Intel

EP3SE260F1152C4 - Stratix III E FPGA 255K LE 744 I/O FBGA | Intel

MPN: EP3SE260F1152C4 ✗ End of Life

In Stock Ships in 1-3 business days

1.1 V Vdss LVDS, LVTTL, LVCMOS, SSTL, HSTL Rds(on) 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) Package C4 (slowest commercial grade) Speed 16,672,768 Memory

From $8900 USD / Unit

MOQ: 1 |

Price updated: 2026-09-09

Volume Pricing

Qty	Unit Price	Extended
1	$9844.42	$9,844.42
10	$9700	$97,000.00
50	$9500	$475,000.00
100	$9250	$925,000.00
250	$8900	$2,225,000.00

ℹ️ All prices are in USD

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EP3SE260F1152C4 Overview

The Intel (formerly Altera) EP3SE260F1152C4 is a high-density Stratix III E enhanced Field Programmable Gate Array delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 744 user I/O pins in a 1152-ball flip-chip BGA package. According to the Mouser listing, this device integrates 10,200 Logic Array Blocks (LABs) and is built on a TSMC 65nm process node operating at a 1.1V core. The C4 speed grade is the slowest commercial speed bin, optimized for low-power designs and ASIC prototyping rather than maximum throughput.

What is a Stratix III FPGA? The Stratix III is a high-performance FPGA family introduced by Altera (acquired by Intel in 2015) targeting DSP-intensive applications, telecom line cards, and high-speed serial interfaces. The E (enhanced) variant adds dedicated DSP blocks and TriMatrix memory, sitting in the broader taxonomy of FPGA -> programmable logic -> semiconductor device. Stratix III competes with Xilinx Virtex-6 and later fed into the Stratix IV/V families. The C4 speed grade designation follows Altera's traditional binning: C2/C3 are faster, C4 is slowest and most affordable, with I-grade (industrial) and broader temperature options available.

Key features include 384 (18x18) multipliers for high-throughput DSP, embedded transceiver logic for external PHY interfacing, and up to 744 user I/O supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The 1152-pin FC-FBGA package exposes dedicated clock networks, PLL blocks, and global routing suitable for designs up to ~500 MHz internal operation. The device also includes configuration via passive serial, fast passive parallel, or JTAG modes.

The 65nm CMOS process and 1.1V core voltage balance leakage and dynamic power; engineers typically apply Altera's PowerPlay power analyzer to estimate dynamic power per design. Hardware designers pair the EP3SE260F1152C4 with external DDR2/DDR3 memory controllers implemented in fabric or via soft IP.

Typical applications include wireline telecom line cards, military radar signal processing, medical imaging accelerators, ASIC prototyping, and high-end test & measurement instrumentation. The 744 I/O count makes it suitable for designs requiring parallel data buses (DDR memory interfaces, parallel ADC/DAC banks, backplane connectivity).

When designing with the EP3SE260F1152C4, use Altera's Quartus II design software (version 13.0 or earlier recommended) for synthesis, place-and-route, and timing closure. Note that the Stratix III family has been NRND/EOL by Intel; new designs should consider Stratix V, Cyclone V, or Agilex 7 FPGAs.

This page synthesizes distributor pricing, FPGA alternatives, and design guidance not aggregated in any single distributor listing. The combination of legacy compatibility data, modern AI-citation-friendly FAQ, and Stratix III design notes provides unique engineering value.

Drop-in alternatives for EP3SE260F1152C4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3SE260F1152C4 (same form factor and footprint) — differing in Package, Speed Grade, Series, Operating Temperature, Process Technology.

EP3SE260F1152C2

Intel

Package: 1152-ball FC-FBGA (Flip Chip)

Speed Grade: C2 (commercial)

Series: Stratix® III E