EP3SE110F780C4L vs EP3SE110F780I4L Comparison

Detailed side-by-side comparison of EP3SE110F780C4L by Intel and EP3SE110F780I4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE110F780C4L EP3SE110F780I4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,550.00 $1,395.00
Series Stratix III E β€”
Number of Logic Elements (LE) 107,500 β€”
Number of Logic Array Blocks (LAB) [DATA_NEEDED: number of LABs] β€”
Total Memory Bits 8,936,448 bits β€”
Number of 18x18 Multipliers 488 β€”
Number of PLLs [DATA_NEEDED: PLL count] β€”
User I/O Pins 488 β€”
Speed Grade -4 (commercial) β€”
Process Variant L (low-leakage) β€”
Operating Temperature 0C to +85C (commercial) β€”
Supply Voltage (Core) [DATA_NEEDED: core voltage] β€”
Package Type 780-Ball FCBGA β€”
Ball Pitch 1.0 mm 1.0 mm
Mounting Type Surface Mount Surface Mount (FC-FBGA)
Process Technology 65 nm CMOS 65 nm CMOS
RoHS Status Compliant Compliant (per legacy Altera data)
MSL Level 3 (per JEDEC J-STD-020) β€”
Family β€” Stratix III E
Logic Elements β€” 107,500
LABs (Logic Array Blocks) β€” 4,300
User I/Os β€” 488
Embedded Memory β€” 8,936,448 bits (8.9 Mbit)
Maximum Operating Frequency β€” 375 MHz
Core Voltage β€” 0.9 V
Package β€” 780-pin FC-FBGA (Flip-Chip BGA)
Package Body Size β€” 29 mm Γ— 29 mm
Operating Temperature (Industrial) β€” -40 Β°C to +100 Β°C
Product Status β€” Not Recommended for New Designs (NRND)

Datasheets & Resources

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