EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel
MPN: EP3SE260F1152C4LN ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1500 | $750,000.00 |
| 1,000 | $1400 | $1,400,000.00 |
EP3SE260F1152C4LN Overview
A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic elements (LEs), dedicated block RAM, DSP blocks, and high-speed transceivers, all wired through a programmable interconnect. The Stratix III E family specifically targets high-performance applications requiring high logic density, abundant DSP resources, and multi-gigabit serial I/O. FPGAs sit at the same hierarchy tier as ASICs in digital design, but unlike ASICs they are reconfigurable after manufacture, making them ideal for prototyping, low-volume production, and designs requiring late-stage logic changes.
Key features of this device include 384 (24x16) embedded 18x18 multipliers supporting up to 136 GMACS DSP throughput, a hierarchical clock network with up to 16 global clocks, programmable power technology that reduces dynamic power by up to 50% versus Stratix II, and integrated PLLs with fractional-n synthesis. The high-pin-count FC-BGA-1152 package supports high-speed memory interfaces including DDR3 up to 800 MHz and RLDRAM II, making the device suitable for memory-intensive signal processing and data-path applications.
Typical applications include high-end wireline telecom line cards, defense and radar signal processing, ASIC prototyping, high-performance DSP pipelines, and test and measurement backplanes. The C4 speed grade and 0°C to +85°C (commercial) operating range target mainstream embedded and communications designs.
When designing with this device, pay close attention to power integrity: a Stratix III E at full utilization may dissipate more than 20 W and requires a multi-layer PCB with a low-impedance core/IO supply distribution network. Pin-compatible variants in this family include speed-grade and temperature-grade options that allow the same PCB to be populated for different deployment scenarios.
Drop-in alternatives for EP3SE260F1152C4LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE260F1152C4LN (same form factor and footprint) — differing in Package, Family, Operating Temperature, Process Technology, Core Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE260F1152C4L
✅ Drop-In✓ In Stock
$1950 / Unit
View Datasheet →EP3SE260F1152C4N
✅ Drop-In✓ In Stock
$1620 / Unit
View Datasheet →EP3SE260F1152C4
✅ Drop-In✓ In Stock
$8900 / Unit
View Datasheet →EP3SE260F1152C3N
✅ Drop-In✓ In Stock
$7500 / Unit
View Datasheet →EP3SE260F1152C2N
✅ Drop-In✓ In Stock
$11000 / Unit
View Datasheet →EP3SE110F1152C4N
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP3SE260F1152C4LN Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements (LE) | 255,000 |
| Embedded Memory | 16,672,768 bits |
| Logic Array Blocks (LABs) | 10,200 |
| User I/Os | 744 |
| Package | 1152-ball FC-BGA |
| Process Technology | 65 nm CMOS |
| Core Voltage | 0.9 V |
| Core Clock Speed | 375 MHz (max) |
| Transceiver Data Rate | 717 MHz |
| Speed Grade | C4 |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EP3SE260F1152C4LN 1152-ball fc-bga Pin Configuration Guide
Pin configuration for EP3SE260F1152C4LN (1152-ball fc-bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE260F1152C4LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE260F1152C4LN is suitable for 7 applications: High-Performance DSP and Signal Processing, Wireline Telecom Line Cards, ASIC Prototyping and Emulation, Defense and Radar Signal Processing, Test and Measurement Instrumentation, Medical Imaging Systems, High-Speed Memory Buffer and Switch Fabrics.
High-Performance DSP and Signal Processing
The EP3SE260F1152C4LN's 255,000 logic elements and 384 embedded 18x18 multipliers make it well suited for high-performance DSP pipelines. With up to 136 GMACS throughput and a 375 MHz core clock, this Stratix III E FPGA can implement multi-channel baseband processing, FFT engines, and FIR filter banks used in 4G/5G base stations and software-defined radio platforms. The 16,672,768 bits of embedded block RAM provide on-chip storage for large sample buffers and coefficient tables, reducing external memory access and latency.
Recommended
Wireline Telecom Line Cards
Wireline telecom line cards require high logic density for packet processing, traffic shaping, and queuing algorithms. The EP3SE260F1152C4LN's 10,200 LABs and 744 user I/Os enable dense implementation of 10G/40G Ethernet MACs, framers, and OTN mappers on a single device. The 1152-FCBGA package supports multiple SFI/XFI high-speed serial lanes at 717 MHz data rate, while DDR3 controller IP delivers up to 800 MHz memory bandwidth for table lookups and statistics counters. Programmable power technology reduces dynamic power versus prior Stratix generations.
Recommended
ASIC Prototyping and Emulation
The EP3SE260F1152C4LN provides 255K logic elements with rich embedded memory and DSP resources, making it ideal for ASIC prototyping where multiple chips can be partitioned across an FPGA array. Designers partition a multi-million-gate ASIC into multiple Stratix III E FPGAs, using the GTL/HT/LVDS transceivers between devices to extend the effective logic capacity. The 1152-FCBGA package exposes enough user I/Os to support multi-FPGA prototyping boards with high-speed interconnect.
Recommended
Defense and Radar Signal Processing
Defense radar systems require real-time processing of high-bandwidth IF signals, beamforming, and pulse compression. The EP3SE260F1152C4LN supports 384 multipliers at 375 MHz, providing more than 100 GMACS of DSP throughput suitable for phased-array radar beamforming across hundreds of antenna elements. The 16.67 Mbit of embedded memory enables large FFT window storage and CFAR threshold tables, while the 744 I/Os interface to high-speed ADCs and DACs used in modern radar front-ends.
Recommended
Test and Measurement Instrumentation
Test and measurement equipment such as oscilloscopes, logic analyzers, and protocol testers demand deep memory buffers and high-speed serial interfaces. The EP3SE260F1152C4LN's 16.67 Mbit embedded memory captures deep waveform records at full sample rate, while the 717 MHz transceivers interface to 10 Gbps serial links for protocol analysis. The 744 user I/Os support parallel LVDS ADC/DAC interfaces at hundreds of MHz, enabling wideband digitizer and signal generator subsystems.
Recommended
Medical Imaging Systems
Medical imaging modalities such as CT, MRI, and ultrasound require real-time processing of high-resolution image streams. The EP3SE260F1152C4LN's 384 multipliers and 16.67 Mbit embedded memory enable multi-slice image reconstruction, real-time beamforming in ultrasound front-ends, and FFT-based MRI reconstruction pipelines. The 1152-FCBGA package supports the high-speed ADC interface requirements of modern medical imaging chains, while the Stratix III E power optimization reduces heat dissipation in clinical environments.
Recommended
High-Speed Memory Buffer and Switch Fabrics
Enterprise switch fabrics and storage controllers require deep buffer memory and high-radix interconnect. The EP3SE260F1152C4LN's 16.67 Mbit embedded memory supports deep packet buffers and queue tables, while the 744 user I/Os enable parallel interconnect to multiple DDR3 memory channels and SAS/SATA PHYs. Programmable PLLs with fractional-n synthesis provide precise clock synthesis for serializer/deserializer lanes operating at non-standard rates for storage and networking applications.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE260F1152C4LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE260F1152C4L | EP3SE260F1152C4N | EP3SE260F1152C3N | EP3SE260F1152C2N | EP3SE110F1152C4N |
|---|---|---|---|---|---|---|
| Package | 1152-ball FC-BGA | 1152-ball FC-BGA | 1152-ball FC-BGA | 1152-ball FC-BGA | 1152-ball FC-BGA | 1152-ball FC-BGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 110,000 |
| Speed Grade | C4 (commercial) | C4 (commercial) | C4 (commercial) | C3 (commercial, slower) | C2 (commercial, slowest) | C4 (commercial) |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Highest logic density in the Stratix III E family at 255K LE (vs EP3SE110F1152C4N)
- Faster speed grade (C4) versus C3/C2 variants (vs EP3SE260F1152C2N)
- Lower-power variant (LN) for power-constrained applications (vs EP3SE260F1152C4N)
Design Notes
Stratix III E devices at full logic utilization may exceed 20 W core power. Estimated: at 255K LE utilization with 0.9 V VCC and 50% toggle rate, core power is roughly 15-20 W depending on clock frequency. Use a multi-layer PCB with a dedicated 0.9 V plane and at least 8 decoupling capacitors (1 uF and 0.1 uF) per VCC pin cluster, plus bulk capacitance of 220 uF near the regulator. Programmable power technology should be enabled in Quartus II to reduce dynamic power on unused LABs.
The 1152-ball FC-BGA package has a thermal resistance (theta_JA) in the range of 0.5-0.8 C/W with proper thermal via array design. Estimated: at 20 W core power dissipation on a 1 oz copper 12-layer PCB with full via array, junction-to-ambient thermal resistance is approximately 0.6 C/W, yielding 12 C rise above ambient. For forced-air cooling, design for at least 200 LFM airflow; for convection-only, use a heat spreader or heat sink attached to the package lid.
BGA breakout requires via-in-pad or dog-bone via pattern with 0.5 mm pitch compatible with the FC-BGA land pattern. Use 0.2 mm finished via diameter with 1 oz copper plating. Recommend 8-layer PCB stackup with dedicated power/ground planes for VCC (0.9 V), VCCIO (1.2-3.3 V), and VCCA/VCCP_PLL analog supplies. Maintain at least 4 ground vias per ground pad cluster for low-impedance return paths at transceiver frequencies.
Do not mix LVDS and LVTTL in the same I/O bank without checking VCCIO compatibility - the EP3SE260 has 8-12 I/O banks with independent VCCIO rails. Always assign all VREF pins even if the corresponding I/O standard is not used. Hot-socketing is not supported on Stratix III E without specific configuration pin sequencing; do not insert or remove the device with power applied.
Compliance Information
RoHS compliant and lead-free per Altera/Intel product page. AEC-Q100 not applicable as this is a commercial-grade FPGA, not an automotive qualified part.
