EP3SE110F1152I4 vs EP3SE110F1152C3N Comparison

Detailed side-by-side comparison of EP3SE110F1152I4 by Intel and EP3SE110F1152C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE110F1152I4 EP3SE110F1152C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $1,020.00 $1,560.00
Family Stratix III E Stratix III E
Logic Elements (LE) 107,500 107,500
Logic Array Blocks (LABs) 4300 4,300
DSP Blocks 744 Yes (embedded multipliers)
Embedded Memory (bits) 8,936,448 β€”
User I/Os 744 744
Package 1152-ball FCBGA (Flip-Chip BGA) β€”
Operating Temperature -40Β°C to +100Β°C (Industrial) 0 Β°C to 85 Β°C (commercial)
Process Node 40 nm β€”
Maximum User I/O Speed [DATA_NEEDED: maximum I/O toggle rate MHz] β€”
PLLs 24 β€”
Configuration Modes JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), Active Serial (AS) β€”
Memory Interface Support DDR3, DDR2, QDRII+, RLDRAM II β€”
Transceiver Protocol Support PCIe Gen1/Gen2, Gbit Ethernet, XAUI, Serial RapidIO β€”
RoHS Status Compliant β€”
Lead-Free Yes Yes (per Altera/Intel datasheet family convention)
Mounting Type Surface Mount (BGA) Surface Mount
MSL Level [DATA_NEEDED: MSL rating] β€”
Series β€” Stratix III
Total RAM Bits β€” 8,936,448
Operating Frequency (max) β€” 500 MHz
Core Supply Voltage β€” 1.1 V nominal
I/O Supply Voltage β€” [DATA_NEEDED: I/O supply range]
Process Technology β€” 65 nm TSMC
Package Type β€” FC-FBGA-1152 (flip-chip BGA)
Speed Grade β€” C3
Mounting Style β€” SMD/SMT (Tray)
Memory Type β€” M9K and M144K block RAM
External Memory Support β€” DDR/DDR2/DDR3 with read/write leveling
Boundary Scan β€” IEEE 1149.1 (JTAG)
RoHS β€” [DATA_NEEDED: RoHS status]

Datasheets & Resources

Browse All Products Create BOM Request Quote