EP3SE260F1152C4LN vs EP3SE260F1152C4N Comparison

Detailed side-by-side comparison of EP3SE260F1152C4LN by Intel and EP3SE260F1152C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE260F1152C4LN EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel

EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel

EP3SE260F1152C4LN ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE260F1152C4LN EP3SE260F1152C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $1,400.00 $1,620.00
Family Stratix III E Stratix III (Enhanced)
Logic Elements (LE) 255,000 β€”
Embedded Memory 16,672,768 bits 16,672,768 bits (16.67 Mbit)
Logic Array Blocks (LABs) 10,200 β€”
User I/Os 744 β€”
Package 1152-ball FC-BGA 1152-ball FC-FBGA (flip-chip)
Process Technology 65 nm CMOS 65 nm CMOS
Core Voltage 0.9 V 1.1 V
Core Clock Speed 375 MHz (max) β€”
Transceiver Data Rate 717 MHz β€”
Speed Grade C4 -4 (commercial temperature)
Operating Temperature 0C to +85C (commercial) 0C to +85C (commercial, 'C' suffix)
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
MSL Level [DATA_NEEDED: MSL level] β€”
RoHS Status Compliant β€”
Series β€” Stratix III E
Logic Elements (LEs) β€” 255,000
Maximum User I/Os β€” 744
Number of LABs/CLBs β€” 10,200
DSP / 18x18 Multipliers β€” 768 embedded multipliers
Maximum Operating Frequency β€” 450 MHz
Packaging β€” Tray
Lead-Free / RoHS β€” Lead-free finish (RoHS compliant per distributor listing)
Memory Type β€” SRAM-based, volatile (requires configuration device)
Configuration β€” External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status β€” Obsolete (per Xecor cross-reference data)

Datasheets & Resources

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