EP3SE260F1152C3 vs EP3SE110F1152C3N Comparison

Detailed side-by-side comparison of EP3SE260F1152C3 by Intel and EP3SE110F1152C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE260F1152C3 EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE260F1152C3 EP3SE110F1152C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $12,500.00 $1,560.00
Series Stratix III E Stratix III
Logic Elements 255,000 β€”
Embedded Memory (bits) 16,672,768 β€”
Logic Array Blocks (LABs) 10,200 4,300
User I/Os 744 744
Embedded 18x18 Multipliers 384 β€”
Package 1152-ball FCBGA (Flip-Chip BGA) β€”
Mounting Type Surface Mount Surface Mount
Core Voltage 0.9 V to 1.1 V β€”
Process Technology 40 nm 65 nm TSMC
Operating Temperature 0C to +85C (Commercial) 0 Β°C to 85 Β°C (commercial)
Configuration Method Passive Serial / Fast Passive Parallel / JTAG β€”
PLLs 12 β€”
RoHS Status Compliant β€”
Speed Grade C3 C3
Family β€” Stratix III E
Logic Elements (LE) β€” 107,500
Total RAM Bits β€” 8,936,448
Operating Frequency (max) β€” 500 MHz
Core Supply Voltage β€” 1.1 V nominal
I/O Supply Voltage β€” [DATA_NEEDED: I/O supply range]
Package Type β€” FC-FBGA-1152 (flip-chip BGA)
Mounting Style β€” SMD/SMT (Tray)
DSP Blocks β€” Yes (embedded multipliers)
Memory Type β€” M9K and M144K block RAM
External Memory Support β€” DDR/DDR2/DDR3 with read/write leveling
Boundary Scan β€” IEEE 1149.1 (JTAG)
RoHS β€” [DATA_NEEDED: RoHS status]
Lead-Free β€” Yes (per Altera/Intel datasheet family convention)

Datasheets & Resources

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