EP3SE260F1517C2G vs EP3SE260F1517C3N Comparison

Detailed side-by-side comparison of EP3SE260F1517C2G by Intel and EP3SE260F1517C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE260F1517C3N EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE260F1517C2G EP3SE260F1517C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $2,050.00 $9,850.00
Family Stratix III E Stratix III E
Logic Elements 254,400 254,400
Adaptive Logic Modules (ALMs) 81,760 β€”
Total Memory Bits 16,727,680 (16.67 Mbit) β€”
Embedded Memory (M9K Blocks) 864 β€”
Embedded Multipliers (18x18) 768 β€”
User I/O Pins 976 β€”
Transceiver Channels 12 β€”
Transceiver Data Rate (max) 3.75 Gbps (C2 grade) β€”
PLLs (Fractional + Clock Multiplier) 8 fractional + 4 CMU β€”
Global Clock Networks 20 16
Package 1517-ball FCBGA, 40x40 mm 1517-BBGA (FCBGA)
Speed Grade C2 (commercial, ~6 ns) C3 (commercial)
Operating Temperature 0C to 85C (commercial, "C" suffix) β€”
Process Node 40 nm TSMC β€”
RoHS Status Compliant Compliant
Lead-Free / Halogen-Free Yes / Yes β€”
Embedded Memory β€” 16,672,768 bits (16.7 Mbits)
User I/Os β€” 976
DSP Blocks (18x18 Multipliers) β€” 816
M9K Memory Blocks β€” 1,040
Maximum Transceiver Data Rate β€” 600 Mbps
PLLs β€” 4
Process Technology β€” 65 nm TSMC low-power CMOS
Operating Junction Temperature β€” 0 C to +85 C (commercial)
Mounting Type β€” Surface Mount
External Memory Interfaces β€” DDR3, DDR2, QDRII+, RLDRAM2

Datasheets & Resources

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