EP3SE260F1152C3N vs EP3SE110F1152C3N Comparison

Detailed side-by-side comparison of EP3SE260F1152C3N by Intel and EP3SE110F1152C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152C3N EP3SE110F1152C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $7,500.00 $1,560.00
Series Stratix III E Stratix III
Logic Elements / Cells 255,000 β€”
Embedded Memory Bits 16,672,768 bits β€”
Logic Array Blocks (LABs) 10,200 4,300
User I/O Count 744 β€”
Package 1152-BBGA, FCBGA β€”
Mounting Type Surface Mount Surface Mount
Process Technology 65 nm 65 nm TSMC
Core Voltage 1.1 V β€”
Operating Temperature 0 C to +85 C (Commercial) 0 Β°C to 85 Β°C (commercial)
Transceivers Integrated high-speed transceivers β€”
DSP Blocks Yes (dedicated multiplier/accumulator) Yes (embedded multipliers)
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) β€”
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II DDR/DDR2/DDR3 with read/write leveling
Configuration Modes AS, AP, PS, FPP, JTAG β€”
Partial Reconfiguration Supported β€”
Programmable Power Technology Yes (up to 50% dynamic power reduction) β€”
RoHS Status Compliant β€”
Family β€” Stratix III E
Logic Elements (LE) β€” 107,500
Total RAM Bits β€” 8,936,448
User I/Os β€” 744
Operating Frequency (max) β€” 500 MHz
Core Supply Voltage β€” 1.1 V nominal
I/O Supply Voltage β€” [DATA_NEEDED: I/O supply range]
Package Type β€” FC-FBGA-1152 (flip-chip BGA)
Speed Grade β€” C3
Mounting Style β€” SMD/SMT (Tray)
Memory Type β€” M9K and M144K block RAM
Boundary Scan β€” IEEE 1149.1 (JTAG)
RoHS β€” [DATA_NEEDED: RoHS status]
Lead-Free β€” Yes (per Altera/Intel datasheet family convention)

Datasheets & Resources

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