EP3SE260F1517C3N vs EP3SE260F1517I3G Comparison
Detailed side-by-side comparison of EP3SE260F1517C3N by Intel and EP3SE260F1517I3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE260F1517C3N | EP3SE260F1517I3G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9,850.00 | $3,520.00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 254,400 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) | β |
| User I/Os | 976 | β |
| DSP Blocks (18x18 Multipliers) | 816 | β |
| M9K Memory Blocks | 1,040 | β |
| Maximum Transceiver Data Rate | 600 Mbps | β |
| PLLs | 4 | β |
| Global Clock Networks | 16 | β |
| Package | 1517-BBGA (FCBGA) | 1517-ball FC-FBGA (Flip-Chip BGA) |
| Process Technology | 65 nm TSMC low-power CMOS | β |
| Speed Grade | C3 (commercial) | β |
| Operating Junction Temperature | 0 C to +85 C (commercial) | β |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | β |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | β |
| Embedded Memory Bits | β | 16,672,768 |
| Maximum Operating Frequency | β | 500 MHz |
| Core Voltage | β | 1.1 V |
| User I/O Count | β | 976 |
| Process Node | β | 65 nm |
| Embedded Multipliers | β | 768 (18x18) |
| PLL Count | β | 12 |
| Transceiver Data Rate | β | Up to 6.375 Gbps |
| Operating Temperature Grade | β | Industrial (-40C to +100C) |
| Lead-Free / RoHS | β | Yes (RoHS compliant per DigiKey listing) |
| MSL Level | β | [DATA_NEEDED: MSL level] |