EP3SE260F1152C3N vs EP3SE260F1152I3 Comparison

Detailed side-by-side comparison of EP3SE260F1152C3N by Intel and EP3SE260F1152I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152C3N EP3SE260F1152I3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $7,500.00 $16,500.00
Series Stratix III E Stratix III E (EP3SE260)
Logic Elements / Cells 255,000 β€”
Embedded Memory Bits 16,672,768 bits β€”
Logic Array Blocks (LABs) 10,200 β€”
User I/O Count 744 744
Package 1152-BBGA, FCBGA 1152-BBGA, FC-FBGA (Flip-Chip)
Mounting Type Surface Mount Surface Mount
Process Technology 65 nm 65 nm
Core Voltage 1.1 V 1.1 V
Operating Temperature 0 C to +85 C (Commercial) -40C to +100C (Industrial)
Transceivers Integrated high-speed transceivers β€”
DSP Blocks Yes (dedicated multiplier/accumulator) β€”
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) β€”
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II β€”
Configuration Modes AS, AP, PS, FPP, JTAG β€”
Partial Reconfiguration Supported β€”
Programmable Power Technology Yes (up to 50% dynamic power reduction) β€”
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Logic Elements β€” 255,000
Number of LABs/CLBs β€” 10,200
Total RAM Bits β€” 16,672,768
Number of Embedded Multipliers (DSP blocks) β€” 768
Maximum Fabric Frequency β€” 500 MHz
Speed Grade β€” I3 (Industrial, speed bin 3)
MSL Level β€” [DATA_NEEDED: MSL level]
Product Status β€” Obsolete (per Xecor comparator)

Datasheets & Resources

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