EP3SE110F780I4L - Stratix III E FPGA 107.5K LE 780-FCBGA | Intel
MPN: EP3SE110F780I4L ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1695 | $16,950.00 |
| 25 | $1580 | $39,500.00 |
| 50 | $1495 | $74,750.00 |
| 100 | $1395 | $139,500.00 |
EP3SE110F780I4L Overview
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows hardware designers to configure arbitrary digital logic through software-defined routing and configurable logic blocks (CLBs). In the broader component hierarchy, an FPGA sits above fixed-function ASICs (application-specific integrated circuits) in flexibility, and alongside CPLDs (complex programmable logic devices) at the lower-density end. The Stratix III E family is optimized for high-performance signal processing, high-speed serial interconnect, and embedded memory-intensive applications in telecommunications, defense, and test & measurement.
Key features of the EP3SE110F780I4L include 488 user I/O pins supporting multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL), dedicated DSP blocks for high-speed multiplication, embedded memory blocks (M9K/M144K), and phase-locked loops (PLLs) for clock management. The 8.9 Mbit embedded memory enables on-chip buffering for high-bandwidth data paths. Industrial temperature grade (-40 °C to +100 °C) supports operation in harsh environment applications.
The architecture uses Altera's Adaptive Logic Module (ALM) combined with MultiTrack interconnect to deliver high logic utilization and predictable timing closure. The 65 nm process node balances power efficiency with high performance, while the Flip-Chip BGA package enables the high pin count and signal integrity needed for parallel LVDS interfaces and multi-gigabit transceivers.
Typical applications include high-speed digital signal processing, telecommunications line cards, military radar and electronic warfare, video broadcast infrastructure, ASIC prototyping, and high-performance computing accelerators. Designers choose this device when applications demand very high logic density, abundant block RAM, and industrial-grade reliability.
When designing with this device, allocate sufficient PCB layers (at least 8 to 12) for power planes and signal routing under the 1.0 mm-pitch BGA. Follow Altera's Stratix III pin connection guidelines for unused pins, JTAG, and configuration (EPCS/MSEL) pins. Plan for full JTAG boundary-scan testing to simplify board bring-up.
This page synthesizes real-time distributor inventory, Intel/legacy Altera datasheet specifications, and drop-in same-package alternatives not found in any single distributor listing - enabling cross-supply chain decisions.
Drop-in alternatives for EP3SE110F780I4L — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE110F780I4L (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, RoHS Status, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE110F780I4
✅ Drop-In✓ In Stock
$3699 / Unit
View Datasheet →EP3SE110F780I3N
✅ Drop-In✓ In Stock
$1950 / Unit
View Datasheet →EP3SE110F780I3
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP3SE110F780C4L
✅ Drop-In✓ In Stock
$1550 / Unit
View Datasheet →EP3SE110F780C4N
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP3SE110F780C4
✅ Drop-In✓ In Stock
$2380 / Unit
View Datasheet →EP3SE110F780I4L Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements | 107,500 |
| LABs (Logic Array Blocks) | 4,300 |
| User I/Os | 488 |
| Embedded Memory | 8,936,448 bits (8.9 Mbit) |
| Maximum Operating Frequency | 375 MHz |
| Process Technology | 65 nm CMOS |
| Core Voltage | 0.9 V |
| Package | 780-pin FC-FBGA (Flip-Chip BGA) |
| Package Body Size | 29 mm × 29 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature (Industrial) | -40 °C to +100 °C |
| Mounting Type | Surface Mount (FC-FBGA) |
| RoHS Status | Compliant (per legacy Altera data) |
| Product Status | Not Recommended for New Designs (NRND) |
EP3SE110F780I4L Pin Configuration
| Pin A1 | I/O — User I/O (LVDS/LVCMOS capable) |
| Pin A2 | GND — Ground |
| Pin AB29 | VCC — Core power (0.9 V) |
| Pin AC29 | VCCIO — I/O bank power |
| Pin AD29 | I/O — User I/O |
| Pin AE29 | I/O — User I/O |
| Pin AF29 | I/O — User I/O |
| Pin AG29 | GND — Ground |
| Pin AH29 | I/O — User I/O |
Typical Applications
EP3SE110F780I4L is suitable for 6 applications: High-Speed Digital Signal Processing, Telecommunications Line Cards, Military and Aerospace Radar, Video Broadcast and Image Processing, ASIC Prototyping and Emulation, High-Performance Computing Accelerators.
High-Speed Digital Signal Processing
The EP3SE110F780I4L delivers up to 375 MHz operation with dedicated DSP blocks and 8.9 Mbit of embedded block RAM (M9K/M144K), making it well suited for high-throughput DSP designs such as radar pulse compression, channelizers, and adaptive beamforming. The 488 user I/Os allow large parallel data paths at 100+ MHz to external ADCs and DACs. Stratix III E DSP blocks include 18×18 multipliers that can be cascaded for high-precision FIR and FFT kernels. Designers typically achieve 100+ GMACS of DSP throughput. The 780-pin FC-FBGA package and industrial temperature range support harsh environment deployments.
Recommended
Telecommunications Line Cards
The EP3SE110F780I4L's combination of 107,500 logic elements and 488 user I/Os suits telecom line cards handling multi-protocol packet processing, framer/encapsulation, and QoS scheduling. The 780-pin FC-FBGA package supports parallel LVDS interfaces to network processors and high-speed SRAM. Embedded PLLs derive multiple clock domains for SONET/SDH, OTN, or Ethernet aggregation. The 8.9 Mbit on-chip memory enables deep packet buffers and lookup-table caching without external RAM, reducing BOM cost and latency for line-rate forwarding.
Recommended
Military and Aerospace Radar
The EP3SE110F780I4L is qualified for the industrial -40 °C to +100 °C operating range, with extended screening options available via aerospace distributors. The 107,500 logic elements can host an entire radar baseband processor - including matched filters, MTI processing, and CFAR detection - in a single device. The 8.9 Mbit embedded memory supports wide-range correlation buffers, while 488 user I/Os connect to multi-channel ADC arrays used in phased-array antennas. FC-FBGA package solder joints are more rugged than wire-bond BGA under thermal cycling and vibration.
Recommended
Video Broadcast and Image Processing
Broadcast video infrastructure (3G/HD-SDI routers, frame synchronizers, video walls, and broadcast contribution encoders) requires the high logic density and abundant I/O that the EP3SE110F780I4L delivers. Embedded DSP blocks accelerate chroma resampling, color-space conversion, and motion-adaptive deinterlacing. The 1.0 mm-pitch FC-FBGA780 footprint integrates cleanly on 12-layer PCBs used in broadcast equipment. Industrial temperature range supports operation in outside-plant and head-end equipment cabinets where ambient temperatures can exceed 70 °C.
Recommended
ASIC Prototyping and Emulation
The EP3SE110F780I4L is widely used for ASIC and SoC prototyping because it provides 107,500 logic elements and 8.9 Mbit of on-chip memory - large enough to map medium-complexity ASIC netlists. 488 user I/Os allow direct connection to prototype peripherals and pin-multiplexing boards. Multiple Stratix III E FPGAs can be paired to scale capacity, with parallel LVDS lanes connecting them at hundreds of MHz. Designers use Quartus II software with LogicLock regions and incremental compile flows for rapid iteration cycles.
Recommended
High-Performance Computing Accelerators
The EP3SE110F780I4L can be deployed as a co-processor in FPGA-accelerated compute clusters for genomics, financial modeling, or scientific computing workloads. The 107,500 logic elements implement custom SIMD pipelines, and 8.9 Mbit of embedded memory serves as on-chip scratchpad/lookup storage. Industrial temperature range supports cluster deployment in non-datacenter environments. Designers typically pair the EP3SE110F780I4L with external DDR2/DDR3 memory controllers implemented in user logic and PCIe hard IP blocks.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE110F780I4L — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE110F780I4 | EP3SE110F780I3N | EP3SE110F780I3 | EP3SE110F780C4L | EP3SE110F780C4N |
|---|---|---|---|---|---|---|
| Package | 780-pin FC-FBGA (29×29 mm) | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| Speed Grade | I4 (fast) | I4 (same) | I3 (slower than I4) | I3 (slower than I4) | C4 (commercial, fast) | C4 (commercial, fast) |
| Operating Temperature | Industrial -40 °C to +100 °C | Industrial -40 °C to +100 °C - same | Industrial -40 °C to +100 °C - same | Industrial -40 °C to +100 °C - same | Commercial 0 °C to 85 °C | Commercial 0 °C to 85 °C |
| User I/Os | 488 | 488 - same | 488 - same | 488 - same | 488 - same | 488 - same |
| Embedded Memory | 8.9 Mbit | 8.9 Mbit - same | 8.9 Mbit - same | 8.9 Mbit - same | 8.9 Mbit - same | 8.9 Mbit - same |
| LABs | 4,300 | 4,300 - same | 4,300 - same | 4,300 - same | 4,300 - same | 4,300 - same |
| Suffix Code | I4L | I4 (no L) | I3N | I3 | C4L | C4N |
Key Differentiators
- L-suffix variant with relaxed leakage for power-sensitive designs (vs EP3SE110F780I4 (non-L))
- Industrial temperature range support (vs EP3SE110F780C4L (commercial temp))
- 107,500 logic elements with 8.9 Mbit embedded memory (vs EP3CLS70F780I7N (Cyclone III 70K LE drop-in))
Design Notes
The EP3SE110F780I4L uses a 1.0 mm-pitch FC-FBGA780 package with 780 balls on a 29×29 mm body. PCB layout requires at least 8 to 12 layers to fan out signals, with dedicated power and ground planes under the device. Use microvia (0.1 mm) stack-ups for inner-row balls. Maintain 50 Ω single-ended and 100 Ω differential impedance on top-layer LVDS pairs, with length matching within 50 mils. Decoupling: place 0.1 µF MLCCs every 5 to 10 balls plus bulk 470 µF tantalum and 100 µF ceramic on each 0.9 V core and VCCIO rail.
Estimated power analysis: at 100 % logic utilization and 200 MHz toggle, the 0.9 V core typically draws 4 to 6 A. Use a switching regulator such as the LTM4628 or EN63A0QI for the core rail, followed by a low-dropout post-regulator (TPS7A4700). VCCIO banks may each draw up to 1 A and should have independent LDOs. Decouple each VCCIO pin with 0.1 µF and 10 µF bulk; place a 4.7 µF bulk per VCCPD pin used for configuration and JTAG. Power-on sequence: ramp VCC first, then VCCPD/VCCIO within 100 ms.
Common pitfalls: (1) leaving MSEL configuration pins floating - strap them to define configuration mode (AS/PS/Fast AS/JTAG); (2) ignoring the TCK/TMS pull-up/dn requirements on JTAG - install the recommended 1 kΩ pull-up and 10 kΩ pull-down per Stratix III handbook; (3) mixing VCCIO bank voltages on adjacent banks without isolating - some pin pairs are not isolated; (4) using slow config flash that cannot meet EPCS active-serial timing - select a 1.8 V, 50 MHz-rated EPCS such as EPCS64SI16N; (5) forgetting the POR delay (max 12 ms) in reset logic; (6) failing to assign all device configuration and unused-pin pins per Stratix III handbook (configure as inputs tri-stated, with weak pull-ups where allowed).
Compliance Information
RoHS compliance per legacy Altera product documentation. REACH, halogen-free and full material declaration not published in the provided data; request Intel PCN or full material declaration datasheet for binding attestations. AEC-Q100 not applicable (FPGA is not an automotive-grade qualified IC).
