EP3SE260F1152C2N vs EP3SE260F1152C2 Comparison

Detailed side-by-side comparison of EP3SE260F1152C2N by Intel and EP3SE260F1152C2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152C2N EP3SE260F1152C2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $11,000.00 $2,400.00
Series Stratix III E Stratixยฎ III E
Family FPGA - Field Programmable Gate Array โ€”
Number of Logic Elements 255000 โ€”
Number of LABs/CLBs 10200 โ€”
Total Memory Bits 16672768 โ€”
Number of I/O 744 โ€”
Voltage - Supply 1.1 V โ€”
Mounting Type Surface Mount Surface Mount
Operating Temperature [DATA_NEEDED: operating temperature grade] Commercial (0 ยฐC to +85 ยฐC junction) [DATA_NEEDED: exact TJ limits]
Package / Case 1152-BBGA, FCBGA โ€”
Process Technology 65 nm 65 nm CMOS
Maximum Frequency 600 MHz โ€”
Supplier Device Package 1152-FCBGA โ€”
MSL Level [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
RoHS Status Compliant Compliant
Lead Free Yes (per EP3SE260F1152C2G comparison) โ€”
ECCN [DATA_NEEDED: ECCN code] โ€”
Moisture Sensitivity [DATA_NEEDED: MSL level] โ€”
Manufacturer โ€” Intel (formerly Altera)
Logic Elements (LE) โ€” 255,000
Logic Array Blocks (LABs) โ€” 10,200
Embedded Memory (bits) โ€” 16,672,768
User I/Os โ€” 744
User I/O Banks โ€” [DATA_NEEDED: I/O bank count]
Core Voltage (VCCINT) โ€” 1.1 V
Package โ€” 1152-ball FC-FBGA (Flip Chip)
Speed Grade โ€” C2 (commercial)
Lead-Free โ€” Yes
Design Software โ€” Quartus II (Stratix III support)

Datasheets & Resources

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