EP3SE110F1152C4 vs EP3SE110F1152C4N Comparison

Detailed side-by-side comparison of EP3SE110F1152C4 by Intel and EP3SE110F1152C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE110F1152C4 EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 ⚠ Last Time Buy
Intel
EP3SE110F1152C4N EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE110F1152C4 EP3SE110F1152C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $2,200.00 $1,395.00
Family Stratix III E Stratix III Enhanced (E)
Logic Elements 107,500 107,500
Embedded Memory 8,936,448 bits β€”
Maximum User I/Os 744 β€”
DSP Blocks [DATA_NEEDED: 18x18 multiplier count] β€”
Logic Array Blocks (LABs) [DATA_NEEDED: LAB count] 4300
Process Technology 65 nm 65 nm
Core Voltage 1.1 V 1.1 V
Maximum Performance 450 MHz β€”
Package Type 1152-ball FCBGA (Flip-Chip BGA) β€”
Operating Temperature Grade Commercial (C4) β€”
Configuration Memory SRAM-based (volatile) β€”
On-chip Termination Dynamic, programmable β€”
I/O Standards Supported LVDS, LVTTL, LVCMOS, HSTL, SSTL β€”
RoHS Status Compliant Compliant
Memory Bits β€” 8,936,448
Embedded Multipliers (18x18) β€” 896
User I/O Pins β€” 744
Maximum Operating Frequency β€” 450 MHz
Package β€” 1152-ball FCBGA (Flip-Chip BGA)
Mounting Type β€” Surface Mount
Operating Temperature β€” 0C to +85C (Commercial)
Configuration Method β€” Passive Serial / Fast Passive Parallel / JTAG / AES-256
MSL Level β€” 3 (168 hours)
Design Software β€” Quartus II (v9.1 or later)

Datasheets & Resources

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