EP3SE110F780C3 vs EP3CLS100F780C8N Comparison

Detailed side-by-side comparison of EP3SE110F780C3 by Intel and EP3CLS100F780C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE110F780C3 EP3SE110F780C3 - Stratix III E FPGA 107.5K LE 780-FCBGA | Intel

EP3SE110F780C3 - Stratix III E FPGA 107.5K LE 780-FCBGA | Intel

EP3SE110F780C3 ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE110F780C3 EP3CLS100F780C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Active
Stock Status In Stock In Stock
Unit Price (USD) $220.00 $105.80
Series Stratix III E β€”
Logic Elements 107500 β€”
Logic Array Blocks (LABs) 4300 β€”
Total Memory Bits 8936448 4,451,328
User I/O Count 488 β€”
Package 780-BBGA, FCBGA 780-ball FBGA (FineLine BGA)
Number of Terminals 780 β€”
Package Code BGA β€”
Package Shape Square β€”
Form of Terminal Ball β€”
Temperature Grade Other (Commercial) β€”
Speed Grade C3 β€”
Mounting Type Surface Mount Surface Mount (BGA)
RoHS Status [DATA_NEEDED: RoHS status] Compliant
Operating Temperature [DATA_NEEDED: operating temperature range] β€”
Device Family β€” Cyclone III LS
Logic Elements (LE) β€” 100,448
Embedded Memory Blocks β€” M9K + M144K
Logic Array Blocks (LAB) β€” 6,278
Number of PLLs β€” 4
Maximum User I/O β€” 429
Core Supply Voltage (VCCINT) β€” 1.2 V
Analog Supply (VCCA) β€” 2.5 V
Process Technology β€” 65 nm low-power CMOS
Maximum Embedded Multipliers (18x18) β€” 244
Package Dimensions β€” 29 mm x 29 mm, 1.0 mm ball pitch
Operating Temperature (Commercial) β€” 0C to +85C
Configuration Schemes β€” AS, PS, PP, JTAG
Lead-Free β€” Yes

Datasheets & Resources

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