EP3SE110F1152C3N vs EP3SE110F1152C4N Comparison
Detailed side-by-side comparison of EP3SE110F1152C3N by Intel and EP3SE110F1152C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel
EP3SE110F1152C3N β Last Time BuyIntel
EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
EP3SE110F1152C4N β Last Time BuySpecification Comparison
| Parameter | EP3SE110F1152C3N | EP3SE110F1152C4N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,560.00 | $1,395.00 |
| Family | Stratix III E | Stratix III Enhanced (E) |
| Series | Stratix III | β |
| Logic Elements (LE) | 107,500 | β |
| Logic Array Blocks (LABs) | 4,300 | 4300 |
| Total RAM Bits | 8,936,448 | β |
| User I/Os | 744 | β |
| Operating Frequency (max) | 500 MHz | β |
| Core Supply Voltage | 1.1 V nominal | β |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply range] | β |
| Process Technology | 65 nm TSMC | 65 nm |
| Package Type | FC-FBGA-1152 (flip-chip BGA) | β |
| Operating Temperature | 0 Β°C to 85 Β°C (commercial) | 0C to +85C (Commercial) |
| Speed Grade | C3 | β |
| Mounting Type | Surface Mount | Surface Mount |
| Mounting Style | SMD/SMT (Tray) | β |
| DSP Blocks | Yes (embedded multipliers) | β |
| Memory Type | M9K and M144K block RAM | β |
| External Memory Support | DDR/DDR2/DDR3 with read/write leveling | β |
| Boundary Scan | IEEE 1149.1 (JTAG) | β |
| RoHS | [DATA_NEEDED: RoHS status] | β |
| Lead-Free | Yes (per Altera/Intel datasheet family convention) | β |
| Logic Elements | β | 107,500 |
| Memory Bits | β | 8,936,448 |
| Embedded Multipliers (18x18) | β | 896 |
| User I/O Pins | β | 744 |
| Core Voltage | β | 1.1 V |
| Maximum Operating Frequency | β | 450 MHz |
| Package | β | 1152-ball FCBGA (Flip-Chip BGA) |
| Configuration Method | β | Passive Serial / Fast Passive Parallel / JTAG / AES-256 |
| RoHS Status | β | Compliant |
| MSL Level | β | 3 (168 hours) |
| Design Software | β | Quartus II (v9.1 or later) |