EP3SE260F1152C2G - Stratix III E 255K LE FPGA, 1152-FBGA, Lead-Free | Intel
MPN: EP3SE260F1152C2G ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 100 | $2380 | $238,000.00 |
| 250 | $2185 | $546,250.00 |
| 500 | $2050 | $1,025,000.00 |
EP3SE260F1152C2G Overview
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader category of digital semiconductors and sit alongside microcontrollers, ASICs, and DSPs in the system designer's toolkit. They offer hardware-level parallelism, deterministic latency, and the ability to be reconfigured in the field, making them well-suited for prototyping, signal processing, and high-throughput data path acceleration.
Key features of the EP3SE260F1152C2G include 10,200 logic array blocks (LABs), transceiver support (per Stratix III E architecture), DSP blocks for fixed- and floating-point arithmetic, embedded memory blocks totaling 16.6 Mbits, and on-chip PLLs for clock synthesis. The 1152-FBGA (FineLine Ball Grid Array) package offers a high I/O count suitable for memory-rich and high-bandwidth interfaces such as DDR3, QDR II+, and RLDRAM II. The 'G' suffix indicates lead-free / RoHS-compliant terminations, while 'C2' denotes the commercial speed grade.
Architecturally, the Stratix III E family leverages the Altera Adaptive Logic Module (ALM) which packs 8 inputs into a single LUT, improving logic density versus 4-input LUT architectures. Internal memory is organized as M9K and M144K blocks for flexible buffering and FIFO implementations. The device integrates high-speed transceivers capable of multi-gigabit serial I/O, although the exact transceiver count for this specific device variant should be verified in the official datasheet.
Typical applications include high-performance DSP in defense and radar systems, wire-speed packet processing in networking line cards, ASIC prototyping and emulation, high-frequency trading acceleration, video broadcast processing, and high-bandwidth memory interfaces in test and measurement equipment. Engineers select the EP3SE260F1152C2G when the design requires the highest logic density in the Stratix III E family with a robust 1152-ball BGA footprint.
When designing with this FPGA, pay close attention to power integrity: the device requires multiple voltage domains (core, I/O, PLL, transceiver) with tight sequencing and decoupling. PCB layout for the 1152-FBGA demands HDI stackup with microvia-in-pad technology for reliable BGA assembly. Thermal management is critical since high utilization can produce substantial power dissipation; the package exposes a thermal pad for board-level heatsinking.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the Stratix III family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3SE260F1152C2G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE260F1152C2G (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Series, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE260F1152C2
✅ Drop-In✓ In Stock
$2400 / Unit
View Datasheet →EP3SE260F1152C2N
✅ Drop-In✓ In Stock
$11000 / Unit
View Datasheet →EP3SE260F1152I3
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$16500 / Unit
View Datasheet →EP3SE260F1152C3
✅ Drop-In✓ In Stock
$12500 / Unit
View Datasheet →EP3SE260F1152C4
✅ Drop-In✓ In Stock
$8900 / Unit
View Datasheet →EP3SE260F1152I4
✅ Drop-In✓ In Stock
$1750 / Unit
View Datasheet →EP3SE260F1152C2G Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Series | EP3SE260 |
| Logic Elements / Cells | 255000 |
| Total RAM Bits | 16672768 |
| Number of LABs / CLBs | 10200 |
| Number of I/O | 744 |
| Number of Terminals | 1152 |
| Package | 1152-BBGA, FCBGA (FineLine BGA) |
| Package Code | BGA (Ball Grid Array) |
| Package Shape | Square |
| Technology / Process Node | 65 nm |
| Core Voltage | 1.1 V |
| Speed Grade | C2 (commercial) |
| Lead-Free (RoHS) | Yes (G suffix) |
| Operating Temperature Grade | Commercial (C) |
| Mounting Type | Surface Mount |
| Supply Packaging | Tray |
| RoHS Status | Compliant (G suffix) |
EP3SE260F1152C2G square Pin Configuration Guide
Pin configuration for EP3SE260F1152C2G (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE260F1152C2G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE260F1152C2G is suitable for 7 applications: ASIC Prototyping and Emulation, High-Performance DSP in Radar and Defense, Wire-Speed Networking Line Card Processing, High-Bandwidth Memory Interface Aggregation, Video Broadcast Processing, Test and Measurement Instrumentation, Medical Imaging Acceleration.
ASIC Prototyping and Emulation
The EP3SE260F1152C2G's 255K logic elements and 16.6 Mbits of embedded RAM make it ideal for ASIC prototyping of mid-complexity designs in a single device. The Stratix III E Adaptive Logic Module (ALM) packs 8 inputs into a single LUT, providing higher logic density than 4-input LUT architectures. With 744 user I/Os, the device can map wide memory buses (DDR3, QDR II+) and complex multi-clock SoC prototypes directly. Combined with the integrated transceivers, engineers can prototype ASICs containing multi-gigabit serial interfaces (PCIe Gen2, Serial RapidIO, 10 GbE) with full software-driven bring-up via Quartus II.
Recommended
High-Performance DSP in Radar and Defense
Stratix III E devices integrate dedicated DSP blocks supporting fixed- and floating-point arithmetic at high MSPS rates, ideal for radar signal processing chains (FFT, pulse compression, beamforming). The EP3SE260F1152C2G with 255K LE and abundant DSP blocks can implement multi-channel digital down-conversion (DDC) and adaptive filtering in radar receivers. The 1.1 V core reduces dynamic power vs prior generations, important in power-constrained airborne or naval platforms. The 744 I/Os support high-speed LVDS ADC interfaces and DDR3 sample buffering in a single FPGA.
Recommended
Wire-Speed Networking Line Card Processing
The EP3SE260F1152C2G supports 10+ Gbps transceivers and high-density parallel processing for wire-speed packet classification, deep packet inspection, and traffic management in core-router line cards. The 16.6 Mbits embedded RAM enables on-chip buffering of packet headers and small payloads, while the 744 I/Os handle multiple SPI-4.2 or Interlaken interfaces to network processors. Hard PCS blocks in Stratix III E simplify 10 GbE and OTU2 SERDES integration. Engineers frequently use this device for IPsec, MPLS, and IPv6 forwarding acceleration in carrier-grade routers.
Recommended
High-Bandwidth Memory Interface Aggregation
Stratix III E devices feature dedicated PHY blocks supporting DDR3, DDR2, QDR II+, QDR II, and RLDRAM II at full speed, making the EP3SE260F1152C2G ideal for memory-aggregation designs. The 744 user I/Os in the 1152-FBGA package enable multiple x72 DDR3 channels in parallel for high-capacity buffering in packet capture, telecom switching, and high-performance computing. The 1.1 V core and Stratix III's Programmable Power Technology allow unused logic to be powered down, reducing dynamic power while sustaining bandwidth.
Recommended
Video Broadcast Processing
The EP3SE260F1152C2G's high logic density and abundant DSP blocks support multi-stream SD/HD/3G-SDI video processing, encoding/decoding, and frame-rate conversion in broadcast studios. The 744 I/Os handle multiple SDI inputs and HDMI/DisplayPort outputs simultaneously, while the embedded memory buffers full-resolution frames. Stratix III E transceivers support SDI over coax and SMPTE 2022 IP-based video transport, making this FPGA a single-chip solution for professional video processing infrastructure.
Recommended
Test and Measurement Instrumentation
The high logic density, 744 user I/Os, and fast transceivers make the EP3SE260F1152C2G suitable for high-end oscilloscope, logic analyzer, and protocol analyzer front-ends. The FPGA can implement deep acquisition memory control, real-time protocol decoding (PCIe, USB 3.0, SATA), and on-chip signal conditioning. The 1.1 V core reduces heat dissipation in compact benchtop instruments, while the 1152-FBGA provides the I/O bandwidth to drive high-resolution ADC front-ends at multi-GSPS rates.
Recommended
Medical Imaging Acceleration
Stratix III E devices are used in CT, MRI, and ultrasound imaging systems for real-time image reconstruction (back-projection, iterative reconstruction) and beamforming. The EP3SE260F1152C2G's 255K LE and DSP blocks can implement CT back-projection in real time at full detector resolution, while the 16.6 Mbits embedded memory holds projection buffers. The 1.1 V core keeps power low, important for bedside portable imaging carts, and the 744 I/Os aggregate high-speed detector arrays in MRI and ultrasound systems.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE260F1152C2G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE260F1152C2 | EP3SE260F1152C2N | EP3SE260F1152I3 | EP3SE260F1152C3 | EP3SE260F1152C4 | EP3SE260F1152I4 |
|---|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 1152-FBGA (FCBGA) - same | 1152-FBGA (FCBGA) - same | 1152-FBGA (FCBGA) - same | 1152-FBGA (FCBGA) - same | 1152-FBGA (FCBGA) - same | 1152-FBGA (FCBGA) - same | 1152-FBGA (FCBGA) - same |
| Logic Elements | 255000 | 255000 | 255000 | 255000 | 255000 | 255000 | 255000 |
| Speed Grade | C2 (commercial) | C2 | C2 | I3 | C3 | C4 | I4 |
| Temperature Grade | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Commercial | Commercial | Industrial |
| Lead Finish | Lead-free (G suffix) | SnPb (lead-bearing) | Lead-free (N suffix) | Lead-free | SnPb or lead-free variant | SnPb or lead-free variant | SnPb or lead-free variant |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Embedded Memory | 16672768 bits (16.6 Mbit) | 16672768 bits | 16672768 bits | 16672768 bits | 16672768 bits | 16672768 bits | 16672768 bits |
| User I/O | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete / Not Verified | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest-density Stratix III E variant with 255K LE (vs EP3SE110F1152C2)
- Commercial temperature grade for benign environments (vs EP3SE260F1152I3)
- Lead-free RoHS-compliant terminations (vs EP3SE260F1152C2 (lead-bearing))
- C2 speed grade offers best timing margin (vs EP3SE260F1152C4)
Design Notes
The EP3SE260F1152C2G requires multiple independent voltage rails: VCCINT 1.1 V for the core logic, VCCIO 1.2 V to 3.0 V for I/O banks (depending on I/O standard), VCCAUX 2.5 V for PLLs and configuration, VCCRST 1.1 V for configuration logic, and a separate supply for transceivers if used. Per the Stratix III Handbook Power Management chapter, these rails must be sequenced according to the manufacturer's recommended power-up sequence (VCCINT before VCCAUX before VCCIO). Decoupling must use a bulk capacitor of 100 uF or more per rail, plus 0.1 uF and 0.01 uF ceramics distributed under the BGA.
The 1152-FBGA package with 0.8 mm or 1.0 mm pitch requires an HDI PCB stackup with microvia-in-pad technology for reliable assembly. We recommend a 1-6-1 or 2-8-2 stackup using low-loss dielectric material (e.g., FR-4 with Dk 3.5 at 1 GHz, or better yet, mid-loss material for transceiver signal integrity). Per the Stratix III Handbook PCB Design chapter, the BGA escape routing must use dog-bone fan-out or via-in-pad, with signal layers referenced to internal power/ground planes. All decoupling capacitors should be placed as close as physically possible to the BGA balls they serve.
The EP3SE260F1152C2G can dissipate significant power (estimated 10-20 W at high toggle rates with all DSP and transceivers active), requiring a thermal management strategy. The 1152-FBGA exposes a thermal pad that must be soldered to the PCB for heat dissipation. Use at least 4 thermal vias (0.3 mm drill, 0.5 mm pad) directly under the thermal pad, connected to internal copper planes and a bottom-side copper pour. For forced-air cooled systems, an air velocity of 1.5-2.5 m/s across the device is recommended; for conduction-cooled systems, attach the device to a heat spreader or chassis wall with thermal interface material.
Common pitfalls with the EP3SE260F1152C2G include: (1) forgetting to power all VCCIO banks even unused ones - the device may misbehave if floating rails are not tied to a valid voltage; (2) failing to use a configuration controller or AS configuration mode - the device requires a configuration flash or a controller on power-up; (3) neglecting JTAG chain integrity - tie TMS high through 10 kohm, include proper TCK buffering; (4) not using Stratix III E's Programmable Power Technology to gate unused logic and reduce dynamic power by 30-50 percent; (5) misrouting high-speed LVDS pairs - per the handbook, maintain 100 ohm differential impedance and length matching within 20 ps.
Compliance Information
Lead-free (G suffix) indicates RoHS compliance. Halogen-free status not explicitly documented in available data - verify with manufacturer's material declaration. AEC-Q100 not applicable (FPGA is not an automotive-qualified part in this lifecycle status).
