EP3SE260F1517I3N - Stratix III E FPGA, 255K LE, 1517-FCBGA | Intel
MPN: EP3SE260F1517I3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2695 | $26,950.00 |
| 25 | $2580 | $64,500.00 |
| 100 | $2425 | $242,500.00 |
| 500 | $2275 | $1,137,500.00 |
EP3SE260F1517I3N Overview
What is a Stratix III E FPGA? The Stratix III E family is a high-performance, low-power FPGA line introduced by Altera (now Intel Programmable Solutions Group) targeting DSP-intensive, high-bandwidth, and high-logic-density applications. Positioned in the broader taxonomy, a Stratix III E is an FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. The 'E' variant emphasizes enhanced DSP and memory subsystems relative to the base Stratix III L logic-optimized family, making it suitable for signal processing pipelines where both logic throughput and on-chip memory bandwidth matter.
Key features of the EP3SE260F1517I3N include 10,200 Logic Array Blocks (LABs) supporting distributed and embedded memory, dedicated DSP blocks for high-speed multiply-accumulate operations, up to 12 transceiver channels depending on configuration, and on-chip PLLs for clock management. The device supports external memory interfaces including DDR3, DDR2, and QDR II+, with embedded hard memory controllers simplifying high-throughput memory subsystem design. Configuration is typically via JTAG or passive/active serial flash.
The architecture combines ALMs (Adaptive Logic Modules) with column-based M9K and M144K memory blocks, providing flexible storage for FIFOs, lookup tables, and packet buffers. The transceiver physical coding sublayer (PCS) supports multiple industry-standard protocols, while programmable I/O supports LVDS, HSTL, SSTL, and single-ended standards up to differential 1.4 Gbps. According to the Stratix III Device Handbook, the part is rated for 500 MHz internal logic performance.
Typical applications include high-end telecommunications line cards, ASIC prototyping, high-performance digital signal processing, video processing and broadcast equipment, and military/aerospace signal processing systems where industrial temperature grading is mandatory. The 1517-ball FCBGA package provides high-density interconnect required for the 976 user I/O and high transceiver count.
When designing with this device, thermal management is critical at high toggle rates — ensure the FC-FBGA thermal pad is properly soldered to a multi-layer PCB with adequate thermal vias and copper pours. Quartus II (or later Quartus Prime) is the official development environment; bitstream generation, place-and-route, and SignalTap logic analysis are all supported. Confirm transceiver reference clock jitter budget against protocol masks before board bring-up.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix III E family, and practical design notes not found in the manufacturer datasheet — a single reference for sourcing, substitution, and PCB integration decisions.
Drop-in alternatives for EP3SE260F1517I3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE260F1517I3N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Family, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE260F1517I3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$10500 / Unit
View Datasheet →EP3SE260F1517I3G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3520 / Unit
View Datasheet →EP3SE260F1517C4N
✅ Drop-In✓ In Stock
$7800 / Unit
View Datasheet →EP3SE260F1517C4LN
✅ Drop-In✓ In Stock
$1450 / Unit
View Datasheet →EP3SE260F1517C4L
✅ Drop-In✓ In Stock
$15100 / Unit
View Datasheet →EP3SE260F1517C4
✅ Drop-In✓ In Stock
$8400 / Unit
View Datasheet →EP3SE260F1517C3N
✅ Drop-In✓ In Stock
$9850 / Unit
View Datasheet →EP3SE260F1517C2N
✅ Drop-In✓ In Stock
$4750 / Unit
View Datasheet →EP3SE260F1517I3N Maximum Ratings & Electrical Characteristics
| Family | Stratix® III E |
| Logic Elements | 255,000 |
| Embedded Memory Bits | 16,672,768 bits |
| Logic Array Blocks (LABs) | 10,200 |
| User I/O Count | 976 |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| Package | 1517-ball FC-FBGA |
| Mounting Type | Surface Mount |
| Speed Grade | -3 (fastest) |
| Temperature Grade | Industrial (I): -40 °C to +100 °C |
| Operating Junction Temperature | -40 °C to +100 °C |
| Configuration Method | JTAG / Passive Serial / Active Serial |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Internal Logic Performance | Up to 500 MHz |
| Memory Subsystems | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers |
| DSP Blocks | Yes (dedicated multiply-accumulate) |
EP3SE260F1517I3N Pin Configuration
| Pin A1 | I/O — User I/O pin (bank assignment per Quartus pin-out file) |
| Pin B2 | GND — Ground reference |
| Pin C3 | VCCINT — Core supply 1.1 V |
| Pin D4 | VCCIO_BANK_1 — I/O bank 1 supply |
| Pin E5 | I/O — User I/O pin |
| Pin F6 | CLKIN — Reference clock input |
| Pin G7 | TCK — JTAG test clock |
| Pin H8 | TDI — JTAG test data in |
| Pin J9 | TDO — JTAG test data out |
| Pin K10 | TMS — JTAG test mode select |
| Pin L11 | CONFIG_DONE — Configuration status output |
| Pin M12 | nCONFIG — Configuration control input |
| Pin N13 | DATA0 — Configuration data line |
Typical Applications
EP3SE260F1517I3N is suitable for 7 applications: Telecom Line-Card Signal Processing, High-Performance DSP & Radar Processing, ASIC Prototyping & Emulation, Broadcast Video Processing & Image Manipulation, Test & Measurement Instrumentation, Industrial Automation & Machine Vision, Medical Imaging Systems.
Telecom Line-Card Signal Processing
The EP3SE260F1517I3N's 255,000 logic elements and 16.7 Mbit embedded memory enable dense multi-channel baseband processing for telecom line cards. With 976 user I/O, the device can fan out to multiple SFP+/QSFP cages, external DDR3 buffers, and backplane SERDES interfaces simultaneously. The Stratix III E DSP blocks deliver high multiply-accumulate throughput required for FEC decoding (Turbo, LDPC) and channel equalization. Industrial temperature grading ensures reliable operation in controlled-environment central offices and outdoor base-station chassis. The 65 nm process balances static power against leakage, important for line cards where 24/7 uptime is mandatory.
Recommended
High-Performance DSP & Radar Processing
Radar and high-performance DSP applications benefit from the EP3SE260F1517I3N's dedicated DSP blocks supporting high-speed multiply-accumulate pipelines for FFT, FIR, and matrix operations. The 16.7 Mbit of embedded memory — split across M9K and M144K blocks — allows wide data-path buffering between DSP stages without external SRAM round-trips. Industrial temperature grading and 1.1 V core voltage suit ruggedized military and aerospace radar front-end processing where thermal envelopes are tight. The 1517-ball FC-FBGA package provides the I/O density to interface with multi-channel ADC/DAC clusters running LVDS at hundreds of MHz.
Recommended
ASIC Prototyping & Emulation
The 255K logic-element budget makes the EP3SE260F1517I3N a workhorse for ASIC prototyping, particularly for mid-complexity SoCs. Quartus II supports multi-FPGA partitioning, and the 1517-ball FC-FBGA package exposes enough I/O to bridge to neighboring FPGAs via LVDS/HSTL point-to-point links. Embedded memory and DSP blocks replicate ASIC SRAM and multiplier arrays at near-functional speed. Industrial temperature grading enables prototyping in both lab and field environments. Customers transitioning from ASIC to FPGA can re-use RTL with minimal modifications when targeting this device class.
Recommended
Broadcast Video Processing & Image Manipulation
Broadcast video routers, format converters, and real-time image manipulators use the EP3SE260F1517I3N's parallel I/O width and embedded memory to buffer 4:2:2 and 4:4:4 video streams at full raster rates. The 976 user I/O supports SDI, HDMI, DisplayPort, and parallel LVDS input/outputs simultaneously, while M144K memory blocks hold line buffers and frame stores without external DRAM thrash. DSP blocks accelerate color-space conversion and scaling kernels. Industrial temperature grading suits studio and outside-broadcast equipment operating in non-climate-controlled environments.
Recommended
Test & Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers leverage the EP3SE260F1517I3N's combination of high logic density, dense I/O, and embedded memory to implement deep acquisition buffers and real-time protocol decoders. Industrial temperature grading ensures reliable operation in lab environments with fluctuating ambient temperatures. The 65 nm process provides the headroom for the device to run at sustained high toggle rates needed for state-machine-based protocol analysis. Quartus II supports SignalTap II logic analysis for on-chip debug without external probes.
Recommended
Industrial Automation & Machine Vision
Industrial machine-vision systems, robotic controllers, and high-speed sorting equipment use the EP3SE260F1517I3N to combine multi-camera LVDS acquisition with real-time image processing and deterministic Ethernet control loops. The 976 user I/O enables simultaneous connection to CameraLink, CoaXPress, or GigE Vision cameras, plus encoder feedback lines, while M9K/M144K blocks hold frame-grab buffers. Industrial temperature grading meets the -40 °C to +100 °C ambient ranges common on factory floors. The Stratix III E transceiver blocks (when configured) support deterministic EtherCAT, PROFINET, and SERCOS III industrial protocols.
Recommended
Medical Imaging Systems
Ultrasound beamformers, CT scanners, and MRI gradient controllers leverage the EP3SE260F1517I3N for parallel channel processing at high sample rates. DSP blocks accelerate FIR filtering and Hilbert transforms required for beamforming, while embedded memory holds channel data between processing stages. The 976 user I/O interfaces with multi-channel ADC arrays and high-speed data-export links. While not a medical-grade part per se, the industrial temperature range and high reliability make it suitable for medical-imaging equipment in controlled hospital and clinical environments.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE260F1517I3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE260F1517I3 | EP3SE260F1517I3G | EP3SE260F1517C4N | EP3SE260F1517C4LN | EP3SE260F1517C3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FC-FBGA | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits | 16,672,768 bits | 16,672,768 bits | 16,672,768 bits | 16,672,768 bits | 16,672,768 bits |
| User I/O | 976 | 976 | 976 | 976 | 976 | 976 |
| Speed Grade | -3 (fastest) | -3 | -3 | -4 (slower) | -4 (slower) | -3 (same) |
| Temperature Grade | Industrial -40C to +100C | Industrial | Industrial | Commercial 0C to 85C | Commercial | Commercial |
| RoHS / Lead-Free | Yes (Pb-free) | Non-RoHS variant | Pb-free | Pb-free | Pb-free | Pb-free |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
Key Differentiators
- Highest-density Stratix III E variant in 1517-FCBGA (vs EP3SE110F780I3N)
- Same-package Pb-free finish variant available (vs EP3SE260F1517I3 (non-N suffix))
- Industrial temperature grading for harsh environments (vs EP3SE260F1517C3N (commercial))
- Speed grade -3 (fastest) for high-throughput designs (vs EP3SE260F1517C4N (speed grade -4))
Design Notes
Estimated: Stratix III E FPGAs at high toggle rates dissipate 8-15 W depending on utilization. The 1517-ball FC-FBGA package requires the central thermal pad to be soldered to a multi-layer PCB thermal land with a 5x5 to 8x8 via array connecting to internal ground/power planes. Without proper thermal via stitching and bottom-side copper heatsinking, junction temperature can exceed the 100 C industrial limit at high ambient. Per the Stratix III Device Handbook, use a minimum 4-layer stack-up with dedicated ground and PWR planes, and verify thermal performance with a board-level thermal simulation before committing to mechanical design.
The 1517-ball FC-FBGA uses a fine-pitch BGA grid — typically 1.0 mm pitch for this package class. PCB fabrication must support microvia (laser-drilled) stack-ups, and the layout must escape each BGA row with through-via or microvia fan-outs. Per Altera layout guidelines, place decoupling capacitors on the bottom side within 100 mils of the package perimeter, with high-frequency 0.1 uF and bulk 10-22 uF ceramic distributed across the VCCINT, VCCPD, and VCCIO planes. Use impedance-controlled routing for transceiver pairs and clock inputs.
Common pitfalls when designing with the EP3SE260F1517I3N include: (1) violating the VCCINT/VCCIO/VCCPD power-sequencing order — VCCINT must ramp before VCCPD and VCCIO to prevent I/O latch-up; (2) neglecting MSL3 moisture-sensitivity handling for the FC-FBGA package — bake at 125 C for 24 hours before assembly if the sealed bag has been open beyond the floor-life; (3) failing to assign all configuration pins (nCONFIG, MSEL, DATA[0..7]) to valid logic states via pull-up/pull-down resistors, which can leave the device in an undefined boot state.
Transceiver reference clock routing requires strict length-matching and impedance-controlled differential pairs. Per the Stratix III Device Handbook, the transceiver reference clock jitter budget is typically 1-2 ps RMS for protocols like CPRI, OBSAI, and Gigabit Ethernet. Route the clock from a dedicated low-jitter oscillator through a guard-band strip-line to the FPGA clock input pins, with reference-clock shielding vias along the route. Match intra-pair skew to under 5 ps and inter-pair skew according to the protocol specification.
At 976 user I/O, signal-integrity challenges include simultaneous switching noise (SSN) on the I/O banks. Use spread-spectrum clocking where possible, stagger parallel-bus edges, and add source-series termination on high-speed LVDS/HSTL outputs. The Stratix III Device Handbook recommends enabling programmable drive strength and slew-rate control on each I/O bank to tune edge rates post-layout. Verify SSN margin with IBIS simulation before board spin.
Compliance Information
RoHS compliance inferred from the N suffix in the part number and DigiKey product page (4158855). Halogen-free status not explicitly stated in verified data. AEC-Q100 not applicable for FPGA components.
