EP3SE260F1517C3 vs EP3SE260F1517C3N Comparison
Detailed side-by-side comparison of EP3SE260F1517C3 by Intel and EP3SE260F1517C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260F1517C3
EP3SE260F1517C3 - Stratix III E FPGA 255K LE | Intel | 1517-FBGA
EP3SE260F1517C3 β ActiveIntel
EP3SE260F1517C3N
EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel
EP3SE260F1517C3N β Last Time BuySpecification Comparison
| Parameter | EP3SE260F1517C3 | EP3SE260F1517C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $10,800.00 | $9,850.00 |
| Manufacturer | Intel (formerly Altera) | β |
| Series | Stratix III E | β |
| Logic Elements | 255,000 | 254,400 |
| Logic Array Blocks (LABs) | 10,200 | β |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | 16,672,768 bits (16.7 Mbits) |
| User I/Os | 976 | 976 |
| DSP Blocks (18x18 multipliers) | 768 | β |
| PLLs | 12 | 4 |
| Core Voltage | 0.9 V | β |
| Process Node | 65 nm (TSMC) | β |
| Package | 1517-BBGA, FCBGA (FineLine BGA) | 1517-BBGA (FCBGA) |
| Package Pitch | 1.0 mm | β |
| Operating Temperature Grade | Commercial (C suffix) | β |
| Speed Grade | 3 | C3 (commercial) |
| Configuration | SRAM-based, requires external configuration device | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant | Compliant |
| Family | β | Stratix III E |
| DSP Blocks (18x18 Multipliers) | β | 816 |
| M9K Memory Blocks | β | 1,040 |
| Maximum Transceiver Data Rate | β | 600 Mbps |
| Global Clock Networks | β | 16 |
| Process Technology | β | 65 nm TSMC low-power CMOS |
| Operating Junction Temperature | β | 0 C to +85 C (commercial) |
| External Memory Interfaces | β | DDR3, DDR2, QDRII+, RLDRAM2 |