EP3SE110F1152I4 - Stratix III E FPGA 107K LE 1152-FCBGA | Intel
MPN: EP3SE110F1152I4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1395 | $13,950.00 |
| 100 | $1280 | $128,000.00 |
| 500 | $1150 | $575,000.00 |
| 1,000 | $1020 | $1,020,000.00 |
EP3SE110F1152I4 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built from a matrix of configurable logic blocks (CLBs), dedicated DSP slices, embedded memory blocks, and programmable I/O cells, all interconnected by a routed fabric. Within the broader integrated-circuit taxonomy, an FPGA belongs to programmable logic devices (PLDs), itself a subset of digital ICs. Stratix III E devices specifically target high-performance digital signal processing, high-throughput serial connectivity, and embedded processor subsystems where deterministic latency and parallel arithmetic matter more than the absolute logic capacity of a CPU.
Key features include 4300 Logic Array Blocks (LABs) - Mouser lists this as the LABs figure - transceivers supporting up to 600 MHz fabric performance, embedded multiplier blocks for high-speed DSP, and dedicated memory interfaces including DDR3/DDR2/QDRII+ support. The device includes 24 phase-locked loops (PLLs) and supports multiple I/O standards including LVDS, HSTL, SSTL, and PCI Express. Configuration is supported through JTAG, passive serial, fast passive parallel, and Altera-specific modes such as Active Serial (AS) using an EPCS configuration device.
Technically, the Stratix III E family improves the ratio of logic performance per watt over the prior Stratix II generation by combining a lower-power programmable logic fabric with on-chip DSP blocks and TriMatrix embedded memory that can be configured as RAM, ROM, shift registers, or FIFO buffers. The integrated transceivers support protocols such as PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and XAUI at multi-gigabit rates.
Typical applications include high-end communications infrastructure (10G/40G line cards, base-station DSP), high-performance test and measurement instrumentation, ASIC prototyping, high-throughput video processing, and embedded compute acceleration. The 1152-ball FCBGA package supports dense board designs where multi-channel I/O and memory interfaces must be routed out without compromising signal integrity.
When designing with this device, plan for substantial power-delivery and thermal management: a 107.5K-LE design typically requires a multi-layer PCB with at least 6 layers, multiple decoupling capacitors per power rail, and thermal vias beneath the FCBGA. Configuration storage should use an EPCS flash device paired with JTAG for in-system reprogrammability. Pin compatibility within the Stratix III E family allows migration between density variants on the same footprint, simplifying hardware reuse.
This page synthesizes distributor pricing, package-level drop-in alternatives within the Stratix III E family, and practical design notes that go beyond what the manufacturer datasheet alone provides - giving procurement and engineering teams a single reference for lifecycle, supply chain, and engineering decisions.
Drop-in alternatives for EP3SE110F1152I4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE110F1152I4 (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Process Technology, Family, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE110F1152I3N
✅ Drop-In✓ In Stock
$3980 / Unit
View Datasheet →EP3SE110F1152I3
✅ Drop-In✓ In Stock
$4150 / Unit
View Datasheet →EP3SE110F1152I2N
✅ Drop-In✓ In Stock
$1480 / Unit
View Datasheet →EP3SE110F1152C4N
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP3SE110F1152C4LN
✅ Drop-In✓ In Stock
$3510 / Unit
View Datasheet →EP3SE110F1152C3N
✅ Drop-In✓ In Stock
$1560 / Unit
View Datasheet →EP3SE110F1152C2N
✅ Drop-In✓ In Stock
$1925 / Unit
View Datasheet →EP3SE110F1152I4 Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements (LE) | 107,500 |
| Logic Array Blocks (LABs) | 4300 |
| DSP Blocks | 744 |
| Embedded Memory (bits) | 8,936,448 |
| User I/Os | 744 |
| Package | 1152-ball FCBGA (Flip-Chip BGA) |
| Operating Temperature | -40°C to +100°C (Industrial) |
| Process Node | 40 nm |
| PLLs | 24 |
| Configuration Modes | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), Active Serial (AS) |
| Memory Interface Support | DDR3, DDR2, QDRII+, RLDRAM II |
| Transceiver Protocol Support | PCIe Gen1/Gen2, Gbit Ethernet, XAUI, Serial RapidIO |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Mounting Type | Surface Mount (BGA) |
EP3SE110F1152I4 1152-ball fcbga (flip-chip bga) Pin Configuration Guide
Pin configuration for EP3SE110F1152I4 (1152-ball fcbga (flip-chip bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE110F1152I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE110F1152I4 is suitable for 7 applications: 10G/40G Communications Line Cards, High-Performance DSP / Baseband Processing, ASIC Prototyping and Emulation, Test and Measurement Instrumentation, High-Throughput Video Processing / Broadcast, Industrial Automation and Control, Aerospace / Defense Signal Processing.
10G/40G Communications Line Cards
The EP3SE110F1152I4 is well-suited for 10G/40G optical line-card designs where its 107,500 logic elements and 744 DSP blocks deliver the parallel arithmetic needed for forward-error-correction, packet classification, and traffic-management pipelines. Its integrated transceivers support PCI Express Gen2, XAUI, Serial RapidIO, and Gbit Ethernet at multi-gigabit rates, eliminating external PHY chips on multi-protocol cards. With 8,936,448 embedded memory bits, packet buffers and lookup tables stay on-die, reducing external memory accesses that bottleneck throughput. Quartus II's TimeQuest timing analyzer and 24 on-chip PLLs close timing on multi-channel SerDes lanes, and 744 user I/Os provide abundant LVDS pairs for backplane interconnect without external bus switches.
Recommended
High-Performance DSP / Baseband Processing
The 744 dedicated DSP blocks on the EP3SE110F1152I4 make it a strong fit for wireless baseband, radar, and software-defined-radio baseband processing. Each DSP block supports 18x18 multiplication with add-and-accumulate, so designers can implement hundreds of complex FFT butterflies or finite-impulse-response filter taps without consuming logic-element fabric. The 8,936,448-bit embedded memory serves as coefficient and sample storage, and 24 PLLs generate the multiple clock domains needed for ADC/DAC interface and packet-processing subsystems. Industrial -40°C to +100°C operation supports outdoor base-station environments, and the 1152-ball FCBGA exposes enough I/O for parallel LVDS ADC/DAC interfaces.
Recommended
ASIC Prototyping and Emulation
With 107,500 logic elements and 8.9 Mbits of embedded memory, the EP3SE110F1152I4 accommodates mid-complexity ASIC RTL for functional verification and software development. Quartus II synthesis supports incremental compilation, allowing design teams to partition large RTL into the device's logic regions and preserve compile times across iterations. The 1152-ball FCBGA exposes 744 user I/Os, giving ASIC emulation boards abundant connectivity to DUT peripherals. Industrial temperature grade supports emulation of automotive and industrial ASICs without thermal derating. Designers should use TimeQuest SDC constraints to drive timing closure and use SignalTap II logic analyzer for runtime visibility into DUT behavior.
Recommended
Test and Measurement Instrumentation
The EP3SE110F1152I4 fits mid-range test and measurement equipment such as protocol analyzers, arbitrary waveform generators, and logic-analyzer capture engines. Its 744 DSP blocks accelerate real-time FFT, FIR filtering, and correlation on digitizer streams, while 8,936,448 embedded memory bits hold deep capture buffers in on-chip RAM. Transceivers support PCI Express Gen2 host interface for sustained stream transfer to host CPUs, and 744 user I/Os provide ample LVDS connectivity to high-speed ADC front ends. Industrial temperature range ensures instrument operation in lab and field environments, while the 40nm process keeps static power low enough for fan-cooled benchtop enclosures.
Recommended
High-Throughput Video Processing / Broadcast
The EP3SE110F1152I4 supports broadcast video processing where its 744 DSP blocks accelerate motion-compensated temporal filtering, de-interlacing, and color-space conversion on uncompressed SDI streams. Its 107,500 logic elements host large multi-tap polyphase scalers, while 8,936,448 embedded memory bits provide line and frame buffers to bridge between input and output rates. Transceivers carry SDI, HDMI, and DisplayPort signals at multi-gigabit rates, and 744 user I/Os allow direct connection to multiple parallel video buses. The 1152-ball FCBGA exposes enough high-speed pairs for 4K/UHD routing at production-frame rates without external muxes.
Recommended
Industrial Automation and Control
For industrial motion controllers and machine-vision platforms, the EP3SE110F1152I4 offers 744 DSP blocks for closed-loop control loops, 107,500 logic elements for EtherCAT or PROFINET protocol stacks, and 8,936,448 embedded memory bits for command queues. Industrial -40°C to +100°C operation supports cabinet-free deployment near motors and process equipment. The 1152-ball FCBGA provides 744 user I/Os to connect to multi-axis encoder inputs, ADC feedback, and high-speed Ethernet PHYs without external bus-expanders. Configuration via Active Serial using an EPCS flash device enables field firmware updates, while JTAG provides in-system debug access during commissioning.
Recommended
Aerospace / Defense Signal Processing
The EP3SE110F1152I4's industrial temperature range and high DSP count make it suitable for non-space aerospace and defense applications such as radar preprocessing, electronic-warfare subsystems, and avionics data concentrators. Its 744 DSP blocks deliver the throughput needed for pulse-Doppler processing and channelized receiver banks, while 8,936,448 embedded memory bits hold beam-forming coefficients and detection tables. The 1152-ball FCBGA package supports dense board layouts common in size-constrained avionics bays. Designers should follow DO-254 design-assurance guidance and use Quartus II's design-partition features to isolate DO-254-critical RTL blocks for verification evidence.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE110F1152I4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE110F1152I3N | EP3SE110F1152I3 | EP3SE110F1152I2N | EP3SE110F1152C4N | EP3SE110F1152C4LN | EP3SE110F1152C3N | EP3SE110F1152C2N |
|---|---|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (F1152) | 1152-ball FCBGA (F1152) - same | 1152-ball FCBGA (F1152) - same | 1152-ball FCBGA (F1152) - same | 1152-ball FCBGA (F1152) - same | 1152-ball FCBGA (F1152) - same | 1152-ball FCBGA (F1152) - same | 1152-ball FCBGA (F1152) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LE) | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| DSP Blocks | 744 | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Embedded Memory (bits) | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 |
| User I/Os | 744 | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Temperature Grade | Industrial (-40°C to +100°C) | Industrial | Industrial | Industrial | Commercial (0°C to +85°C) | Commercial (0°C to +85°C) | Commercial (0°C to +85°C) | Commercial (0°C to +85°C) |
| Speed Grade | I4 (fastest industrial) | I3 (slower industrial) | I3 (slower industrial) | I2 (slowest industrial) | C4 (fastest commercial) | C4 (fastest commercial) | C3 (mid commercial) | C2 (slowest commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest Stratix III E density in the 1152-FCBGA package (vs EP3SL110F1152I4 (Stratix III L variant))
- Industrial temperature range at fastest I4 speed grade (vs EP3SE110F1152C4N)
- Pin-compatible migration path within the F1152 package family (vs EP3C80F780I7 (Cyclone III, 780-pin package))
Design Notes
Estimated: at 40nm process and 107.5K LE utilization near 70%, the EP3SE110F1152I4 typically dissipates 8-14W. The 1152-ball FCBGA exposes a large thermal pad beneath the package; populate all thermal balls with thermal vias to inner copper planes and ensure at least 4 inner solid ground/power planes for heat spreading. For enclosed chassis designs, attach a heatsink with thermal interface material rated for the -40°C to +100°C industrial range, or use forced-air cooling. Confirm junction temperature in the Quartus II PowerPlay early-estimate flow.
The 1152-ball FCBGA at 1.0 mm pitch requires a high-layer-count PCB (typically 8-12 layers) with microvia or stacked-via construction to fan out the BGA escape. Use 50-ohm controlled-impedance routing for high-speed transceiver channels; reference the Stratix III Device Handbook pin-connection guidelines for per-ball signal-integrity requirements. Place decoupling capacitors on the bottom side of the BGA, with 0402 or 0201 footprints sized for the available escape channels. Keep differential-pair lengths matched within the timing budget specified for the I/O standard used (LVDS, HSTL, SSTL).
Do not confuse the EP3SE110F1152I4 speed-grade suffix with the package suffix - 'F1152' identifies the 1152-ball FCBGA while 'I4' identifies the industrial-temperature speed bin. Configuration mode selection (AS, PS, FPP, JTAG) must match the EPCS flash device or processor host interface - mismatched configuration modes cause configuration failures. Always validate the design's Quartus II fitter pin assignments against the pin-connection guidelines before tape-out, especially for transceiver reference-clock pins that have strict placement rules.
Stratix III E transceivers require clean analog supplies - isolate PLL analog VCC and XCVR VCC from digital VCC with ferrite beads or pi filters, and provide dedicated decoupling at each transceiver channel group. Reference-clock routing to REFCLK inputs must be length-matched and impedance-controlled; any stubs degrade jitter performance. For DDR3/QDRII+ memory interfaces, follow the Stratix III External Memory Interface Handbook for DQ/DQS byte-lane swapping rules - violating these can cause setup/hold failures invisible to TimeQuest static timing analysis.
Multi-gigabit transceivers on the EP3SE110F1152I4 (PCIe Gen2 at 5 Gbps, XAUI at 3.125 Gbps) require the PCB stackup to deliver better than -25 dB insertion loss and controlled return loss on each channel. Use IBIS-AMI models from Intel/Altera for channel simulation before fabrication - transmitter de-emphasis and receiver equalization settings must be tuned per board. Series coupling capacitors on transceiver channels should be 0402 size with 0.1uF NPO/C0G dielectric; AVX or Murata parts rated for 6 GHz or higher are typical choices.
Compliance Information
RoHS and lead-free per Intel/Altera Stratix III product documentation. Not AEC-Q100 qualified as an FPGA - AEC-Q100 applies to simple ICs, not programmable logic. Halogen-free status not confirmed in available data.
