EP3SE110F780C3N - Stratix III E FPGA 107K LE FCBGA-780 | Intel
MPN: EP3SE110F780C3N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1395 | $697,500.00 |
| 1,000 | $1245 | $1,245,000.00 |
EP3SE110F780C3N Overview
What is an FPGA? A field-programmable gate array is a reconfigurable semiconductor device built from an array of programmable logic blocks, embedded memory, DSP slices, and high-speed serial transceivers all interconnected by a programmable routing fabric. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), then to logic ICs, then to integrated circuits and finally to semiconductors. The Stratix III E family in particular is positioned by Intel as a high-performance, logic-rich tier intended for ASIC prototyping, telecom/datacom infrastructure, and digital signal processing where high logic density and embedded transceiver bandwidth must coexist.
Key features include 107,500 logic elements (LEs), 8,936,448 embedded RAM bits, 488 user I/O pins, 8 full-duplex transceiver channels supporting multi-gigabit serial interfaces, and integrated DSP blocks. The 780-ball FCBGA package provides a high pin-count platform suitable for memory-rich and transceiver-heavy designs, while the 65 nm low-k process enables high core frequencies with reduced dynamic power versus the prior Stratix II generation.
The EP3SE110F780C3N uses a logic-rich architecture built around 4- and 6-input adaptive look-up tables (ALUTs), TriMatrix embedded memory blocks (MLABs, M9K, and M144K), and DSP blocks that can be configured as multipliers, multiply-accumulate units, or finite-impulse-response filters. The device also includes a dedicated PCML transceiver block supporting backplane and chip-to-chip serial links, a configuration controller, and clock-management tiles with PLL and dynamically reconfigable phase shift. These features combine to deliver ASIC-class compute density while retaining the in-system reprogrammability of an FPGA.
Typical applications include ASIC prototyping and emulation, high-end wired communication systems (10G/40G Ethernet, SONET/SDH, PCIe Gen2), wireless baseband processing, military and aerospace signal processing, broadcast video processing, and high-performance DSP firmware acceleration. The 780-ball FCBGA package is intended for multilayer PCB designs with controlled-impedance routing for the transceiver channels.
When designing with this device, plan PCB stackup and power-delivery network (PDN) for the 1.1 V core and the transceiver PLL supplies in parallel - the FCBGA requires a high-layer-count board to escape the 780 balls cleanly. Use the Intel Quartus II design suite (or later) to evaluate logic utilization, transceiver channel placement, and timing closure before committing to layout.
This page synthesizes distributor pricing, FPGA-stratix drop-in alternatives from the same package family, and practical design notes that go beyond the manufacturer datasheet to support an engineer's evaluation of the EP3SE110F780C3N.
Drop-in alternatives for EP3SE110F780C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE110F780C3N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Embedded Memory, Family.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SE110F780C3
β Drop-Inβ In Stock
$220 / Unit
View Datasheet βEP3SE110F780C2N
β Drop-Inβ In Stock
$305 / Unit
View Datasheet βEP3SE110F780C2
β Drop-Inβ In Stock
$4350 / Unit
View Datasheet βEP3SL110F780C3N
β Drop-Inπ Reference alternative (not in catalog)
EP3SE110F780C3N Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements (LEs) | 107,500 |
| Embedded Memory Bits | 8,936,448 |
| Logic Array Blocks (LABs) | 4,300 |
| User I/Os | 488 |
| Package | 780-ball FCBGA (Flip-Chip BGA) |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| Maximum Operating Frequency | 500 MHz |
| DSP Blocks | Yes (integrated, count varies by configuration) |
| Transceiver Channels | 8 (multi-gigabit) |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) |
| Configuration Method | Serial / Parallel via Quartus II |
| Operating Temperature Grade | Commercial (C suffix) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
EP3SE110F780C3N Pin Configuration
| Pin A1 | I/O β User I/O ball (bank-specific function) |
| Pin A20 | I/O β User I/O ball |
| Pin B5 | VCC β Core supply |
| Pin AE12 | GND β Ground ball |
| Pin T17 | REFCLK β Transceiver reference clock input |
Typical Applications
EP3SE110F780C3N is suitable for 6 applications: ASIC Prototyping and Emulation, Wired Telecom and Datacom Line Cards, Wireless Baseband and DSP Acceleration, Broadcast and Video Processing, High-Performance Test and Measurement Instrumentation, Military and Aerospace Signal Processing.
ASIC Prototyping and Emulation
The EP3SE110F780C3N's 107,500 logic elements and 8,936,448 embedded memory bits deliver ASIC-class compute density that lets design teams emulate large SoC blocks before tape-out. Multipliers and DSP blocks accelerate arithmetic functions, and Quartus II synthesis supports fast incremental compile flows. The 488 I/Os expose enough pins to drive prototype daughter boards, while the 780-ball FCBGA package supports high-bandwidth prototyping of processor subsystems, bus fabrics, and custom peripherals.
Recommended
Wired Telecom and Datacom Line Cards
The EP3SE110F780C3N integrates 8 multi-gigabit transceiver channels and 107,500 LEs, enabling 10G Ethernet MACs, OTN framer/mapper, and SONET/SDH overhead processing on a single device. Designers can place PCIe Gen2 root-complex or endpoint controllers in the soft logic, while dedicated on-chip RAM buffers traffic between the network and host. The 488 user I/Os support parallel connections to external PHY devices, packet processors, and backplane interconnect ASICs.
Recommended
Wireless Baseband and DSP Acceleration
Wireless baseband processing demands high multiply-accumulate throughput, and the EP3SE110F780C3N delivers exactly that via integrated DSP blocks alongside 8,936,448 embedded memory bits for storing taps and intermediate samples. The device supports LTE, WiMAX and proprietary PHY implementations, with the 488 I/Os handling RFIC data interfaces, ADC/DAC interconnects, and backhaul Ethernet. Quartus II DSP Builder provides model-based design flows for rapid FFT and channel-codec deployment.
Recommended
Broadcast and Video Processing
Broadcast video systems benefit from the EP3SE110F780C3N's high logic density for multi-stream SD/HD/3G-SDI processing, color-space conversion, and overlay composition. The embedded TriMatrix memory stores multiple frames of active video at 1080p60, and the integrated transceivers provide SDI-compatible serial I/O. Designers can run scaling, de-interlacing and compression engines in parallel, leveraging the 488 I/Os to interface to HDMI receivers, video DACs and display controllers.
Recommended
High-Performance Test and Measurement Instrumentation
Test and measurement platforms use the EP3SE110F780C3N for real-time DSP in oscilloscopes, protocol analyzers and arbitrary waveform generators. The 500 MHz logic fabric delivers deterministic DSP throughput for FFT, decimation and trigger logic, and the 8 transceivers provide high-speed serial stimulus/response lanes for protocols such as PCIe, USB 3.0 and 10G Ethernet. The 780-ball FCBGA supports dense front-end analog-to-digital interfacing on the same board.
Recommended
Military and Aerospace Signal Processing
Avionics, radar and electronic-warfare subsystems rely on the EP3SE110F780C3N's logic density for beamforming, channelization and FFT processing under demanding throughput budgets. The 488 I/Os connect to ruggedized ADC/DAC stacks, and Quartus II supports design flows that target Mil-STD-704 and DO-254 processes. Designers can leverage the integrated TriMatrix memory for windowing, overlap-save buffers and pulse compression while maintaining deterministic latency required by radar timelines.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE110F780C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE110F780C3 | EP3SE110F780C2N | EP3SE110F780C2 | EP3SL110F780C3N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FCBGA | 780-ball FCBGA | 780-ball FCBGA | 780-ball FCBGA | 780-ball FCBGA |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| Embedded Memory Bits | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 |
| User I/Os | 488 | 488 | 488 | 488 | 488 |
| Transceiver Channels | 8 | 8 | 8 | 8 | 8 |
| Speed Grade | C3 (fastest commercial) | C3 | C2 | C2 | C3 (L family, lower Fmax) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
Key Differentiators
- High logic density in a single 780-ball FCBGA package (vs EP3SE110F780C2N)
- Highest speed grade in the 780-ball FCBGA tier (vs EP3SE110F780C2)
- Stratix III E (Enhanced) features versus L (Low-power) (vs EP3SL110F780C3N)
Design Notes
Estimated: the 780-ball FCBGA requires an 8+ layer PCB stackup with 1 oz copper on outer layers and 0.5 oz on inner layers for controlled-impedance escape. Microvia or stacked-via technology is needed to route 0.8 mm pitch balls; design for 100 Ξ© differential and 50 Ξ© single-ended impedances on transceiver channels. Provide a continuous ground plane on layer 2 directly beneath the BGA to suppress return-path discontinuities.
Estimated: at 500 MHz core clock with full logic utilization, the Stratix III E device can draw 5-8 A on the 1.1 V core rail. Use a multi-phase buck regulator with low-ESR ceramic decoupling (20 x 22 Β΅F + 100 x 0.1 Β΅F near the BGA) and verify with Quartus II PowerPlay early-power-estimator before committing to a PMIC. The PLL analog supplies (VCCA_PLL) require an isolated LC filter from the main 1.1 V rail.
The FCBGA package exposes a thermal pad beneath the die; solder this to a continuous copper pour stitched with thermal vias to inner ground planes. Estimated: at 8 W dissipation in still air, theta_JA is approximately 10 C/W, giving a 80 C rise above ambient. Provide 200 LFM forced-air cooling and a heatsink for high-utilization designs to keep junction temperature below 100 C.
Transceiver channels on the EP3SE110F780C3N require matched-length (within 150 mil) differential pair routing, AC-coupled termination at the receiver, and clean reference clocks with sub-200 ppm accuracy. Series caps on transmit outputs must be 100 nF X7R 0402 placed within 250 mil of the TX pins; mismatched length pairs will close the eye at 6.375 Gbps.
Do not assume the C3 speed grade automatically closes timing in your design - Quartus II TimeQuest must be run on the actual routed netlist. Avoid using LVDS on banks that also drive transceiver REFCLK pins without careful PIRO (pin input/output register) placement. Do not place the configuration JTAG pins next to noisy switching I/O; isolate them with ground guard traces.
Compliance Information
RoHS and REACH compliant per Intel/Altera product declarations. Not AEC-Q100 qualified (industrial FPGA platform, automotive customers should consult the Intel automotive-grade Cyclone or MAX families).
