EP3SE260F1517I4L vs EP3SE260F1517C3N Comparison
Detailed side-by-side comparison of EP3SE260F1517I4L by Intel and EP3SE260F1517C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE260F1517I4L | EP3SE260F1517C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2,800.00 | $9,850.00 |
| Family | Stratix III Enhanced (E) | Stratix III E |
| Series | Stratix III | β |
| Logic Elements | 255,000 | 254,400 |
| Embedded Memory | 16,672,768 bits (16.6 Mbits) | 16,672,768 bits (16.7 Mbits) |
| Maximum User I/O | 976 | β |
| Package Type | 1517-BBGA, FCBGA | β |
| Package Dimensions | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) | β |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) | β |
| Temperature Grade | Industrial | β |
| Speed Grade | I4 | C3 (commercial) |
| Lead-Free / RoHS | Yes (L suffix) | β |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | β |
| Process Technology | 65 nm CMOS | 65 nm TSMC low-power CMOS |
| DSP Blocks (18x18 Multipliers) | 768 | 816 |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel | β |
| MSL Level | 3 (per JEDEC J-STD-020) | β |
| RoHS Status | Compliant | Compliant |
| User I/Os | β | 976 |
| M9K Memory Blocks | β | 1,040 |
| Maximum Transceiver Data Rate | β | 600 Mbps |
| PLLs | β | 4 |
| Global Clock Networks | β | 16 |
| Package | β | 1517-BBGA (FCBGA) |
| Operating Junction Temperature | β | 0 C to +85 C (commercial) |
| External Memory Interfaces | β | DDR3, DDR2, QDRII+, RLDRAM2 |