EP3SE260F1517I4N vs EP3SL200F1517I4LN Comparison
Detailed side-by-side comparison of EP3SE260F1517I4N by Intel and EP3SL200F1517I4LN by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N β Last Time Buy
Specification Comparison
| Parameter | EP3SE260F1517I4N | EP3SL200F1517I4LN |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $10,500.00 | $6,300.00 |
| Series | Stratix III E | β |
| Logic Elements | 255,000 | 200,000 |
| Embedded Memory Bits | 16,672,768 bits | 10,901,504 |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | β |
| User I/O Pins | 976 | 976 |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | β |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | β |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | β |
| PLLs | [DATA_NEEDED: total PLL count] | β |
| Core Voltage | 1.1 V | β |
| Process Technology | TSMC 65 nm | 65 nm TSMC low-power |
| Package | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA |
| Package Body Size | [DATA_NEEDED: mm x mm] | β |
| Operating Temperature | -40 Β°C to +100 Β°C (Industrial) | -40C to +100C (Industrial) |
| Operating Temperature Grade | Industrial (I4) | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | β |
| MSL Level | [DATA_NEEDED: MSL classification] | [DATA_NEEDED: MSL moisture sensitivity level] |
| Family | β | Stratix III L |
| Logic Array Blocks (LABs) | β | 8,000 |
| RoHS Status | β | Compliant |
| Lead-Free | β | Yes |
| Supply Voltage Core | β | [DATA_NEEDED: VCC core voltage] |
| Transceiver Data Rate (max) | β | [DATA_NEEDED: max transceiver rate] |
| DSP Blocks (18x18 multipliers) | β | 384 |
| DSP Performance | β | 288 GMACS |
| Configuration Method | β | Passive Parallel / Active Serial / JTAG |
| Ball Pitch | β | 1.0 mm |
| Package Dimensions | β | 40 mm x 40 mm |