EP3SE260F1152C2 vs EP3SE260F1152C2G Comparison

Detailed side-by-side comparison of EP3SE260F1152C2 by Intel and EP3SE260F1152C2G by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152C2 EP3SE260F1152C2G
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $2,400.00 $2,050.00
Manufacturer Intel (formerly Altera) โ€”
Series Stratixยฎ III E EP3SE260
Logic Elements (LE) 255,000 โ€”
Logic Array Blocks (LABs) 10,200 โ€”
Embedded Memory (bits) 16,672,768 โ€”
User I/Os 744 โ€”
User I/O Banks [DATA_NEEDED: I/O bank count] โ€”
Core Voltage (VCCINT) 1.1 V โ€”
Process Technology 65 nm CMOS โ€”
Package 1152-ball FC-FBGA (Flip Chip) 1152-BBGA, FCBGA (FineLine BGA)
Mounting Type Surface Mount Surface Mount
Speed Grade C2 (commercial) C2 (commercial)
Operating Temperature Commercial (0 ยฐC to +85 ยฐC junction) [DATA_NEEDED: exact TJ limits] โ€”
RoHS Status Compliant Compliant (G suffix)
Lead-Free Yes โ€”
MSL Level [DATA_NEEDED: MSL rating] โ€”
Design Software Quartus II (Stratix III support) โ€”
Family โ€” Stratix III E
Logic Elements / Cells โ€” 255000
Total RAM Bits โ€” 16672768
Number of LABs / CLBs โ€” 10200
Number of I/O โ€” 744
Number of Terminals โ€” 1152
Package Code โ€” BGA (Ball Grid Array)
Package Shape โ€” Square
Technology / Process Node โ€” 65 nm
Core Voltage โ€” 1.1 V
Lead-Free (RoHS) โ€” Yes (G suffix)
Operating Temperature Grade โ€” Commercial (C)
Supply Packaging โ€” Tray

Datasheets & Resources

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