EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
MPN: EP3SE110F1152C4N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1595 | $159,500.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1395 | $1,395,000.00 |
EP3SE110F1152C4N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration data after manufacture. Within the broader taxonomy, FPGAs sit alongside ASICs and CPLDs as reconfigurable logic devices, but offer the highest logic density and the highest performance-per-watt ceiling in the FPGA category. The Stratix III family is positioned for memory-rich and multiplier-rich data-centric designs.
Key features of the EP3SE110F1152C4N include 107,500 logic elements, 8,936,448 memory bits, 744 user I/O pins, support for high-speed transceivers in companion family members, and best-in-class signal integrity through dynamic on-chip termination, output delay, and current strength control. The E-family variant emphasizes embedded memory and DSP blocks for DSP-intensive workloads such as wireless baseband, video processing, and high-performance computing.
The device architecture combines adaptive logic modules (ALMs), TriMatrix embedded memory (MLAB, M9K, M144K blocks), DSP blocks, and modular I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, SSTL, and PCIe. Configuration is via passive serial, fast passive parallel, or JTAG, with optional encryption using AES-256. The 65 nm process delivers a favorable performance-per-watt ratio compared to the prior 90 nm Stratix II generation.
Typical applications include high-end communications infrastructure (10G/40G Ethernet line cards, OTN framer/mapper, baseband processing), high-performance computing accelerators, ASIC prototyping, broadcast video processing, and military/aerospace signal processing. The E variant is specifically tuned for memory- and multiplier-rich DSP workloads.
Design considerations include the use of the Quartus II design software (version 9.1 or later for full Stratix III support), multi-rail power decoupling with bulk, ceramic, and high-frequency bypass capacitors, controlled-impedance PCB routing for high-speed I/O, and thermal management via the Flip-Chip BGA exposed die for heat-spreader attachment. Power estimation should use the Quartus PowerPlay Early Power Estimator before place-and-route.
This page consolidates distributor pricing, drop-in alternatives, and practical design notes not found in a single datasheet view. For full pinout, electrical characteristics, and configuration bitstream generation, consult the official Intel Stratix III Device Handbook.
Drop-in alternatives for EP3SE110F1152C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE110F1152C4N (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Family, Package, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE110F1152C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1560 / Unit
View Datasheet →EP3SE110F1152C4LN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3510 / Unit
View Datasheet →EP3SE110F1152C4L
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3372.13 / Unit
View Datasheet →EP3SE110F1152C4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2200 / Unit
View Datasheet →EP3SL110F1152C2N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3SE110F1152C3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3200 / Unit
View Datasheet →EP3SE110F1152C4N Maximum Ratings & Electrical Characteristics
| Family | Stratix III Enhanced (E) |
| Logic Elements | 107,500 |
| Memory Bits | 8,936,448 |
| Embedded Multipliers (18x18) | 896 |
| Logic Array Blocks (LABs) | 4300 |
| User I/O Pins | 744 |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| Maximum Operating Frequency | 450 MHz |
| Package | 1152-ball FCBGA (Flip-Chip BGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (Commercial) |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG / AES-256 |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
| Design Software | Quartus II (v9.1 or later) |
EP3SE110F1152C4N 1152-ball fcbga (flip-chip bga) Pin Configuration Guide
Pin configuration for EP3SE110F1152C4N (1152-ball fcbga (flip-chip bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE110F1152C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE110F1152C4N is suitable for 6 applications: 10G/40G Ethernet Line Card Processing, Wireless Baseband DSP Processing, High-Performance Computing Accelerator, Broadcast Video Processing and Format Conversion, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing.
10G/40G Ethernet Line Card Processing
The EP3SE110F1152C4N fits 10G/40G Ethernet line card designs where 107,500 logic elements provide packet-classification capacity and 896 embedded 18x18 multipliers handle packet-header checksum and IPsec acceleration. Its 8,936,448 memory bits buffer packet descriptors and queue structures, while the 744 user I/Os interface directly to SFP+ and QSFP+ PHY devices via LVDS/HSTL. The 1.1 V core and 65 nm process deliver a favorable performance-per-watt ratio for chassis-based systems with constrained airflow. Compared to a Stratix IV equivalent, the Stratix III E variant trims power by 30-40% while maintaining 450 MHz internal fabric speed, making it ideal for dense multi-port line cards.
Recommended
Wireless Baseband DSP Processing
The EP3SE110F1152C4N's 896 embedded 18x18 multipliers deliver 100s of GMACs of DSP throughput, ideal for LTE, WiMAX, and proprietary PHY-layer baseband processing in macro and small-cell base stations. The TriMatrix memory hierarchy (MLAB + M9K + M144K) provides on-chip storage for symbol buffers and FFT windows, eliminating external SRAM access for moderate FFT sizes. Quartus II's DSP Builder blocks can map FIR, FFT, and channel-correction directly onto hardware multipliers with deterministic latency. The 1152-FCBGA package enables multi-gigabit LVDS links to RF front-end ADCs/DACs while maintaining signal integrity through dynamic on-chip termination.
Recommended
High-Performance Computing Accelerator
The 107,500 logic elements of the EP3SE110F1152C4N support custom compute pipelines (FFT, encryption, compression, financial Monte Carlo) and the embedded multiplier array accelerates SIMD-style numeric workloads at FPGA clock rates up to 450 MHz. Designers commonly pair this device with a host CPU over PCIe Gen1/Gen2 hard IP blocks for co-processing offload. The 8.9 Mbit embedded memory serves as a high-bandwidth scratchpad, while the abundant I/O supports DDR2/DDR3 external memory interfaces. PowerPlay Early Power Estimator should be used pre-implementation to verify board thermal design for compute-dense workloads where fabric utilization exceeds 70%.
Recommended
Broadcast Video Processing and Format Conversion
The EP3SE110F1152C4N is well suited to broadcast-grade video processing, where 107,500 logic elements and 896 multipliers can implement multi-channel SD/HD/3G-SDI processing, de-interlacing, scaling, and color-space conversion in a single device. Its modular I/O banks natively support SDI at 270 Mb/s to 2.97 Gb/s with on-chip termination, eliminating external resistor networks. Memory bandwidth from TriMatrix buffers handles line-store and frame-store requirements for broadcast switchers. Designers targeting 4K workflows can pair two EP3SE110 devices for left/right image partition or use one as a 4K up-conversion engine.
Recommended
ASIC Prototyping and Emulation
For ASIC prototyping and in-circuit emulation, the EP3SE110F1152C4N's 107,500 logic elements partition reasonably for designs in the 1-2M ASIC-gate range, mapping ASIC cells to ALMs and using TriMatrix memory to emulate SRAM/ROM arrays. Designers can chain multiple devices via LVDS or SERDES side-band channels for higher-density ASIC emulations. Quartus II's incremental compile and LogicLock regions enable repeatable team-based verification cycles. The 1152-FCBGA package with 744 user I/Os provides ample pin capacity for full-speed ASIC I/O reproduction, including DDR3 and PCIe Gen2 interfaces.
Recommended
Military and Aerospace Signal Processing
The EP3SE110F1152C4N serves as the processing engine in military/aerospace signal-intelligence and radar systems, where 107,500 logic elements and 896 multipliers implement pulse compression, Doppler filtering, and beamforming in a single device. Its commercial 0C to +85C grade fits ground-based and avionics-grade enclosures, while the EP3SE110F1152I4N industrial variant extends coverage for outdoor or near-engine installations. The FPGA's configuration bitstream can be encrypted with AES-256 to protect proprietary waveform IP in deployed assets. The 65 nm process is qualified per MIL-STD-883 screening flows by several aerospace integrators.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE110F1152C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE110F1152C3N | EP3SE110F1152C4LN | EP3SL110F1152C2N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1152-ball FCBGA | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 |
| Speed Grade | -4 (C4) | -3 (C3) - faster | -4 (C4) - same | -2 (C2) - faster |
| Family Variant | Enhanced (E) - memory/multiplier rich | Enhanced (E) - same | Enhanced (E) - same | Logic-rich (L) - different DSP/memory mix |
| User I/O | 744 | 744 | 744 | 744 |
| Lead-Free | Yes (N suffix) | Yes (N suffix) | Yes (LN suffix) | Yes (N suffix) |
Key Differentiators
- Speed-grade C4 vs C3 (slower, lower cost) (vs EP3SE110F1152C3N)
- Same-package footprint across speed grades (vs EP3SL110F1152C2N)
- TriMatrix memory depth optimized for E variant (vs EP3SL110F1152C2N)
Design Notes
The EP3SE110F1152C4N requires multiple supply rails: 1.1 V core (VCC), 2.5 V or 3.0 V auxiliary (VCCAUX), 3.0 V I/O bank supplies (VCCIO), and a PLL analog supply. Use a PowerPlay Early Power Estimator (EPE) spreadsheet pre-place-and-route to size the regulator budget; typical quiescent consumption is 3-5 W with active designs reaching 15-25 W at high fabric utilization. Decoupling must include 100 uF bulk per rail plus 10 uF and 100 nF ceramic networks near every BGA quadrant.
The 1152-FCBGA package has an exposed die top surface designed for heat-spreader attachment (not a heatsink solder pad). Use a thermal-interface material (TIM) with conductivity >= 3 W/m-K and a copper or aluminum spreader bonded with mechanical pressure. Estimated: at 20 W dissipation, theta_JA on a JEDEC JESD51 test board is roughly 8-12 C/W, giving a 160-240 C junction rise above ambient without active cooling; heatsink or forced airflow is mandatory.
The 1.0 mm pitch 1152-ball FCBGA requires a multilayer PCB stackup with microvia (laser-drilled) or stacked-via construction to fan out the inner-row balls. Maintain 50 ohm single-ended (90 ohm differential) controlled impedance on high-speed LVDS pairs; keep length matching within 150 ps for DDR3 and 50 ps for source-synchronous interfaces. Reference the Stratix III Device Handbook pin-out file for exact ball assignments and bank-power pin locations.
Do not mix 1.5 V and 1.8 V signaling on adjacent I/O banks without reviewing the VCCIO group restrictions. Confirm JTAG chain integrity with the Quartus II programmer before soldering; the FCBGA package is non-reworkable, so first-time-right build is critical. Always configure the device's MSEL pins to match the desired configuration mode (AS, PS, FPP, JTAG) at board power-up.
Compliance Information
RoHS compliant per Intel product page; N suffix denotes lead-free. AEC-Q100 not applicable - FPGAs are not automotive-qualified unless explicitly stated. Conflict-minerals statement available from Intel.
