EP3SE260F1152C4N vs EP3SE260F1152C2G Comparison

Detailed side-by-side comparison of EP3SE260F1152C4N by Intel and EP3SE260F1152C2G by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152C4N EP3SE260F1152C2G
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $1,620.00 $2,050.00
Series Stratix III E EP3SE260
Family Stratix III (Enhanced) Stratix III E
Logic Elements (LEs) 255,000 β€”
Embedded Memory 16,672,768 bits (16.67 Mbit) β€”
Maximum User I/Os 744 β€”
Number of LABs/CLBs 10,200 β€”
DSP / 18x18 Multipliers 768 embedded multipliers β€”
Process Technology 65 nm CMOS β€”
Core Voltage 1.1 V 1.1 V
Maximum Operating Frequency 450 MHz β€”
Package 1152-ball FC-FBGA (flip-chip) 1152-BBGA, FCBGA (FineLine BGA)
Speed Grade -4 (commercial temperature) C2 (commercial)
Operating Temperature 0C to +85C (commercial, 'C' suffix) β€”
Mounting Type Surface Mount (BGA) Surface Mount
Packaging Tray β€”
Lead-Free / RoHS Lead-free finish (RoHS compliant per distributor listing) β€”
Memory Type SRAM-based, volatile (requires configuration device) β€”
Configuration External EPCS / enhanced configuration via AS, PS, JTAG, or FPP β€”
Product Status Obsolete (per Xecor cross-reference data) β€”
Logic Elements / Cells β€” 255000
Total RAM Bits β€” 16672768
Number of LABs / CLBs β€” 10200
Number of I/O β€” 744
Number of Terminals β€” 1152
Package Code β€” BGA (Ball Grid Array)
Package Shape β€” Square
Technology / Process Node β€” 65 nm
Lead-Free (RoHS) β€” Yes (G suffix)
Operating Temperature Grade β€” Commercial (C)
Supply Packaging β€” Tray
RoHS Status β€” Compliant (G suffix)

Datasheets & Resources

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