EP3SE260F1152C3N vs EP3SE260F1152C4N Comparison

Detailed side-by-side comparison of EP3SE260F1152C3N by Intel and EP3SE260F1152C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152C3N EP3SE260F1152C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $7,500.00 $1,620.00
Series Stratix III E Stratix III E
Logic Elements / Cells 255,000 β€”
Embedded Memory Bits 16,672,768 bits β€”
Logic Array Blocks (LABs) 10,200 β€”
User I/O Count 744 β€”
Package 1152-BBGA, FCBGA 1152-ball FC-FBGA (flip-chip)
Mounting Type Surface Mount Surface Mount (BGA)
Process Technology 65 nm 65 nm CMOS
Core Voltage 1.1 V 1.1 V
Operating Temperature 0 C to +85 C (Commercial) 0C to +85C (commercial, 'C' suffix)
Transceivers Integrated high-speed transceivers β€”
DSP Blocks Yes (dedicated multiplier/accumulator) β€”
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) β€”
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II β€”
Configuration Modes AS, AP, PS, FPP, JTAG β€”
Partial Reconfiguration Supported β€”
Programmable Power Technology Yes (up to 50% dynamic power reduction) β€”
RoHS Status Compliant β€”
Family β€” Stratix III (Enhanced)
Logic Elements (LEs) β€” 255,000
Embedded Memory β€” 16,672,768 bits (16.67 Mbit)
Maximum User I/Os β€” 744
Number of LABs/CLBs β€” 10,200
DSP / 18x18 Multipliers β€” 768 embedded multipliers
Maximum Operating Frequency β€” 450 MHz
Speed Grade β€” -4 (commercial temperature)
Packaging β€” Tray
Lead-Free / RoHS β€” Lead-free finish (RoHS compliant per distributor listing)
Memory Type β€” SRAM-based, volatile (requires configuration device)
Configuration β€” External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status β€” Obsolete (per Xecor cross-reference data)

Datasheets & Resources

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