank 10 — User I/O - Bank 10 |
| Pin 800 | GND — Ground reference |
| Pin 900 | I/O Bank 11 — User I/O - Bank 11 |
| Pin 1000 | VCCPD — Pre-driver supply |
| Pin 1100 | I/O Bank 12 — User I/O - Bank 12 |
Typical Applications
EP3SE110F1152C2 is suitable for 7 applications: ASIC Prototyping, High-Performance DSP / Wireless Baseband, Telecom Line-Card / Packet Processing, Medical Imaging (CT/MRI Reconstruction), Test and Measurement Instrumentation, Defense / Radar Signal Processing, Video Broadcast / Image Processing.
ASIC Prototyping
The EP3SE110F1152C2's 107,500 logic elements and 8,936,448 bits of TriMatrix embedded memory make it a strong fit for ASIC prototyping of mid-complexity SoCs up to several million gates. Designers map synthesized RTL (Verilog/VHDL) into the Stratix III fabric via Quartus II, then validate real-world timing, power, and software-driver behavior on real silicon before committing to ASIC tape-out. The 744 user I/Os provide sufficient breakout for prototype system peripherals (DDR2/3 controllers, Ethernet MACs, PCIe soft-cores), and the 65 nm Stratix III architecture yields timing predictability close to the target ASIC node. Compared to simulation, FPGA prototyping runs orders of magnitude faster - hours instead of weeks - and exposes board-level integration problems (signal integrity, power sequencing) before any ASIC NRE is spent.
Recommended
High-Performance DSP / Wireless Baseband
The Stratix III E family's hardened DSP blocks, combined with 107K logic elements, deliver hundreds of GMACs of 18x19-bit fixed-point multiply-accumulate throughput, suitable for wireless baseband signal processing such as LTE PHY layer, channel coding (Turbo, LDPC), and FFT/iFFT engines. The EP3SE110F1152C2's TriMatrix memory provides 8.9 Mbits of fast block RAM distributed across M9K and M144K blocks, allowing parallel radix-2/4 FFT butterflies without off-chip memory stalls. The 65 nm process supports internal clock frequencies up to 500 MHz on DSP blocks, enabling real-time processing of 20 MHz LTE channels or multi-carrier GSM/EDGE base stations. The 1152-ball FC-BGA package supports the high I/O bandwidth required for CPRI or OBSAI fronthaul links to radio units.
Recommended
Telecom Line-Card / Packet Processing
With 744 user I/Os and TriMatrix memory totaling 8.9 Mbits, the EP3SE110F1152C2 is well-suited for telecom line-card packet processing where multiple gigabit Ethernet or SONET/SDH links must be aggregated, classified, and forwarded at wire speed. Designers implement multi-queue QoS schedulers, deep packet inspection engines, and protocol adapters (Ethernet, MPLS, IPv4/v6) entirely in FPGA logic, achieving deterministic sub-microsecond latency that network processors cannot match. The Stratix III E variant chosen over Stratix III GX indicates the design uses external SERDES PHY devices rather than the FPGA's internal transceivers - common in designs where the SERDES needs to be a specific vendor or revision for interoperability. The commercial 0C-85C temperature grade suits central-office deployments.
Recommended
Medical Imaging (CT/MRI Reconstruction)
The EP3SE110F1152C2's combination of 107K logic elements, hundreds of DSP blocks, and 8.9 Mbits of block RAM enables real-time image reconstruction for CT (filtered back-projection) and MRI (Fourier-domain gridding) scanners at clinically useful frame rates. Designers implement parallel pipelines that process multiple projection angles or k-space lines simultaneously, achieving reconstruction throughput 10-100x faster than CPU-only approaches. The 1152-ball FC-BGA supports the high pin count required to interface to multi-channel analog front ends and DDR2/DDR3 image-data buffers. The 65 nm Stratix III device family offers an excellent performance-per-watt for medical imaging carts where heat dissipation is constrained, while the commercial temperature range is acceptable for controlled hospital environments.
Recommended
Test and Measurement Instrumentation
The EP3SE110F1152C2 is widely deployed in test and measurement equipment such as high-speed logic, protocol, and signal-integrity analyzers because its 107K logic elements and 744 I/Os allow simultaneous capture, real-time processing, and streaming of multi-channel high-speed data. Designers build arbitrary waveform generators, bit-error-rate testers, and protocol analyzers (PCIe, USB 3.0, SATA) that require flexible pattern generation and on-the-fly protocol decoding. The Stratix III E variant supports external PHY chips for the high-speed SERDES, allowing the test equipment vendor to choose the latest-generation PHY without FPGA silicon changes. The 8.9 Mbits of block RAM provides deep capture buffers, while Quartus II tooling supports rapid design iteration.
Recommended
Defense / Radar Signal Processing
The EP3SE110F1152C2's high logic capacity and DSP-block density make it a workhorse for defense radar and sonar front-end processing, where phased-array beamforming, pulse compression (chirp correlation), and CFAR detection must execute in real time across hundreds of channels. Designers map FFT/iFFT engines, matrix-inversion adaptive beamformers, and Doppler filter banks entirely into the Stratix III fabric, leveraging parallel DSP slices for tens of GMACs of throughput. The 744 user I/Os accommodate multi-channel ADC/DAC interfaces and high-speed links to back-end signal processors. The commercial temperature range of C2 (0C-85C) is suitable for indoor electronics bays; military deployments may require the EP3SE110F1152A2 or EP3SE110F1152I2 variant.
Recommended
Video Broadcast / Image Processing
The EP3SE110F1152C2 supports real-time processing of uncompressed 4K video streams at 60 fps thanks to its 107K logic elements and high I/O count (744 pins). Designers implement multi-channel SDI/HDMI ingest, real-time scaling, de-interlacing, color-space conversion, and overlay compositing pipelines directly in FPGA logic - tasks that would overwhelm general-purpose CPUs. The 8.9 Mbits of embedded memory serve as line buffers and chroma-key storage, while dedicated DSP blocks accelerate 2D FIR filters and motion estimation. The 1152-ball FC-BGA package supports the wide parallel buses required for 4K video pixel rates. Compared to GPU-based video pipelines, FPGA-based processing offers deterministic latency critical for broadcast on-air applications.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE110F1152C2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE110F1152C2N | EP3SE110F1152C2G | EP3SE110F1152C3 | EP3SE110F1152C4 | EP3SE110F1152I2 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) - same brand | Intel (Altera) - same brand | Intel (Altera) - same brand | Intel (Altera) - same brand | Intel (Altera) - same brand |
| Package | 1152-ball FC-BGA (F1152) | 1152-ball FC-BGA (F1152) - same | 1152-ball FC-BGA (F1152) - same | 1152-ball FC-BGA (F1152) - same | 1152-ball FC-BGA (F1152) - same | 1152-ball FC-BGA (F1152) - same |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| Embedded Memory (bits) | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C | 0C to 85C | 0C to 100C | Extended | -40C to 100C (Industrial) |
| RoHS Compliant | Variant dependent (C2G is RoHS) | Yes (Pb-free) | Yes (RoHS) | Variant dependent | Variant dependent | Variant dependent |
| Speed Grade | C2 (8 speed grade) | C2 | C2 | C3 | C4 | I2 |
| Process Node | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
Key Differentiators
- Highest logic density in Stratix III E family (vs EP3SE50 / EP3SE70 in same F1152 package)
- RoHS-compliant Pb-free ball variant available (vs EP3SE110F1152C2 (standard SnPb finish))
- Industrial temperature grade option (vs EP3SE110F1152C2 (commercial 0C-85C))
Design Notes
Estimated power analysis for a Stratix III E 110 device: at full logic activity (~70% toggle rate) and 800 MHz internal clock, core power can reach 8-12 W. The 1152-ball FC-BGA package has a typical theta_JA of approximately 12-15 C/W with proper thermal vias and heatsink, giving a junction temperature rise of 100-180C above ambient. For designs operating at >5 W sustained, attach a passive heatsink or active cooling and ensure at least 4 thermal-via arrays beneath the BGA land pattern.
The 1152-ball FC-BGA with 1.0 mm ball pitch requires a 12+ layer PCB for clean breakout routing - 4 routing layers are insufficient to escape all 1152 balls without dog-bone fanouts. Use a stack-up with symmetrical dielectric thicknesses to prevent bow during reflow. Vias-in-pad with filled and plated-over copper caps are recommended for the inner rows of balls. Maintain 50 ohm controlled impedance on all LVDS and HSTL I/O traces.
Stratix III devices require carefully sequenced power rails per Intel's Power Management Design Guide. Core VCCINT (0.9 V), analog VCCA (1.1 V), I/O VCCIO (1.5/1.8/2.5/3.3 V depending on bank), and pre-driver VCCPD (2.5/3.3 V) must ramp in a defined sequence with monotonic rise times >200 us. Recommended sequencing: VCCINT first, then VCCPD, then VCCIO, then VCCA. Use TI TPS54xxx or equivalent DC-DC converters with PGOOD signals feeding an FPGA sequencer. Add at least one 100 uF bulk + four 22 uF + twelve 0.1 uF + twelve 0.01 uF decoupling caps per power rail.
Do not omit the external configuration memory (EPCQ256 or compatible flash) - the Stratix III SRAM configuration is volatile and the FPGA will not boot without a valid bitstream. Verify JTAG chain integrity before PCB tape-out using a USB-Blaster or compatible programmer. Ensure CONFIG_DONE, nSTATUS, and nCONFIG pins have appropriate pull-ups as specified in the configuration handbook. Failing to do so results in a 'configuration error' state and full board rework.
For multi-gigabit DDR2/DDR3 memory interfaces (typical for Stratix III designs), use source-synchronous OCT (on-chip termination) and place the memory chips within 2 inches of the FPGA. Maintain matched-length traces with 50 mil tolerance within a byte lane. Use IBIS or HSPICE models from Altera/Intel to validate signal integrity before PCB fabrication - backplane designs in particular often fail on second-iteration SI without proper pre-layout simulation.
Compliance Information
RoHS and lead-free status depend on suffix: EP3SE110F1152C2 (non-RoHS), EP3SE110F1152C2G (RoHS), EP3SE110F1152C2N (Pb-free variant). All variants are REACH and conflict-minerals compliant per Intel product compliance documentation. AEC-Q100 not applicable - this is a high-density FPGA not intended for automotive safety-critical applications.
