EP3SE110F780I3N vs EP3SE110F780I4L Comparison

Detailed side-by-side comparison of EP3SE110F780I3N by Intel and EP3SE110F780I4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE110F780I3N EP3SE110F780I4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,950.00 $1,395.00
Family Stratix III E Stratix III E
Logic Elements 107,500 107,500
Logic Array Blocks (LABs) 4,300 β€”
Embedded Memory Bits 8,936,448 (approximately 1.1 MB) β€”
Maximum User I/Os 488 β€”
Core Voltage 1.1 V (range 1.05 V to 1.15 V) 0.9 V
Process Technology 65 nm CMOS 65 nm CMOS
Package 780-pin FC-FBGA (Flip-Chip FineLine BGA) 780-pin FC-FBGA (Flip-Chip BGA)
Operating Temperature -40 Β°C to +100 Β°C (Industrial, "I" grade) β€”
Configuration Interface Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) β€”
Boundary-Scan Test Yes, per IEEE Std. 1149.1 β€”
Speed Grade 3 (Fast) β€”
PLLs Yes, with global and regional clock networks β€”
Mounting Type Surface Mount (BGA) Surface Mount (FC-FBGA)
RoHS Status Compliant Compliant (per legacy Altera data)
MSL Level [DATA_NEEDED: MSL level] β€”
Supply Voltage Tolerance 1.05 V to 1.15 V β€”
LABs (Logic Array Blocks) β€” 4,300
User I/Os β€” 488
Embedded Memory β€” 8,936,448 bits (8.9 Mbit)
Maximum Operating Frequency β€” 375 MHz
Package Body Size β€” 29 mm Γ— 29 mm
Ball Pitch β€” 1.0 mm
Operating Temperature (Industrial) β€” -40 Β°C to +100 Β°C
Product Status β€” Not Recommended for New Designs (NRND)

Datasheets & Resources

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