EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera
MPN: EP3SE260F1152C3 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14514.57 | $14,514.57 |
| 5 | $14000 | $70,000.00 |
| 10 | $13500 | $135,000.00 |
| 25 | $13000 | $325,000.00 |
| 100 | $12500 | $1,250,000.00 |
EP3SE260F1152C3 Overview
What is an FPGA? A Field-Programmable Gate Array is a programmable logic device containing an array of configurable logic blocks, embedded memory, DSP blocks, and programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit alongside ASICs and microcontrollers in the digital IC hierarchy. Stratix III E devices target high-end applications requiring maximum logic density, embedded transceivers, and high-speed external memory interfaces.
Key features of the EP3SE260F1152C3 include 384 embedded 18x18 multipliers for DSP, support for DDR3/QDRII+/RLDRAM II external memory interfaces up to 800 MHz, 12 phase-locked loops (PLLs), and 1.0V core operation. The device supports configuration via passive serial, fast passive parallel, and JTAG modes, with built-in encryption for IP protection.
Architecturally, Stratix III E introduces Adaptive Logic Modules (ALMs) with 8-input fracturable look-up tables, allowing each ALM to implement either one 6-input LUT or two independent 4-input LUTs, improving logic packing efficiency over previous generations. The 40nm process enables high performance at lower static and dynamic power compared to prior Stratix generations, addressing power consumption concerns for large FPGAs.
Typical applications include high-performance digital signal processing, wireless baseband processing, high-speed serial protocol bridging, ASIC prototyping, and military/aerospace signal processing. With 744 user I/Os and 1152-ball FCBGA packaging, the EP3SE260F1152C3 supports dense board-level integration for systems requiring maximum connectivity.
When designing with this device, ensure adequate thermal management - the FCBGA package requires controlled impedance PCB stackup and multiple ground/power planes. Power estimation tools (PowerPlay) should be used early in the design cycle to size voltage regulators and decoupling. Configuration scheme must be selected during board design to allocate correct pins.
This page synthesizes distributor pricing, FPGA family comparisons, and practical design notes not consolidated in the manufacturer datasheet, helping engineers select and source the right Stratix III variant.
Drop-in alternatives for EP3SE260F1152C3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE260F1152C3 (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Family, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE260F1152C2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$11000 / Unit
View Datasheet →EP3SE260F1152C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1620 / Unit
View Datasheet →EP3SE260F1152C2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2400 / Unit
View Datasheet →EP3SE110F1152C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1560 / Unit
View Datasheet →EP3SE110F1152C3
✅ Drop-In✓ In Stock
$3200 / Unit
View Datasheet →EP3SE110F1152C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1395 / Unit
View Datasheet →EP3SE260F1152C3 Maximum Ratings & Electrical Characteristics
| Series | Stratix III E |
| Logic Elements | 255,000 |
| Embedded Memory (bits) | 16,672,768 |
| Logic Array Blocks (LABs) | 10,200 |
| User I/Os | 744 |
| Embedded 18x18 Multipliers | 384 |
| Package | 1152-ball FCBGA (Flip-Chip BGA) |
| Mounting Type | Surface Mount |
| Core Voltage | 0.9 V to 1.1 V |
| Process Technology | 40 nm |
| Operating Temperature | 0C to +85C (Commercial) |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | 12 |
| RoHS Status | Compliant |
| Speed Grade | C3 |
EP3SE260F1152C3 1152-ball fcbga (flip-chip bga) Pin Configuration Guide
Pin configuration for EP3SE260F1152C3 (1152-ball fcbga (flip-chip bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE260F1152C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE260F1152C3 is suitable for 7 applications: High-Performance DSP Signal Processing, ASIC Prototyping and Emulation, Wireless Baseband Processing, High-Speed Protocol Bridging, Military and Aerospace Signal Processing, Video Broadcast and Image Processing, Industrial Test and Measurement.
High-Performance DSP Signal Processing
The EP3SE260F1152C3's 384 embedded 18x18 multipliers and 16.67 Mbits of memory enable high-throughput DSP pipelines for radar, sonar, and software-defined radio applications. The device supports 550 MHz DSP block operation, allowing real-time FFT, FIR, and adaptive filter implementations. With 255K logic elements, complex baseband processing chains fit in a single chip, reducing board area and BOM cost. The 40nm process balances performance with power efficiency for sustained DSP workloads in military and telecom infrastructure.
Recommended
ASIC Prototyping and Emulation
With 255K logic elements and abundant memory, the EP3SE260F1152C3 is widely used for ASIC prototyping and in-circuit emulation. Engineers map large ASIC RTL designs into the FPGA to validate logic before tape-out, dramatically reducing respin risk. The 744 user I/Os allow extensive chip-to-chip bridging, while high-speed transceivers support ASIC interconnect emulation. Quartus II synthesis supports incremental compilation, allowing partitioned ASIC designs to be brought up incrementally for faster debug cycles.
Recommended
Wireless Baseband Processing
The EP3SE260F1152C3's combination of high logic density, embedded multipliers, and external DDR3 memory interface support up to 800 MHz makes it ideal for wireless baseband processing in LTE and WiMAX infrastructure. PHY-layer functions including channel coding, MIMO detection, and FFT/iFFT run in real-time on the device. The large embedded memory buffers OFDM symbols and HARQ retransmissions, while flexible I/O banks connect to RF front-end ADCs/DACs and CPRI/OBSAI links to baseband cards.
Recommended
High-Speed Protocol Bridging
The EP3SE260F1152C3 supports multiple high-speed serial protocols simultaneously through dedicated transceiver blocks and flexible I/O serdes. Common applications include PCIe Gen2 x8 bridging to SATA III, SFP+ aggregation, and 10 Gigabit Ethernet MAC implementation. With 744 user I/Os, the device can simultaneously drive multiple parallel interfaces including DDR3 memory, LVDS links, and legacy parallel buses, serving as a system integration hub in storage and networking equipment.
Recommended
Military and Aerospace Signal Processing
The EP3SE260F1152C3's high logic density and radiation-tolerant process variants support military and aerospace applications including electronic warfare, SIGINT, and avionics signal processing. Extended temperature grade versions (operating -55C to +125C) are available in the same FCBGA-1152 package. Conformal coating and vibration-resistant BGA soldering meet MIL-STD-810 requirements when properly implemented. The device enables real-time processing of wideband RF signals in size, weight, and power (SWaP)-constrained platforms.
Recommended
Video Broadcast and Image Processing
The EP3SE260F1152C3 handles real-time 4K video processing, broadcast format conversion, and image enhancement with its 16.67 Mbit embedded memory and 744 I/Os. The device can simultaneously ingest multiple HD-SDI streams, perform deinterlacing, scaling, and overlay composition, and output via HDMI or DisplayPort. Embedded DSP blocks accelerate motion estimation and adaptive filtering, while DDR3 interfaces buffer multi-frame video pipelines. Used in studio switchers, video walls, and medical imaging systems.
Recommended
Industrial Test and Measurement
The EP3SE260F1152C3's combination of fast logic and high-speed I/O makes it ideal for automated test equipment (ATE), protocol analyzers, and high-speed oscilloscope capture front-ends. The device's 12 PLLs generate flexible clock trees for sampling and pattern generation, while embedded memory captures long waveform records. The FCBGA-1152 package provides enough I/O to interface with hundreds of test channels simultaneously, supporting parallel test of complex ICs in production environments.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE260F1152C3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE260F1152C2N | EP3SE260F1152C4N | EP3SE110F1152C3N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1152-ball FCBGA | 1152-ball FCBGA | 1152-ball FCBGA | 1152-ball FCBGA |
| Logic Elements | 255,000 | 255,000 | 255,000 | 110,000 |
| Speed Grade | C3 | C2 | C4 | C3 |
| Embedded Memory (bits) | 16,672,768 | 16,672,768 | 16,672,768 | 8,388,608 |
| Embedded 18x18 Multipliers | 384 | 384 | 384 | 224 |
| User I/Os | 744 | 744 | 744 | 744 |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Highest logic density in 1152-ball FCBGA family (vs EP3SE110F1152C3N)
- Speed grade C3 balances performance and power (vs EP3SE260F1152C2N)
- Largest embedded memory in Stratix III family (vs EP3SE260F1152C4N)
Design Notes
The EP3SE260F1152C3 in FCBGA-1152 has high thermal density due to 255K logic elements switching at core speeds. Per Altera thermal guidelines, design the PCB with at least 8 thermal vias in the BGA center pattern and connect to internal ground planes for heat spreading. For applications exceeding 60% utilization, consider forced-air cooling or a heatsink. Estimated: at 0.9V core and full toggle rate, static current alone reaches 3-5A, requiring a robust VRM solution with low-impedance bulk decoupling.
The 1152-ball FCBGA package uses 1.0 mm ball pitch, requiring a controlled-impedance PCB stackup with sequential lamination for the breakout region. Use microvia-in-pad or via-in-pad technology for clean signal egress below the BGA. Assign at least 4 inner layers to GND and 2 to PWR planes. Decoupling capacitors: 1uF X7R per 10 user I/O banks, plus 10uF bulk near each voltage rail pin. Follow Altera AN 532 for BGA escape routing recommendations.
Stratix III requires strict PCB layer stackup for DDR3 interfaces to meet 800 MHz operation. Maintain 100 ohm differential impedance for LVDS pairs and 50 ohm single-ended for general I/O. Reference Altera External Memory Interface Handbook for byte-lane swapping and length-matching rules. Configuration signals (TCK, TMS, TDI, TDO) require 4-layer routing away from switching signals to prevent false JTAG triggers.
Last-time-buy lifecycle status means EP3SE260F1152C3 inventory is finite; do not start new production designs on this part. Use the Altera Cyclone IV/V or Arria V/10 series for new designs requiring long-term supply. For existing Stratix III designs, place a final LTB order before the deadline to secure lifetime inventory. Verify per-pin capacitance settings and on-chip termination (OCT) calibration in the Quartus II pin planner before PCB fabrication.
Compliance Information
RoHS compliant per Altera product environmental compliance. Lead-free FCBGA package with halogen-free mold compound. Not AEC-Q100 qualified - this is a commercial-grade part; industrial-temperature variants use 'I' suffix.
