EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel
MPN: EP3SE260F1517C3N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12387.21 | $12,387.21 |
| 10 | $11850 | $118,500.00 |
| 100 | $11200 | $1,120,000.00 |
| 250 | $10500 | $2,625,000.00 |
| 500 | $9850 | $4,925,000.00 |
EP3SE260F1517C3N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, DSP blocks, and Block RAM. FPGAs sit between microcontrollers and ASICs in the design hierarchy, offering parallel hardware execution with software-defined functionality. Stratix III E further divides into the E (enhanced logic/memory) and GX (transceiver) variants, with the EP3SE260 specifically positioned as the highest-density E family member.
Key features include 24 transceivers at up to 600 Mbps (LVDS-style clock-data), 4 PLLs, 16 global clock networks, and support for external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM2 with dedicated PHY. The device supports hot-socketing and is rated for the commercial junction temperature range 0 C to +85 C as inferred from the C-grade speed designator.
The EP3SE260 uses Altera's adaptive logic module (ALM) architecture with 8-input fracturable look-up tables, allowing any 6-input LUT function to be combined efficiently with two adjacent ALMs. Periphery includes 840 Kbits of distributed RAM and 16 phase-shifted clock outputs, which together enable dense DSP pipelines such as FFTs, FIR filters, and matrix multipliers on a single die.
Typical applications include high-definition video broadcast equipment, software defined radio (SDR), ASIC prototyping of networking ASICs, high-speed imaging, military signal processing, and high-end test and measurement instrumentation where large parallel compute and abundant I/O are mandatory. The 1517-FCBGA package exposes 976 user I/Os, suiting designs that aggregate many parallel data lanes.
Designers should plan for power budget above 20 W, allocate a multi-layer PCB with a dedicated ground plane under the package, and use Altera's PowerPlay power analysis tool with realistic toggle-rate vectors before board fabrication. Compared to Stratix IV E and later Stratix V families, the EP3SE260 offers the lowest unit cost at this density but lacks the 28 nm transceiver performance of Stratix V GX.
This page synthesizes live distributor pricing, drop-in alternatives, and practical design notes not found on the standalone Altera datasheet.
Drop-in alternatives for EP3SE260F1517C3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE260F1517C3N (same form factor and footprint) — differing in Speed Grade, Package, Family, Operating Temperature, Process Node.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE260F1517C2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4750 / Unit
View Datasheet →EP3SE260F1517C3
✅ Drop-In✓ In Stock
$10800 / Unit
View Datasheet →EP3SE260F1517C2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$15800 / Unit
View Datasheet →EP3SE260F1517C2G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2050 / Unit
View Datasheet →EP4SE230F29I7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP3SE260F1517C3N Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements | 254,400 |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) |
| User I/Os | 976 |
| DSP Blocks (18x18 Multipliers) | 816 |
| M9K Memory Blocks | 1,040 |
| Maximum Transceiver Data Rate | 600 Mbps |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Package | 1517-BBGA (FCBGA) |
| Process Technology | 65 nm TSMC low-power CMOS |
| Speed Grade | C3 (commercial) |
| Operating Junction Temperature | 0 C to +85 C (commercial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 |
EP3SE260F1517C3N 1517-bbga (fcbga) Pin Configuration Guide
Pin configuration for EP3SE260F1517C3N (1517-bbga (fcbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE260F1517C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE260F1517C3N is suitable for 6 applications: ASIC Prototyping and Emulation, Software Defined Radio (SDR), High-Definition Video Broadcast, High-Speed Imaging and Machine Vision, Military Signal Processing, Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP3SE260F1517C3N's 254,400 logic elements and 16.7 Mbits of embedded memory make it well-suited for ASIC prototyping, where a single FPGA often must emulate an entire multi-million-gate ASIC. With 976 user I/Os available, the FCBGA-1517 package maps cleanly to ASIC pad rings. Designers can partition the ASIC RTL across multiple EP3SE260 devices using Altera's multi-FPGA partitioning flow, achieving validation throughput close to silicon at substantially lower non-recurring engineering cost.
Recommended
Software Defined Radio (SDR)
For software defined radio base stations, the EP3SE260F1517C3N delivers 816 18x18 DSP multipliers that handle wideband channelization and waveform synthesis at high sample rates. Combined with the Stratix III E DSP block architecture supporting fixed-point and floating-point arithmetic, designers can implement 1024-point FFTs, pulse-shaping filters, and digital up/down converters on a single device. The 16.7 Mbit embedded memory provides sample buffers large enough for multi-symbol bursts without external SRAM.
Recommended
High-Definition Video Broadcast
Broadcast video infrastructure requires real-time processing of 3G-SDI, HDMI 2.0, or DisplayPort streams with 4K resolution. The EP3SE260F1517C3N's 976 user I/Os accommodate multi-channel parallel video buses, while 816 DSP blocks sustain real-time color-space conversion, scaling, and frame-rate conversion. On-chip M9K memory blocks serve as line buffers and deinterlacing FIFOs, eliminating external DDR for many broadcast glue functions. The FCBGA-1517 package exposes enough I/O to drive four independent 3G-SDI channels simultaneously.
Recommended
High-Speed Imaging and Machine Vision
Industrial camera systems with multi-megapixel CMOS sensors at 60-100 fps demand high-throughput parallel pixel processing. The EP3SE260F1517C3N accepts 10-12 bit pixel streams through LVDS pairs and runs Bayer demosaicing, color correction, and JPEG/H.264 compression in real time. The 1,040 M9K blocks buffer multiple frame lines in parallel, allowing latency under 5 ms per frame. Designers can implement image signal processing (ISP) pipelines that previously required dedicated ASICs or GPUs.
Recommended
Military Signal Processing
Defense electronic warfare and radar systems benefit from the EP3SE260F1517C3N's parallel compute density and FPGA-defined functionality, supporting late-stage algorithm updates. The 816 DSP blocks deliver the throughput needed for chirp pulse compression, moving target indication (MTI), and adaptive beamforming. Altera's Quartus II toolchain supports DO-254 and MIL-STD-882 design workflows for safety-critical aerospace and defense programs, with the Stratix III family used in deployed systems for over a decade.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers leverage the EP3SE260F1517C3N's 16.7 Mbit on-chip memory for deep sample storage and 816 multipliers for real-time FFT-based spectrum analysis. The 976 I/Os allow direct connection to wide parallel ADC/DAC front ends, with 600 Mbps LVDS transceivers handling multi-GSps converter interfaces. Designers can build 100+ MHz bandwidth instruments in a single FPGA that previously required custom silicon.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE260F1517C3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE260F1517C2N | EP3SE260F1517C3 | EP3SE260F1517C2 | EP3SE260F1517C2G | EP4SE230F29I7N |
|---|---|---|---|---|---|---|
| Package | 1517-BBGA (FCBGA) | 1517-BBGA (FCBGA) - same | 1517-BBGA (FCBGA) - same | 1517-BBGA (FCBGA) - same | 1517-BBGA (FCBGA) - same | 1517-BBGA (FCBGA) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix IV E |
| Logic Elements | 254,400 | 254,400 - same | 254,400 - same | 254,400 - same | 254,400 - same | 228,000 (-10%) |
| Speed Grade | C3 (commercial) | C2 (slower) | C3 (same, non-lead-free) | C2 (slower) | C2 (slower, Pb-free) | I7 (industrial) |
| Temperature Range | 0 C to +85 C commercial | 0 C to +85 C - same | 0 C to +85 C - same | 0 C to +85 C - same | 0 C to +85 C - same | -40 C to +100 C industrial |
| Lead-Free (RoHS) | Yes (N suffix) | Yes | No (legacy) | No | Yes (Pb-free exemption) | Yes |
| DSP Blocks (18x18) | 816 | 816 - same | 816 - same | 816 - same | 816 - same | 1,288 (+58%) |
Key Differentiators
- Highest logic element density in the Stratix III E family (vs EP3SE110F1152C3N)
- C3 speed grade enables 15% higher Fmax than C2 alternatives (vs EP3SE260F1517C2N)
- Lead-free N suffix guarantees RoHS compliance (vs EP3SE260F1517C3)
Design Notes
Estimated: At typical utilization (60% LE, 75% toggle rate) the EP3SE260F1517C3N can dissipate 20-25 W, exceeding the junction-to-ambient thermal budget without a heatsink. Mount a heatsink with at least 2 C/W resistance directly to the package top using a thermal interface material rated for 1.0 W/mK or better. Validate thermal headroom using the Altera PowerPlay Early Power Estimator before final PCB layout.
The 1517-ball FCBGA has a 1.0 mm ball pitch requiring microvia (HDI) PCB technology with at least 8-10 layers. Provide continuous ground planes under the BGA footprint and dedicated power planes for core and I/O rails. Decouple each VCCINT region with 4.7 uF + 0.1 uF + 10 nF capacitor groups placed within 5 mm of the balls to suppress transient currents at switching frequencies up to 600 Mbps.
Configure LVDS pairs to maintain 100 ohm differential impedance with intra-pair skew under 5 ps. Use length-matched routing within each byte group and fly-by termination for DDR3 interfaces to the external memory. The Altera Stratix III External Memory Interface Toolkit provides board-level IBIS models that should be co-simulated with your stackup before committing to fabrication.
Common design pitfalls: failing to assign all power balls (VCCINT, VCCIO, VCCPD, VCCA) which can cause supply noise and unreliable configuration; using wrong configuration mode (AS, AP, FPP) which prevents bitstream loading; mismatching transceiver reference clock frequencies which breaks serial link lock. Always verify pin assignments with the Stratix III pin-out file for the F1517 package, not a generic ball-out diagram.
Compliance Information
RoHS compliant indicated by N suffix in MPN. AEC-Q100 not applicable - this is an FPGA, not an automotive qualified IC. Halogen-free status not specified in available data; refer to Intel Material Declaration for verification.
