EP3SE260F1517I4N vs EP3SE260F1517C4N Comparison
Detailed side-by-side comparison of EP3SE260F1517I4N by Intel and EP3SE260F1517C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N โ Last Time Buy
Specification Comparison
| Parameter | EP3SE260F1517I4N | EP3SE260F1517C4N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $10,500.00 | $7,800.00 |
| Series | Stratix III E | Stratixยฎ III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | โ |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | โ |
| User I/O Pins | 976 | โ |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | โ |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | โ |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | โ |
| PLLs | [DATA_NEEDED: total PLL count] | โ |
| Core Voltage | 1.1 V | 0.9 V |
| Process Technology | TSMC 65 nm | โ |
| Package | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA |
| Package Body Size | [DATA_NEEDED: mm x mm] | โ |
| Operating Temperature | -40 ยฐC to +100 ยฐC (Industrial) | 0ยฐC to 85ยฐC |
| Operating Temperature Grade | Industrial (I4) | โ |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | โ |
| MSL Level | [DATA_NEEDED: MSL classification] | [DATA_NEEDED: MSL level] |
| Family | โ | Field-Programmable Gate Array (FPGA) |
| Embedded Memory | โ | 16,672,768 bits |
| Logic Array Blocks (LABs) | โ | 10,200 |
| Maximum User I/Os | โ | 976 |
| Process Node | โ | 65 nm |
| Lead Free | โ | [DATA_NEEDED: lead-free status] |
| RoHS Status | โ | [DATA_NEEDED: RoHS status] |
| Maximum Transceiver Data Rate | โ | 12.5 Gbps |