EP3SE260F1517I3N vs EP3SE260F1517I3 Comparison

Detailed side-by-side comparison of EP3SE260F1517I3N by Intel and EP3SE260F1517I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1517I3N EP3SE260F1517I3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Active
Stock Status In Stock In Stock
Unit Price (USD) $2,275.00 $10,500.00
Family Stratixยฎ III E Stratix III E
Logic Elements 255,000 255,000
Embedded Memory Bits 16,672,768 bits โ€”
Logic Array Blocks (LABs) 10,200 10,200
User I/O Count 976 โ€”
Core Voltage 1.1 V 1.0 V typical
Process Technology 65 nm 65 nm CMOS
Package 1517-ball FC-FBGA 1517-BBGA, FCBGA
Mounting Type Surface Mount Surface Mount
Speed Grade -3 (fastest) โ€”
Temperature Grade Industrial (I): -40 ยฐC to +100 ยฐC โ€”
Operating Junction Temperature -40 ยฐC to +100 ยฐC โ€”
Configuration Method JTAG / Passive Serial / Active Serial โ€”
RoHS Status Compliant Compliant
Lead-Free Yes โ€”
Internal Logic Performance Up to 500 MHz โ€”
Memory Subsystems M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers โ€”
DSP Blocks Yes (dedicated multiply-accumulate) โ€”
Embedded Memory (bits) โ€” 16,672,768
Maximum User I/Os โ€” 976
Operating Temperature Grade โ€” Industrial
Junction Temperature Range โ€” -40C to +125C
Maximum Core Frequency โ€” 717 MHz
I/O Standards Supported โ€” LVDS, LVTTL, LVCMOS, HSTL, SSTL
Configuration โ€” SRAM-based, volatile (requires external configuration device)

Datasheets & Resources

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