EP3SE110F780C3N vs EP3SE110F780C4 Comparison
Detailed side-by-side comparison of EP3SE110F780C3N by Intel and EP3SE110F780C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE110F780C3N | EP3SE110F780C4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,245.00 | $2,380.00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LEs) | 107,500 | β |
| Embedded Memory Bits | 8,936,448 | β |
| Logic Array Blocks (LABs) | 4,300 | 4,300 |
| User I/Os | 488 | β |
| Package | 780-ball FCBGA (Flip-Chip BGA) | 780-ball FCBGA (FineLine BGA) |
| Core Voltage | 1.1 V | β |
| Process Technology | 65 nm | β |
| Maximum Operating Frequency | 500 MHz | β |
| DSP Blocks | Yes (integrated, count varies by configuration) | β |
| Transceiver Channels | 8 (multi-gigabit) | β |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | 8,936,448 bits (8.9 Mbit) |
| Configuration Method | Serial / Parallel via Quartus II | β |
| Operating Temperature Grade | Commercial (C suffix) | β |
| RoHS Status | Compliant | Compliant |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL rating] | β |
| Logic Elements | β | 107,500 |
| DSP Blocks (18x18 Multipliers) | β | 896 |
| Maximum User I/O | β | 488 |
| Speed Grade | β | C4 |
| Process Node | β | 40 nm |
| Transceiver Data Rate | β | Up to 1.6 Gbps |
| Memory Interface Support | β | DDR3 up to 800 MHz |
| Operating Temperature | β | Commercial (0C to +85C) |
| Configuration | β | Partial Reconfiguration support |