EP3SE260F1152C4N vs EP3SE260F1152C3N Comparison
Detailed side-by-side comparison of EP3SE260F1152C4N by Intel and EP3SE260F1152C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N β ActiveSpecification Comparison
| Parameter | EP3SE260F1152C4N | EP3SE260F1152C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,620.00 | $7,500.00 |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III (Enhanced) | β |
| Logic Elements (LEs) | 255,000 | β |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | β |
| Maximum User I/Os | 744 | β |
| Number of LABs/CLBs | 10,200 | β |
| DSP / 18x18 Multipliers | 768 embedded multipliers | β |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Operating Frequency | 450 MHz | β |
| Package | 1152-ball FC-FBGA (flip-chip) | 1152-BBGA, FCBGA |
| Speed Grade | -4 (commercial temperature) | β |
| Operating Temperature | 0C to +85C (commercial, 'C' suffix) | 0 C to +85 C (Commercial) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | β |
| Lead-Free / RoHS | Lead-free finish (RoHS compliant per distributor listing) | β |
| Memory Type | SRAM-based, volatile (requires configuration device) | β |
| Configuration | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP | β |
| Product Status | Obsolete (per Xecor cross-reference data) | β |
| Logic Elements / Cells | β | 255,000 |
| Embedded Memory Bits | β | 16,672,768 bits |
| Logic Array Blocks (LABs) | β | 10,200 |
| User I/O Count | β | 744 |
| Transceivers | β | Integrated high-speed transceivers |
| DSP Blocks | β | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | β | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | β | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | β | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | β | Supported |
| Programmable Power Technology | β | Yes (up to 50% dynamic power reduction) |
| RoHS Status | β | Compliant |