EP3CLS100F780C8N - Cyclone III LS FPGA 100K LE 780-FBGA | Intel
MPN: EP3CLS100F780C8N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $142.5 | $142.50 |
| 10 | $132.75 | $1,327.50 |
| 100 | $121.4 | $12,140.00 |
| 250 | $113.2 | $28,300.00 |
| 500 | $105.8 | $52,900.00 |
EP3CLS100F780C8N Overview
A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture consists of an array of configurable logic blocks (LABs/CLBs), programmable interconnect, embedded memory blocks, DSP blocks, and I/O cells - all under software configuration. In the system hierarchy, the FPGA sits between general-purpose microcontrollers and fixed-function ASICs: it offers ASIC-level integration but with field-reconfigurable logic and shorter development cycles. The Cyclone III LS family extends this role into applications requiring low power and enhanced security features for communications, industrial, and automotive systems.
Key features include 4,451,328 bits of embedded RAM, 244 dedicated 18x18 multipliers, 8 transceiver channels, JTAG-based configuration, and support for passive serial (PS), passive parallel (PP), and Active Serial (AS) configuration schemes. The device supports a maximum user I/O count of 429 and a maximum differential I/O pair count specified for the 780-FBGA pinout, with LVDS, LVCMOS, SSTL, and HSTL I/O standards.
The Cyclone III LS architecture uses 65 nm CMOS technology with a 1.2 V core voltage, achieving significant static power reduction compared with the original Cyclone III. Each LAB contains 16 logic elements (LEs), each LE holding a 4-input look-up table (LUT), a programmable register, and carry chain logic for efficient arithmetic. The embedded memory is organized into M9K (9 Kbit) and M144K (144 Kbit) blocks, while dedicated 18x18 multipliers accelerate DSP workloads such as FIR filters and FFT butterflies without consuming logic resources.
Typical applications include industrial control and motor drive, video surveillance and image processing, automotive driver assistance, portable instrumentation, and consumer electronics requiring mid-range logic density. The 780-FBGA package enables high I/O count designs while the low-power process makes it suitable for thermally constrained enclosures. Designers should plan power sequencing across VCCINT (1.2 V), VCCA (2.5 V), and VCCD_PLL rails, and use Altera/Intel Quartus II software for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone III LS family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3CLS100F780C8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS100F780C8N (same form factor and footprint) β differing in Package, Process Technology, Speed Grade, Logic Elements, Embedded Memory Bits.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3CLS100F780C8
β Drop-Inβ In Stock
$65 / Unit
View Datasheet βEP3CLS100F780C7N
β Drop-Inβ In Stock
$298.75 / Unit
View Datasheet βEP3CLS100F780C7
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$632.4 / Unit
View Datasheet βEP3C120F780C8N
β Drop-Inβ In Stock
Contact for price
View Datasheet βEP3C80F780C8N
β Drop-Inβ In Stock
$240.2 / Unit
View Datasheet βEP3C55F780C8N
β Drop-Inβ In Stock
$58.2 / Unit
View Datasheet βEP3CLS100F780C8N Maximum Ratings & Electrical Characteristics
| Device Family | Cyclone III LS |
| Logic Elements (LE) | 100,448 |
| Total Memory Bits | 4,451,328 |
| Embedded Memory Blocks | M9K + M144K |
| Logic Array Blocks (LAB) | 6,278 |
| Number of PLLs | 4 |
| Maximum User I/O | 429 |
| Core Supply Voltage (VCCINT) | 1.2 V |
| Analog Supply (VCCA) | 2.5 V |
| Process Technology | 65 nm low-power CMOS |
| Maximum Embedded Multipliers (18x18) | 244 |
| Package | 780-ball FBGA (FineLine BGA) |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm ball pitch |
| Operating Temperature (Commercial) | 0C to +85C |
| Mounting Type | Surface Mount (BGA) |
| Configuration Schemes | AS, PS, PP, JTAG |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP3CLS100F780C8N 29 mm x 29 mm, 1.0 mm ball pitch Pin Configuration Guide
Pin configuration for EP3CLS100F780C8N (29 mm x 29 mm, 1.0 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS100F780C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS100F780C8N is suitable for 7 applications: Industrial Motor Control, Video Surveillance / Image Processing, Automotive Driver Assistance (Legacy / Infotainment), Portable Test & Measurement Instrumentation, Telecommunications / Network Bridging, Medical Imaging and Patient Monitoring, Consumer Display Controllers.
Industrial Motor Control
The EP3CLS100F780C8N's 100,448 LEs and 244 hardware 18x18 multipliers make it well suited for industrial motor control loops including field-oriented control (FOC) for three-phase AC induction and PMSM motors. The 4 PLLs generate the high-resolution PWM carriers and quadrature decoder clocks needed for encoder feedback. With 429 user I/O pins in the 780-FBGA, the device can interface directly to multi-axis servo drivers, ADC sample clocks, and isolated gate-driver signals. The Cyclone III LS family's low static power reduces thermal load in enclosed industrial cabinets. Designers commonly pair the FPGA with the EPCS16 configuration device and external AD7266 or ADS8363 current-sense ADCs for high-bandwidth torque control loops.
Recommended
Video Surveillance / Image Processing
With 4,451,328 bits of embedded memory and 244 dedicated 18x18 multipliers, the EP3CLS100F780C8N handles real-time video pipelines including Sobel edge detection, motion estimation, and H.264 preprocessing in mid-resolution surveillance cameras. The M9K memory blocks store line buffers while the M144K blocks hold larger frame references. The 65 nm low-power process keeps thermal dissipation low enough for sealed outdoor IP67 camera housings. The 780-FBGA exposes sufficient LVDS pairs for direct connection to CMOS image sensors and HDMI/DVI output. Quartus II's VIP (Video and Image Processing) suite provides optimized IP cores for color space conversion and 2D filter primitives.
Recommended
Automotive Driver Assistance (Legacy / Infotainment)
The Cyclone III LS family with AES bitstream encryption and hardware tamper detection makes the EP3CLS100F780C8N suitable for legacy automotive infotainment, rear-view camera overlays, and driver assistance signal preprocessing. Designers must select the industrial temperature variant (suffix I7 or A7) for -40C to +100C or -40C to +125C operation; the C8 commercial grade is limited to 0C to +85C. The 100K LEs support surround-view stitching, lane-departure warning image processing, and parking-sensor fusion. The low-power 65 nm process suits the constrained thermal envelope of dashboard head units.
Recommended
Portable Test & Measurement Instrumentation
The EP3CLS100F780C8N's 100K LEs, 4 PLLs, and 429 I/O pins enable portable test instruments such as handheld logic analyzers, bench-top oscilloscopes, and protocol analyzers. The embedded multipliers accelerate FFT-based spectrum analysis and digital filter operations, while the abundant M9K blocks buffer acquisition samples. The Cyclone III LS family's low static power extends battery runtime in field-portable designs. JTAG-based debug plus on-chip SignalTap II logic analyzer reduces the need for external test equipment during firmware bring-up.
Recommended
Telecommunications / Network Bridging
In legacy telecom and industrial network bridging applications, the EP3CLS100F780C8N provides 100K LEs to implement protocol converters, packet processors, and TDM-over-IP bridges. The 244 hardware multipliers accelerate CRC computation, Reed-Solomon FEC, and AES-128/256 encryption for secure tunnels. The 4 PLLs generate multiple clock domains needed for E1/T1, I2S, and SPI interfaces simultaneously. The 780-FBGA exposes enough LVDS pairs for direct connection to network PHY devices and backplane SERDES interfaces at speeds up to 875 Mbps per LVDS channel.
Recommended
Medical Imaging and Patient Monitoring
Medical imaging subsystems such as ultrasound beamformers and patient-side monitoring front-ends leverage the EP3CLS100F780C8N's 100K LEs, 244 multipliers, and 4 PLLs. The Cyclone III LS AES bitstream encryption protects proprietary imaging algorithms from cloning. Designers commonly use the embedded M9K memory blocks as channel sum-and-delay buffers for phased-array ultrasound, while the 18x18 multipliers handle the I/Q demodulation and Hilbert transform computations. Hardware tamper detection features (LS family) support FDA cybersecurity guidance for medical device firmware protection.
Recommended
Consumer Display Controllers
Consumer digital signage, kiosk controllers, and digital photo frame mainboards use the EP3CLS100F780C8N to drive multiple LCD panels with on-the-fly image rotation, alpha blending, and color correction. The 100K LEs support dual-output display pipelines at WXGA resolution while leaving logic headroom for capacitive touch processing. The M144K memory blocks hold pre-processed frame buffers, and the 4 PLLs synthesize the pixel clocks for LVDS panels. The 65 nm low-power process allows fan-less operation in slim consumer enclosures.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS100F780C8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS100F780C8 | EP3CLS100F780C7N | EP3C120F780C8N | EP3C80F780C8N | EP3C55F780C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 100,448 | 100,448 | 100,448 | 119,088 (+19%) | 81,264 (-19%) | 55,856 (-44%) |
| Embedded Memory (bits) | 4,451,328 | 4,451,328 | 4,451,328 | 3,981,312 | 2,810,880 | 2,396,160 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Speed Grade | C8 (commercial, -8) | C8 | C7 (faster) | C8 | C8 | C8 |
| Security (AES bitstream encryption) | Yes (LS family) | Yes | Yes | No (Cyclone III) | No (Cyclone III) | No (Cyclone III) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Unit Price (qty 1, USD) | 142.50 | 135.20 | 165.80 | 155.40 | 118.30 | 92.50 |
Key Differentiators
- Cyclone III LS hardware AES-128 bitstream encryption with tamper detection (vs EP3C120F780C8N (standard Cyclone III))
- Higher memory density per logic element (vs EP3C80F780C8N (80K LE Cyclone III))
- Drop-in compatibility with C7 speed grade for higher Fmax paths (vs EP3CLS100F780C7N (C7 speed grade))
Design Notes
Power sequencing is mandatory for the EP3CLS100F780C8N. VCCINT (1.2 V core), VCCA (2.5 V analog), and VCCIO (per-bank 1.2/1.5/1.8/2.5/3.3 V) must ramp monotonically per the Cyclone III Device Handbook. A typical sequencing IC such as the LTC3566 or LM3880 enforces the correct order and prevents latch-up during partial-ramp conditions. Decouple each VCCINT pin with a 0.1 uF X7R plus 10 uF bulk capacitor placed within 5 mm of the ball.
The 780-FBGA at 1.0 mm pitch requires 4+ layer PCB with microvia stack-up. Use 0.5 oz copper outer layers with 1.0 oz inner power/ground planes. Escape routing must use dog-bone fanout or via-in-pad depending on BGA size. Pair each VCCIO bank with a low-impedance ground return path; do not share ground vias between high-speed LVDS pairs and PLL supplies. JTAG signals TCK, TMS, TDI, TDO should be length-matched to within 1 cm if running above 10 MHz.
Estimated: At typical industrial utilization (~60% LEs, 50% toggle rate, 100 MHz), the EP3CLS100F780C8N dissipates approximately 1.2 to 1.8 W from VCCINT. The 780-FBGA's theta_JA is roughly 12 C/W with 4-layer JEDEC test PCB, giving a junction rise of ~15-22 C above ambient. Forced airflow is recommended in sealed enclosures. Thermal vias under the BGA's center ground balls provide additional heat spreading to inner ground planes.
Do not confuse the C8 speed grade (commercial, -8 timing model) with the I7 industrial or A7 automotive temperature grade. Commercial C8 is specified 0C to +85C only. Also, the N suffix indicates lead-free / RoHS, while non-N variants may use SnPb balls - verify your assembly process compatibility. When migrating from Cyclone III (non-LS) to Cyclone III LS, the AES encryption bitstream option must be selected in Quartus II Device Options or the device will reject the bitstream silently.
Compliance Information
RoHS and lead-free per the N suffix in MPN. Commercial temperature grade (0C to +85C); not AEC-Q100 qualified - choose I7 or A7 speed grade for industrial/automotive. Cyclone III LS family adds hardware AES bitstream encryption for IP protection.
