EP3SE260F1152C2 vs EP3SE260F1152C4 Comparison

Detailed side-by-side comparison of EP3SE260F1152C2 by Intel and EP3SE260F1152C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152C2 EP3SE260F1152C4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $2,400.00 $8,900.00
Manufacturer Intel (formerly Altera) โ€”
Series Stratixยฎ III E Stratix III E (Enhanced)
Logic Elements (LE) 255,000 255,000
Logic Array Blocks (LABs) 10,200 10,200
Embedded Memory (bits) 16,672,768 โ€”
User I/Os 744 โ€”
User I/O Banks [DATA_NEEDED: I/O bank count] โ€”
Core Voltage (VCCINT) 1.1 V โ€”
Process Technology 65 nm CMOS 65 nm CMOS (TSMC)
Package 1152-ball FC-FBGA (Flip Chip) 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Mounting Type Surface Mount Surface Mount (BGA)
Speed Grade C2 (commercial) C4 (slowest commercial grade)
Operating Temperature Commercial (0 ยฐC to +85 ยฐC junction) [DATA_NEEDED: exact TJ limits] Commercial (0C to +85C) - inferred from speed grade C4
RoHS Status Compliant Compliant (per distributor listings)
Lead-Free Yes โ€”
MSL Level [DATA_NEEDED: MSL rating] โ€”
Design Software Quartus II (Stratix III support) โ€”
Family โ€” Stratix III
Embedded Memory Bits โ€” 16,672,768
User I/O Count โ€” 744
Core Voltage โ€” 1.1 V
Maximum Internal Frequency โ€” ~450 MHz (per FPGAkey listing)
Package Code โ€” BGA, square
I/O Standards Supported โ€” LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration Modes โ€” Passive Serial, Fast Passive Parallel, JTAG
DSP Blocks (18x18 Multipliers) โ€” 384
PLL Count โ€” [DATA_NEEDED: PLL count]
Transceivers โ€” External PHY interface only (no integrated GXB)

Datasheets & Resources

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