EP3SE260F1517C3N vs EP3SE260F1517C4N Comparison
Detailed side-by-side comparison of EP3SE260F1517C3N by Intel and EP3SE260F1517C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE260F1517C3N | EP3SE260F1517C4N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9,850.00 | $7,800.00 |
| Family | Stratix III E | Field-Programmable Gate Array (FPGA) |
| Logic Elements | 254,400 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) | 16,672,768 bits |
| User I/Os | 976 | โ |
| DSP Blocks (18x18 Multipliers) | 816 | โ |
| M9K Memory Blocks | 1,040 | โ |
| Maximum Transceiver Data Rate | 600 Mbps | 12.5 Gbps |
| PLLs | 4 | โ |
| Global Clock Networks | 16 | โ |
| Package | 1517-BBGA (FCBGA) | 1517-BBGA, FCBGA |
| Process Technology | 65 nm TSMC low-power CMOS | โ |
| Speed Grade | C3 (commercial) | โ |
| Operating Junction Temperature | 0 C to +85 C (commercial) | โ |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | โ |
| Series | โ | Stratixยฎ III E |
| Logic Array Blocks (LABs) | โ | 10,200 |
| Maximum User I/Os | โ | 976 |
| Operating Temperature | โ | 0ยฐC to 85ยฐC |
| Core Voltage | โ | 0.9 V |
| Process Node | โ | 65 nm |
| MSL Level | โ | [DATA_NEEDED: MSL level] |
| Lead Free | โ | [DATA_NEEDED: lead-free status] |