EP3SE260H780C3 vs EP3SE260H780C2N Comparison
Detailed side-by-side comparison of EP3SE260H780C3 by Intel and EP3SE260H780C2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N β Last Time BuySpecification Comparison
| Parameter | EP3SE260H780C3 | EP3SE260H780C2N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,180.00 | $3,600.00 |
| Device Family | Stratix III Enhanced (Stratix III E) | β |
| Series | EP3SE | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10200 | β |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | β |
| User I/Os | 488 | β |
| Operating Voltage (Core) | 0.9 V | β |
| Operating Voltage (Auxiliary) | 1.1 V | β |
| Process Technology | 65 nm CMOS | β |
| Speed Grade | C3 | C2 |
| Operating Temperature | Commercial, 0C to +85C | β |
| Maximum Core Frequency | 500 MHz | β |
| Package | 780-ball FCBGA (HBGA), flip-chip | 780-BGA FCBGA |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 hours) | β |
| Packaging Type | Tray | β |
| Configuration Memory Support | Fast passive parallel, JTAG, Active Serial | β |
| RoHS Status | Compliant (per product listings) | [DATA_NEEDED: rohs status] |
| LABs / CLBs | β | 10,200 |
| Total RAM Bits | β | 16,672,768 |
| User I/O Count | β | 488 |
| Number of Transceivers | β | [DATA_NEEDED: transceiver count] |
| Core Voltage | β | 0.9 V |
| Operating Temperature Range | β | Commercial (0C to +85C) |
| MSL Level | β | 3 (168 hours) |
| Reflow Peak Time Max | β | 40 s |
| Lead-Free | β | [DATA_NEEDED: lead-free] |
| Package Code | β | BGA |
| Terminal Form | β | Ball |
| Number of Terminals | β | 780 |
| Process Node | β | 40 nm |