EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
MPN: EP3SE260F1517I4N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12337.67 | $12,337.67 |
| 10 | $12000 | $120,000.00 |
| 100 | $11500 | $1,150,000.00 |
| 500 | $10950 | $5,475,000.00 |
| 1,000 | $10500 | $10,500,000.00 |
EP3SE260F1517I4N Overview
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated DSP blocks, on-chip memory, and high-speed transceiver resources on a single die. Stratix III E devices extend the Stratix III architecture with enhanced DSP performance and up to 24 transceivers operating at 600 Mbps to 6.375 Gbps, making them suitable for chip-to-chip and backplane serial links. The 1517-BGA FCBGA package provides the largest I/O count in the Stratix III family at 976 user I/O, enabling dense parallel interfaces such as DDR3 and RLDRAM II memory controllers.
Key features include 12 full-duplex transceiver channels with integrated PCS and PMA, dedicated hard memory controllers with support for DDR3 up to 800 MHz, up to 384 18x18 multipliers distributed across multiple DSP blocks, and support for partial reconfiguration. The device also offers 1.1 V core operation with selectable 0.9 V low-power modes, and supports hot-socketing for live insertion into backplane systems.
The Stratix III E architecture uses a 65 nm TSMC process with 8-input adaptive logic modules (ALMs), providing higher logic density per area than the prior Stratix II generation. The 1517-BGA FCBGA package, measuring approximately 40 x 40 mm, uses flip-chip interconnection for low-inductance signal and power delivery. Embedded transceiver calibration, dynamic reconfiguration, and built-in PCIE Gen1 hard IP simplify multi-gigabit serial design.
Typical applications include high-end ASIC prototyping and emulation, software-defined radio baseband processing, high-performance computing accelerators, broadcast video processing, and high-speed serial backplane bridging. The combination of high logic density and embedded transceivers also makes this part a popular choice for radar signal processing and medical imaging front-ends.
Designers must pay close attention to power integrity: the 1.1 V core draws substantial current at full utilization, requiring multi-layer PCB stack-ups with low-impedance decoupling and the Altera SmartVID or external DC-DC solution for voltage regulation. Thermal management for the 1517-BGA package is critical; heatsinks with thermal interface material are typically required when junction-to-ambient exceeds 0.5 °C/W.
This page synthesizes distributor inventory, drop-in same-package variants from the Site MPN list, and application-specific guidance not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3SE260F1517I4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE260F1517I4N (same form factor and footprint) — differing in Package, Family, Process Technology, Operating Temperature, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE260F1517I4LN
✅ Drop-In✓ In Stock
$2895 / Unit
View Datasheet →EP3SE260F1517I4L
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$2800 / Unit
View Datasheet →EP3SE260F1517I4
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$10750 / Unit
View Datasheet →EP3SE260F1517I3N
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$2275 / Unit
View Datasheet →EP3SE260F1517C4N
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$7800 / Unit
View Datasheet →EP3SE260F1517C3N
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$9850 / Unit
View Datasheet →EP3SE260F1517I4N Maximum Ratings & Electrical Characteristics
| Series | Stratix III E |
| Logic Elements | 255,000 |
| Embedded Memory Bits | 16,672,768 bits |
| User I/O Pins | 976 |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps |
| Core Voltage | 1.1 V |
| Process Technology | TSMC 65 nm |
| Package | 1517-BBGA, FCBGA |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Operating Temperature Grade | Industrial (I4) |
| Mounting Type | Surface Mount (BGA) |
EP3SE260F1517I4N 1517-bbga, fcbga Pin Configuration Guide
Pin configuration for EP3SE260F1517I4N (1517-bbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE260F1517I4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE260F1517I4N is suitable for 7 applications: ASIC Prototyping and Emulation, Software-Defined Radio Baseband, High-Performance Computing Accelerators, Broadcast Video Processing, High-Speed Serial Backplane Bridging, Medical Imaging Front-Ends, Radar Signal Processing.
ASIC Prototyping and Emulation
The EP3SE260F1517I4N's 255,000 logic elements and 16.6 Mbits of embedded memory provide the capacity required to map large ASIC RTL onto a single device for functional verification, gate-level netlist emulation, and pre-silicon software bring-up. The 1517-BGA package exposes 976 user I/O so that multi-million-gate ASIC designs with wide external buses can be mapped without multiplexing. Quartus II can partition a large design into the 255K-LE fabric using incremental compilation, and the dedicated hard memory controllers support behavioural ASIC memories. Industrial temperature grade allows benchtop and chassis-level validation across extended thermal ranges. The device's hot-socketing capability is also useful in bring-up racks where boards may be inserted under power.
Recommended
Software-Defined Radio Baseband
With multi-gigabit transceivers up to 6.375 Gbps and dedicated DSP blocks, the EP3SE260F1517I4N is well-suited to software-defined radio baseband processing. Engineers commonly implement wideband digital down-conversion, channelization (polyphase filter banks), and forward-error-correction codecs in Stratix III E. The 1.1 V core enables high clock rates at modest power, while the industrial temperature grade supports outdoor small-cell and military radio deployments. Pair the FPGA with external ADC/DAC converters (e.g., TI ADS54J60 family) connected via LVDS or JESD204B serializer/deserializer lanes, with the FPGA's transceivers absorbing the SERDES burden. Design tools include Quartus II DSP Builder for MATLAB-style model integration.
Recommended
High-Performance Computing Accelerators
The EP3SE260F1517I4N is used as a compute accelerator in HPC and signal-intelligence workloads because the 255K LE and embedded multiplier resources can deliver hundreds of GMACs at low latency. PCI Express hard IP blocks enable a host CPU to dispatch compute kernels into the FPGA over Gen1 PCIe, with the FPGA returning results through the same link. The 16.6 Mbit embedded memory provides line-rate buffering for streaming FFT, Viterbi, or pattern-matching kernels. In dense compute, multiple Stratix III boards can be linked via the multi-gigabit transceivers to scale throughput. Industrial temperature grade also lets these accelerators serve in defence and ruggedised edge compute platforms.
Recommended
Broadcast Video Processing
Broadcast studios and video-conference equipment rely on the EP3SE260F1517I4N for SDI video routing, format conversion, and overlay generation. The device's 976 user I/O and 6.375 Gbps transceivers enable simultaneous handling of uncompressed 3G-SDI or quad-link 12G-SDI streams. Embedded memory and DSP blocks implement real-time deinterlacing, scaling, and colour-space conversion at full broadcast frame rates. Designers use the industrial temperature grade for outside-broadcast vans and remote-production enclosures where ambient temperatures can swing widely. The BGA package supports the large power-delivery network required to drive the parallel SDI output buses.
Recommended
High-Speed Serial Backplane Bridging
Backplane bridging applications - including ATCA, VPX, and proprietary telecom backplanes - depend on the EP3SE260F1517I4N's transceivers and 976 user I/O. Stratix III E supports CEI-6G, XAUI, HiGig, and custom serial protocols at 6.375 Gbps, allowing line-card designers to bridge between board fabrics without external mux/clock-data-recovery parts. The 1517-BGA package and embedded memory simplify multi-lane aggregation. Industrial temperature grade suits telecom central offices and outdoor enclosures. Designers typically use hot-socketing features for live card insertion and removal in production chassis.
Recommended
Medical Imaging Front-Ends
Medical imaging modalities such as ultrasound, CT, and MRI require high-throughput pixel processing that the EP3SE260F1517I4N can deliver via its 255K LE, embedded multipliers, and multi-gigabit transceivers. The FPGA accepts raw LVDS from the detector array, performs beamforming or image reconstruction in real time, and outputs diagnostic-grade DICOM streams. Industrial temperature grade supports deployment in cart-based and portable systems where ambient temperature varies. The 1517-BGA package and large pin count allow simultaneous connection to multiple ADCs and high-speed serial links to the host PC. Compliance to IEC 60601 requires designers to implement appropriate isolation around the FPGA, but the FGPA itself is the compute heart of the system.
Recommended
Radar Signal Processing
Phased-array and synthetic-aperture radar systems use the EP3SE260F1517I4N for pulse compression, Doppler processing, and adaptive beamforming in the FPGA fabric. The DSP blocks enable sustained 18x18 multiplications at hundreds of MHz, and the multi-gigabit transceivers provide low-latency links between sub-arrays. With 976 user I/O, a single FPGA can aggregate ADC data from many channels before backhaul. Industrial temperature grade supports naval and ground-mobile platforms. Designers should plan for the FPGA's 1.1 V core current draw (multi-ampere at full utilisation) and provide a robust multi-layer PCB power-delivery network.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE260F1517I4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE260F1517I4LN | EP3SE260F1517I4L | EP3SE260F1517I4 | EP3SE260F1517I3N | EP3SE260F1517C4N | EP3SE260F1517C3N |
|---|---|---|---|---|---|---|---|
| Package | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 255,000 | 255,000 - same | 255,000 - same | 255,000 - same | 255,000 - same | 255,000 - same | 255,000 - same |
| User I/O Pins | 976 | 976 - same | 976 - same | 976 - same | 976 - same | 976 - same | 976 - same |
| Embedded Memory | 16,672,768 bits | 16,672,768 bits - same | 16,672,768 bits - same | 16,672,768 bits - same | 16,672,768 bits - same | 16,672,768 bits - same | 16,672,768 bits - same |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C - same | -40C to +100C - same | -40C to +100C - same | -40C to +100C - same | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | I4 | I4 - same | I4 - same | I4 - same | I3 (slower than I4) | C4 (commercial, equivalent speed to I4) | C3 (commercial, slower than C4) |
| Process Technology | 65 nm TSMC | 65 nm TSMC - same | 65 nm TSMC - same | 65 nm TSMC - same | 65 nm TSMC - same | 65 nm TSMC - same | 65 nm TSMC - same |
Key Differentiators
- Same 1517-BGA footprint across multiple Stratix III E temperature and speed variants (vs EP3SE260F1517I4 vs EP3SE260F1517I3N)
- Industrial temperature grade in the same package as commercial parts (vs EP3SE260F1517I4N vs EP3SE260F1517C4N)
- Lead-free RoHS-compliant variant available in identical footprint (vs EP3SE260F1517I4N vs EP3SE260F1517I4LN)
- High user I/O count of 976 in a single Stratix III E device (vs EP3SE260F1517I4N vs EP3SE110F1152I4N)
Design Notes
The EP3SE260F1517I4N draws substantial current at the 1.1 V core - estimate 10-30 A depending on logic utilization, clock rate, and toggle rate. Designers must use a multi-layer PCB with dedicated 1.1 V core and 2.5 V/3.0 V/3.3 V auxiliary planes, plus low-impedance decoupling (1 x 0.1 uF per VCC pin, 1 x 10 uF bulk per quadrant). Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet before layout to validate the regulator current budget. SmartVID or external DC-DC controllers (e.g., LTM4677) are recommended for high-current designs.
The 1517-BGA FCBGA has a theta-JA in the 0.3 to 0.5 C/W range with optimised board thermal vias and heatsink. Estimate: at 25 W dissipation, junction-to-ambient rise is approximately 7.5-12.5 C. Use a thermally enhanced PCB stack-up with thermal vias under the BGA, attach a heatsink with thermal interface material (TIM), and ensure adequate airflow in the chassis. Industrial -40C to +100C case temperature rating requires the heatsink design to keep case temperature below 100 C at maximum expected ambient.
Route the 1517-BGA signals on a multi-layer board with microvia/HDI stack-up (e.g., 8 or 10 layers). All BGA breakouts must be matched-length within the tolarance specified by Quartus II Fitter for the relevant I/O standard. Use controlled impedance (typically 50 ohm single-ended, 100 ohm differential) for LVDS pairs and transceiver lanes. Decoupling capacitors must be placed within 100 mils of the relevant power pins. Differential transceiver pairs should be length-matched to within 5 mils.
Do not assume the I4N and I4L variants have identical thermal characteristics - the 'L' suffix affects lead-finish thermal mass. Also, never substitute a commercial-grade (C-suffix) part in an industrial design without re-validating timing at the industrial temperature corners. Quartus II's TimeQuest SDC timing analysis must be re-run at -40C and +100C slow/fast corners for industrial operation. Finally, do not exceed the hot-socketing current limits during live insertion into backplanes.
Transceiver channels up to 6.375 Gbps require careful signal-integrity analysis including 2D/3D EM field simulation of via transitions and AC-coupling capacitor placement. Use reference clock jitter below 1 ps RMS for 6 Gbps operation. Matched impedance traces through the BGA breakout region must avoid jogs or splits in the reference plane. Use IBIS-AMI models from Intel for channel simulation in HSpice, ADS, or SiSoft QCD.
Compliance Information
RoHS, REACH, and lead-free status not explicitly stated in the provided data. The 'N' suffix in EP3SE260F1517I4N denotes lead-free terminal finish per Altera/Intel ordering convention, but explicit RoHS/REACH compliance should be verified with Intel's product certification documentation. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade IC).
