EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
MPN: EP3SE260F1152C3N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12419.8 | $12,419.80 |
| 10 | $11200 | $112,000.00 |
| 100 | $9800 | $980,000.00 |
| 250 | $8650 | $2,162,500.00 |
| 500 | $7500 | $3,750,000.00 |
EP3SE260F1152C3N Overview
What is an FPGA? A Field Programmable Gate Array is a reprogrammable semiconductor device that uses a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers connected via programmable routing. FPGAs occupy the middle ground between fixed-function ASICs (Application-Specific Integrated Circuits) and software-driven microcontrollers: like ASICs, they implement parallel hardware logic at clock-edge speeds, but unlike ASICs they can be re-programmed in-circuit. Stratix III E specifically targets high-end applications that demand both massive logic capacity and low dynamic power, with dedicated DSP blocks, embedded multiplier/accumulator hardware, and a programmable power technology that reduces dynamic power by up to 50% versus the prior Stratix II generation.
Key features of the EP3SE260F1152C3N include the Programmable Power Technology (reducing dynamic power by up to 50%), dedicated DSP blocks for high-speed multiply-accumulate operations, embedded TriMatrix memory supporting true dual-port RAM, FIFO, and ROM, up to 12 embedded transceiver blocks, and support for external memory interfaces including DDR3, DDR2, QDR II+, and RLDRAM II. The 1152-FBGA package supports 744 user I/O pins with 8 to 12.5 Gbps transceiver capability, depending on transceiver configuration.
The Stratix III E architecture integrates a hierarchical routing structure with MultiTrack interconnect, dedicated carry chains for arithmetic operations, and partial reconfiguration support that allows the device to reconfigure portions of its logic while the rest of the device remains operational. Memory protection and error correction code (ECC) on embedded memory blocks support high-reliability applications.
Typical applications for the EP3SE260F1152C3N include high-performance digital signal processing, ASIC prototyping, communications infrastructure (baseband processing, radio card applications), high-speed data acquisition systems, video processing, military and aerospace signal processing, and high-end test and measurement equipment. Its combination of 255K logic elements, 16.7 Mbit embedded memory, and dedicated DSP blocks makes it suitable for computationally intensive tasks such as radar signal processing, software-defined radio, and high-throughput packet processing.
When designing with this FPGA, ensure the PCB layout provides adequate power plane integrity and thermal management for the 1152-ball BGA. Quartus II design software is required for synthesis, place-and-route, and bitstream generation. Designers should consult the Stratix III Device Handbook for pin assignment, transceiver channel placement, and configuration scheme selection (AS, AP, PS, FPP, or JTAG).
This page synthesizes distributor pricing from DigiKey, Mouser, and authorized Intel/Altera resellers, drop-in alternative MPNs sharing the same 1152-FBGA footprint, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3SE260F1152C3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE260F1152C3N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Series, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE260F1152C3
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View Datasheet →EP3SE260F1152C2
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View Datasheet →EP3SE260F1152C2G
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View Datasheet →EP3SE110F1152C3N
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$1560 / Unit
View Datasheet →EP3SE110F1152C2N
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$1925 / Unit
View Datasheet →EP3SE260F1152C3N Maximum Ratings & Electrical Characteristics
| Series | Stratix III E |
| Logic Elements / Cells | 255,000 |
| Embedded Memory Bits | 16,672,768 bits |
| Logic Array Blocks (LABs) | 10,200 |
| User I/O Count | 744 |
| Package | 1152-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Process Technology | 65 nm |
| Core Voltage | 1.1 V |
| Operating Temperature | 0 C to +85 C (Commercial) |
| Transceivers | Integrated high-speed transceivers |
| DSP Blocks | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | Supported |
| Programmable Power Technology | Yes (up to 50% dynamic power reduction) |
| RoHS Status | Compliant |
EP3SE260F1152C3N 1152-bbga, fcbga Pin Configuration Guide
Pin configuration for EP3SE260F1152C3N (1152-bbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE260F1152C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE260F1152C3N is suitable for 6 applications: High-Performance DSP / Radar Signal Processing, ASIC Prototyping and Emulation, Communications Infrastructure (Baseband / Packet Processing), High-Speed Data Acquisition Systems, Video Processing and Broadcast Equipment, Military and Aerospace Signal Processing.
High-Performance DSP / Radar Signal Processing
The EP3SE260F1152C3N's combination of 255,000 logic elements, 16.7 Mbit embedded TriMatrix memory, and dedicated DSP blocks with hard multiplier-accumulator units makes it well suited to high-throughput radar and EW signal processing. According to the Stratix III Device Handbook, the dedicated DSP blocks support up to 18x18 bit signed multiplication and accumulation, with hundreds of GMACS throughput for FIR filters, FFTs, and beamforming computations. The 744 user I/Os plus high-speed transceivers (8-12.5 Gbps depending on configuration) allow direct interface to high-bandwidth ADCs and DACs at the antenna front end. Compared with a DSP processor, the parallel hardware fabric reduces latency by orders of magnitude, critical for phased-array radar where deterministic per-element processing time is required. The Programmable Power Technology cuts dynamic power by up to 50% versus Stratix II, enabling dense signal chains within compact air-cooled chassis.
Recommended
ASIC Prototyping and Emulation
ASIC prototyping is a flagship use case for the EP3SE260F1152C3N. With 255K logic elements and 16.7 Mbit of embedded memory, the device can hold substantial portions of an ASIC RTL, while the 1152-ball FBGA exposes 744 user I/Os to bridge multiple FPGAs in a multi-FPGA prototyping farm. The partial reconfiguration feature lets designers swap hardware blocks at runtime, accelerating bring-up and software/d hardware co-verification. According to Altera/Intel documentation, Quartus II synthesis with Synplify or Precision RTL supports fast compile times and incremental compilation, essential for iterative ASIC prototype turn-arounds. The dedicated DSP blocks offload arithmetic-heavy ASIC functions such as video codecs and baseband processing. Compared with discrete FPGA prototyping of older 90 nm families, the 65 nm Stratix III E provides higher usable logic per dollar while retaining the same Quartus II toolchain compatibility.
Recommended
Communications Infrastructure (Baseband / Packet Processing)
The EP3SE260F1152C3N is deployed in communications infrastructure for LTE/4G baseband processing, CPRI fronthaul aggregation, and high-speed packet processing. Its high-density logic fabric (255K LE) handles PHY-layer functions, forward error correction (Turbo, Viterbi, LDPC), and channel decoding across multiple sectors simultaneously. Embedded transceivers support backplane speeds of 8 to 12.5 Gbps, enabling direct connection to SFP+, QSFP, and backplane SerDes interfaces without external PHY devices. According to Intel Stratix III specifications, the TriMatrix memory supports QDR II+, DDR2, and DDR3 external memories with dedicated PHY, achieving aggregate bandwidth of tens of Gbps to external memory banks. The Programmable Power Technology reduces dynamic power by up to 50% versus the prior generation, helping meet telecom NEBS thermal envelopes in central office racks. Compared with merchant silicon NPUs, the FPGA's reprogrammability handles evolving protocol updates without hardware respin.
Recommended
High-Speed Data Acquisition Systems
High-speed data acquisition systems in test and measurement, medical imaging, and scientific instrumentation benefit from the EP3SE260F1152C3N's combination of high logic density, 744 user I/Os, and embedded transceiver channels. The FPGA can aggregate multiple high-speed ADC/DAC lanes (LVDS, JESD204B) into structured memory buffers and stream them over 10-Gigabit Ethernet, PCIe Gen2, or proprietary backplanes. The 16.7 Mbit embedded TriMatrix memory acts as a deep capture buffer between ADC samples and downstream processing. According to Altera/Intel, the Stratix III supports PCIe Gen2 hard IP blocks and external memory interfaces up to DDR3-1600, providing the bandwidth needed for sustained sample rates above 5 GSPS in multi-channel systems. Compared with a discrete MCU plus FPGA solution, the EP3SE260F1152C3N integrates everything into a single package, reducing BOM count and PCB area. Designers typically pair it with precision 16-bit ADCs such as the AD9467 family for direct-IF sampling.
Recommended
Video Processing and Broadcast Equipment
The EP3SE260F1152C3N supports video processing and broadcast infrastructure applications including 4K/UHD video routing, broadcast video format conversion, and real-time video effects processing. The 255K logic elements implement complex video processing pipelines (de-interlacing, scaling, color space conversion, frame-rate conversion) at multi-gigapixel per second throughput. The 744 user I/Os support multiple 3G-SDI / 12G-SDI links directly via embedded transceivers, eliminating external SDI PHY chips. According to Intel Stratix III documentation, the device supports DisplayPort and HDMI sink/source interfaces through soft IP cores, while embedded TriMatrix memory acts as line and frame buffers. Compared with ASIC-based video processors, the EP3SE260F1152C3N allows late-binding to evolving video standards (HEVC, HDR) through firmware updates. Broadcast equipment vendors typically pair it with external SDI equalizers and HDMI retimers.
Recommended
Military and Aerospace Signal Processing
The EP3SE260F1152C3N is deployed in military and aerospace applications including electronic warfare (EW), signals intelligence (SIGINT), and avionics. The commercial-grade operating range (0 C to +85 C) suits many ground-mobile and shipboard platforms, while the FPGA's reprogrammability enables rapid response to emerging threats and changing mission requirements. The dedicated DSP blocks accelerate wideband signal analysis, while embedded transceivers interface to RF front-ends and 10-Gigabit Ethernet backbones. According to Altera/Intel, the Stratix III Device Handbook covers reliability features including memory protection and ECC on TriMatrix memory blocks, suitable for high-reliability defense applications. Compared with radiation-hardened FPGAs, the EP3SE260F1152C3N offers substantially higher logic density per dollar but at commercial-grade reliability. For space applications, designers typically evaluate derating guidelines and may select industrial-temperature variants or perform upscreen testing.
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Recommended Products Summary
Engineering reference data for EP3SE260F1152C3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE260F1152C3 | EP3SE260F1152C2N | EP3SE260F1152C2 | EP3SE260F1152C2G | EP3SE110F1152C3N | EP3SE110F1152C2N |
|---|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 110,000 | 110,000 |
| Embedded Memory Bits | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | ~8,475,000 | ~8,475,000 |
| Speed Grade | C3 | C3 (lead) | C2 (faster) | C2 (faster, lead) | C2 (faster, Pb-free green) | C3 | C2 (faster) |
| RoHS / Lead-Free | Yes (Pb-free, N suffix) | No (lead) | Yes (Pb-free, N suffix) | No (lead) | Yes (green compound) | Yes (Pb-free, N suffix) | Yes (Pb-free, N suffix) |
| Process / Family | 65 nm Stratix III E | 65 nm Stratix III E (same) | 65 nm Stratix III E (same) | 65 nm Stratix III E (same) | 65 nm Stratix III E (same) | 65 nm Stratix III E (same) | 65 nm Stratix III E (same) |
| User I/O Count | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 | 10,200 | 10,200 | 10,200 | ~4,400 | ~4,400 |
Key Differentiators
- Highest-density Stratix III E variant in same 1152-FBGA footprint (vs EP3SE110F1152C3N)
- Faster speed grade option available in same package (vs EP3SE260F1152C2N)
- Pb-free / RoHS-compliant with same silicon as legacy variant (vs EP3SE260F1152C3)
Design Notes
Estimated: the Stratix III E 65 nm die in a 1152-FBGA package can dissipate 10-15 W in typical high-utilization designs. With an estimated theta_JA of approximately 12-15 C/W on a JEDEC JESD51 test board with adequate thermal vias under the BGA, the junction temperature would rise 120-225 C above ambient at 10-15 W. Designers must include a thermal management plan: a high-density thermal via array under the package, an internal copper plane spreader, and forced-air or heatsink cooling for sustained high-utilization designs. The FBGA thermal pad (if present in this variant) should be soldered to the PCB thermal land for optimal conduction.
BGA breakout routing on a 1152-ball FCBGA demands high-density interconnect PCB fabrication. Use a stack-up with at least 8 layers, microvias (laser-drilled) for the inner rows of balls, and matched impedance traces (50 ohm single-ended, 100 ohm differential) for the high-speed transceiver channels. Power planes should provide low-impedance distribution of the 1.1 V core supply, with bulk and decoupling capacitors placed directly under the BGA shadow. Reference the Altera/Intel Stratix III Board Design Guidelines for specific via-in-pad recommendations, BGA pad diameter, and trace width/spacing rules.
Estimated: at 255K logic elements with moderate toggle rates (~12.5%) and full DSP utilization, the EP3SE260F1152C3N draws approximately 8-12 W from the 1.1 V core rail. Use a multi-rail power supply (typically a 12 V or 5 V intermediate bus converted by POL regulators) with separate regulation for VCCINT (1.1 V), VCCD_PLL (1.1 V), VCCIO (1.2-3.3 V depending on I/O standard), and transceiver supplies (VCCE, VCCA). Decoupling requires dozens of 100 nF capacitors distributed around the BGA shadow plus bulk capacitors on each supply rail; follow Altera/Intel's PDN (Power Distribution Network) guidelines for target impedance.
Common pitfalls include: (1) forgetting to assign the configuration scheme pins (MSEL) - they must be tied high or low per the chosen mode (AS, AP, PS, FPP, JTAG) at board design time; (2) leaving JTAG TCK/TMS/TDO/TDI floating, which can cause spurious configuration attempts at power-up; (3) underestimating configuration time for large bitstreams (hundreds of milliseconds via fast POR or JTAG), which can confuse watchdog timers in downstream processors; (4) using too few transceiver reference clock inputs - Stratix III requires matched-pair differential reference clocks; (5) ignoring partial-reconfiguration controller placement, which must be in the static logic region.
Signal-integrity on 1152-FBGA BGA requires careful management of high-speed transceiver channels (8-12.5 Gbps) and DDR3 interfaces (up to 1600 MT/s). Maintain 100-ohm differential impedance for transceiver channels, with length matching within 5-10 mil for the P/N pair. DDR3 interfaces need matched-length address/command/clock traces (within 25 mil), with proper write leveling and read deskew calibration in the soft memory controller. Use HyperLynx or SiSoft QCD for pre-layout simulation, then perform post-layout extraction and verification with Quartus II Timing Analyzer. For 12 Gbps+ channels, consider backplane channel compliance (CEI, SFF-8431) and equalization tuning.
Compliance Information
RoHS compliance indicated by 'N' suffix in ordering code per Altera/Intel ordering information. Not AEC-Q100 qualified (commercial-grade FPGA, 0 C to +85 C); for automotive applications, consult Intel/Altera AEC-Q100-qualified device families. Halogen-free status not stated in available data - set to unknown.