EP3SE260F1152C2N vs EP3SE260F1152I3 Comparison
Detailed side-by-side comparison of EP3SE260F1152C2N by Intel and EP3SE260F1152I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE260F1152C2N | EP3SE260F1152I3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $11,000.00 | $16,500.00 |
| Series | Stratix III E | Stratix III E (EP3SE260) |
| Family | FPGA - Field Programmable Gate Array | β |
| Number of Logic Elements | 255000 | β |
| Number of LABs/CLBs | 10200 | 10,200 |
| Total Memory Bits | 16672768 | β |
| Number of I/O | 744 | β |
| Voltage - Supply | 1.1 V | β |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | [DATA_NEEDED: operating temperature grade] | -40C to +100C (Industrial) |
| Package / Case | 1152-BBGA, FCBGA | β |
| Process Technology | 65 nm | 65 nm |
| Maximum Frequency | 600 MHz | β |
| Supplier Device Package | 1152-FCBGA | β |
| MSL Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free | Yes (per EP3SE260F1152C2G comparison) | β |
| ECCN | [DATA_NEEDED: ECCN code] | β |
| Moisture Sensitivity | [DATA_NEEDED: MSL level] | β |
| Logic Elements | β | 255,000 |
| Total RAM Bits | β | 16,672,768 |
| User I/O Count | β | 744 |
| Number of Embedded Multipliers (DSP blocks) | β | 768 |
| Core Voltage | β | 1.1 V |
| Maximum Fabric Frequency | β | 500 MHz |
| Package | β | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Speed Grade | β | I3 (Industrial, speed bin 3) |
| Product Status | β | Obsolete (per Xecor comparator) |