EP3SE110F1152I2N vs EP3SE110F1152I4 Comparison

Detailed side-by-side comparison of EP3SE110F1152I2N by Intel and EP3SE110F1152I4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE110F1152I2N

EP3SE110F1152I2N - Stratix III E 107.5K LE FPGA | Intel / Altera

EP3SE110F1152I2N βœ“ Active

Specification Comparison

Parameter EP3SE110F1152I2N EP3SE110F1152I4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $1,480.00 $1,020.00
Series Stratix III Enhanced (EP3SE110) β€”
Family Stratix III Stratix III E
Logic Elements (LE) 107,500 107,500
Logic Array Blocks (LABs) / CLBs 4,300 β€”
System Gates 8,936,448 β€”
User I/O Pins 744 β€”
Number of Terminals 1,152 β€”
Package Code BGA (FCBGA) β€”
Package Shape Square β€”
Ball Pitch 1.00 mm β€”
Supply Voltage Range 1.05 V to 1.15 V (nominal 1.1 V) β€”
Process Technology 40 nm low-power CMOS β€”
Maximum Internal Clock Frequency 100 MHz (per distributor summary; device supports multi-Gbps transceivers) β€”
Operating Temperature -40C to +100C (industrial) -40Β°C to +100Β°C (Industrial)
Speed Grade I2 β€”
Lead-Free / RoHS Yes (suffix N) β€”
Mounting Type Surface Mount Surface Mount (BGA)
Logic Array Blocks (LABs) β€” 4300
DSP Blocks β€” 744
Embedded Memory (bits) β€” 8,936,448
User I/Os β€” 744
Package β€” 1152-ball FCBGA (Flip-Chip BGA)
Process Node β€” 40 nm
Maximum User I/O Speed β€” [DATA_NEEDED: maximum I/O toggle rate MHz]
PLLs β€” 24
Configuration Modes β€” JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), Active Serial (AS)
Memory Interface Support β€” DDR3, DDR2, QDRII+, RLDRAM II
Transceiver Protocol Support β€” PCIe Gen1/Gen2, Gbit Ethernet, XAUI, Serial RapidIO
RoHS Status β€” Compliant
Lead-Free β€” Yes
MSL Level β€” [DATA_NEEDED: MSL rating]

Datasheets & Resources

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